SMT中英文专业术语教程

1、http:/ 深圳市共进电子有限公司SMT中英文专业术语教程中英文专业术语教程更新日期：2011.09http:/ 深圳市共进电子有限公司1.印刷工艺专业英语2.贴片工艺专业英语3.回流工艺专业英语针对新入职或有一定基础的职员2小时罗卫龙使大家对SMT专业英语有所了解，能够看懂一些专业素材培训目的培训目的培训对象培训对象培训讲师培训讲师学习重点学习重点培训课时培训课时http:/ 深圳市共进电子有限公司Printing Process English/印刷工艺英语http:/ 深圳市共进电子有限公司测试测试OK后后转转DIP插件插件印刷（印刷（Printing）：）：目的：借助于钢网把锡膏印刷

2、在PCB之焊盘（PAD）上 贴片（贴片（Mount）：）：目的：将贴片元件准确的贴装到PCB焊盘上回流焊（回流焊（Reflow）：）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序SMT：Surface Mount Technology/表面贴装技术http:/ 深圳市共进电子有限公司Definition：Process of transferring solder paste onto the pads of a PCB, by f

3、orcing it through mating apertures on a stencil, using a squeegeeBoard loader/上板机：上板机： PCBs to be transported to the screen printer using conveyorsPrinter/印刷机：印刷机： deposits solder paste onto pads on the circuit boardhttp:/ 深圳市共进电子有限公司PCBPCB（Printed circuit boardPrinted circuit board）/印制线路板Solder pas

4、teSolder paste/锡膏： Mixture of solder powders and flux deposited onto pads of circuit board on a controlled volume. After reflow provides electrical, mechanical and thermal connection between component and boardhttp:/ 深圳市共进电子有限公司SqueegeeSqueegee/刮刀: Critical tool used to “push” paste through the desi

5、gnated openingsStencilStencil/钢网：Vehicle by which the volume and placement location of solder paste deposition is controlledFoil/钢片Frame/外框Flex Mask/绷网Aperture/开孔http:/ 深圳市共进电子有限公司Main Elements of the Screen Printer/Main Elements of the Screen Printer/印刷机要素印刷机要素Input Conveyor/输入导轨Solvent tank/容剂曹Mon

6、itor/监控器Output Conveyor/输出导轨Light tower/指示灯Emergency stop buttons/紧急制动开关http:/ 深圳市共进电子有限公司Vision system/视觉系统Clamps/夹子Board support/支撑块Or support Pins/支撑顶针stencil/钢网Squeegee/刮刀http:/ 深圳市共进电子有限公司Print Parameters/Print Parameters/印刷参数印刷参数Angle of Attack (45Angle of Attack (45 or 60 or 60 with stencil)/

7、 with stencil)/角度角度：The angle made by the front of squeegee blade in relation to the stencilSnap-Off (Contact or Non-Contact)/Snap-Off (Contact or Non-Contact)/印刷间隙印刷间隙：The distance from the top surface of the PCB to the bottom surface of the stencilSqueegee Pressure/Squeegee Pressure/刮刀压力刮刀压力：Contr

8、ols the shear stress，The total force with which the squeegee is pushing onto the boardSqueegee Speed/Squeegee Speed/刮刀速度刮刀速度：Controls the shear rate，The velocity at which the squeegee traverses across the stencilSeparation Speed/Separation Speed/分离速度分离速度：The velocity at which the PCB release from th

9、e stencilhttp:/ 深圳市共进电子有限公司Separation Distance/分离距离分离距离:The distance when the PCB release from the stencil which keep the separation speedStencil Alignment/Stencil Alignment/钢网对位钢网对位:Vision Based:Fully automatic with fiducials or Semi-automatic ManualCleaning Frequency/Cleaning Frequency/清洗频率清洗频率Cle

10、aning mode/Cleaning mode/清洗模式清洗模式:Dry/wet/vacuumhttp:/ 深圳市共进电子有限公司Print Defects/Print Defects/印刷缺陷印刷缺陷Misalignment/偏位Bridge or Short/短路Icicle/拉尖Scoopinghttp:/ 深圳市共进电子有限公司Incomplete print/少锡Excessive print/多锡Paste residue/锡膏脏污Slump/坍塌http:/ 深圳市共进电子有限公司Component placement process english/元件贴装工艺英语http:

11、/ 深圳市共进电子有限公司测试测试OK后后转转DIP插件插件印刷（印刷（Printing）：）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上 贴片（贴片（Mount）：）：目的：将贴片元件准确的贴装到PCB焊盘上回流焊（回流焊（Reflow）：）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序http:/ 深圳市共进电子有限公司Generic SMD Placement Machine/Generic SMD Placemen

12、t Machine/常用表面贴装设备常用表面贴装设备BoardBoardAlignmentAlignment板对位板对位Robot/Robot/机械臂机械臂ComponentComponentFeeding/Feeding/供料器供料器 ComponentAlignment/器件对位Frame/Frame/外框外框PlacementPlacementHead/Head/贴装头贴装头PCB Transport/PCBPCB Transport/PCB传输传输http:/ 深圳市共进电子有限公司User interface/用户界面Placement robotComponent feeding/

13、供料器料车feeder/飞达Toolbit or nozzle吸嘴http:/ 深圳市共进电子有限公司PCB transporthttp:/ 深圳市共进电子有限公司Board alignmenthttp:/ 深圳市共进电子有限公司Board alignmenthttp:/ 深圳市共进电子有限公司The other professional english used in placement process贴装工艺其他专业英语贴装工艺其他专业英语Loading list/站位表Offset/偏差Pick/吸取Place/贴装Placement Accuracy/贴装精度Linear Motor/

14、线性马达Ball Screw/丝杆Image/影像http:/ 深圳市共进电子有限公司Reflow process english/回流工艺英语http:/ 深圳市共进电子有限公司测试测试OK后后转转DIP插件插件印刷（印刷（Printing）：）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上 贴片（贴片（Mount）：）：目的：将贴片元件准确的贴装到PCB焊盘上回流焊（回流焊（Reflow）：）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品

15、不会流入下一道工序http:/ 深圳市共进电子有限公司Soldering/焊接焊接1.Process of joining metallic surfaces(金属表面连接) through the mass heating(加热) of solder or solder paste2.Creates a mechanical(机械的) and electrical(电的) connection between the components and PCB3.Solder alloy metal(焊料合金) is melted(熔化) to form the connection4.Liqui

16、d solder attaches to the base metals by forming intermetallic compounds(IMC:内部合金), through the process of wetting(润湿)http:/ 深圳市共进电子有限公司Surface Tension/表面张力表面张力: Surface tension is a molecular force(分子作用力) existing in the surface film of all liquidsWetting/润湿润湿: : The ability of the molten solder all

17、oy (熔融焊锡合金) to adhere to the surfaces being solderedCapillary Action/毛细作用毛细作用：Interaction between a liquid (solder or flux) and a small opening or surface in a solid ( Pad, component Lead )Wetting Angle/润湿角润湿角IMC（Intermetallic compounds）/内部合金层内部合金层：When the molten solder alloy makes contact with the

18、 PCB finish or component lead finish, a small amount of Sn in the solder combines with the finish metal or the base copper to form a metallurgical compoundhttp:/ 深圳市共进电子有限公司Typical Convection Reflow Oven/典型的热风回流炉典型的热风回流炉(a)PCBAConveyor/链条链条Heating Blowers/热风器热风器CoolingFan/冷却风扇冷却风扇Reflow oven/回流炉回流炉Lower/下温区Upper/上温区http:/ 深圳市共进电子有限公司Typical reflow profile/典型回流曲线典型回流曲线The reflow of solder is achieved in a furnace with predetermined thermal profiles. The different stages are: 炉子里的回流焊接用预