CCM产品工艺知识培知识

1、Prepare by: civvy chenPrepare by: civvy chen2o 产品的应用产品的应用o 产品的类型产品的类型o 产品的构造产品的构造o 产品的制作工艺产品的制作工艺o 问与答问与答o 附录附录:专业名词介绍专业名词介绍Prepare by: civvy chen3Part I 产品的应用产品的应用Prepare by: civvy chen4Part I 产品的应用产品的应用拆解拆解Prepare by: civvy chen5Part II 产品的类型产品的类型 软板定焦模式(FF) 1. B-To-B 2.Gold FingerPrepare by: civv

2、y chen6Part II 产品的类型产品的类型 软板变焦模式 1.手动变焦(MF) 2.自动变焦(AF)Prepare by: civvy chen7Part II 产品的类型产品的类型 插槽模式(Socket)Prepare by: civvy chen8Part II 产品的类型产品的类型 像素分类 CIF (352*288) 10万像素 (0.1M) VGA (640*480) 30万像素 (0.3M) SXGA (1280*1024) 130万像素 (1.3M) UXGA (1600*1200) 200万像素 (2.0M)Prepare by: civvy chen9Part II

3、I 产品的构造产品的构造 CSP (Chip Scale Package)ChipLensBarrelHolderIR FilterstiffenerFPCSolder BallGlassPrepare by: civvy chen10Part III 产品的构造产品的构造 COB (Chip On Board)ChipLensBarrelHolderIR FilterFingerGold WireFPCPCBPrepare by: civvy chen11Part III 产品的构造产品的构造镜头镜头(Lens)镜座镜座(Holder)芯片芯片(Chip)电路板电路板(PCB)连接器连接器(

4、Con.)Prepare by: civvy chen12Part III 产品的构造产品的构造CMOS CHIPLENS HOLDERLENS BARRELThese 3 items come as an assembly1st LENS ELEMENT2nd LENS ELEMENTIR GLASSSUBSTRATEFPCPrepare by: civvy chen13Part IV 产品的制作工艺产品的制作工艺 材料 1. 晶圆(Wafer) 主要是由硅和锗组成,是摄像头模组的核心部分,称之为影像传感器。Prepare by: civvy chen14Part IV 产品的制作工艺产品的

5、制作工艺 2. 线路板 Printed Circuit Board印刷电路板,是电子元器件的支撑体,是电子元器件电气连接的提供者,简称PCB.Prepare by: civvy chen15Part IV 产品的制作工艺产品的制作工艺 3. 镜座(Holder) Prepare by: civvy chen16Part IV 产品的制作工艺产品的制作工艺 4. 镜头(Lens)Prepare by: civvy chen17Part IV 产品的制作工艺产品的制作工艺 5. 软板(FPC) Flexible Circuit Board软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可

6、靠性绝佳的可挠性印刷电路。Prepare by: civvy chen18Part IV 产品的制作工艺产品的制作工艺 工艺流程 Wafer清洗Plasma清洗固晶固晶烘烤邦线金线检查DAM邦定DAM烘烤二流体清洗CCD检查Glass贴附CCD检查固化半成品测试Prepare by: civvy chen19ProcessSupply WaferTrayOKOKOKOKN/AOKN/AOKIR Glass Attach ProcessCM800Barrel Insert ProcessCM800dispenseCMOS ChipdispenseIR Glassdispense+Lens Bar

7、relDie Attach ProcessCM800Holder Attach ProcessCM800Prepare by: civvy chen20Part IV 产品的制作工艺产品的制作工艺Die Bonding:使芯片 与PCB粘合。注意点：1.芯片方向 2.胶量 3.顶针和吸嘴印 4.芯片角度 5.芯片位置 6.芯片倾斜 Prepare by: civvy chen21Part IV 产品的制作工艺产品的制作工艺Wire Bonding: 通过金线焊接使芯片与PCB线路导通。注意点：1.接线是否正确 2. 线弧 3.金球大小 4.金球厚度 5.金线拉力 6.金球推力 Prepare

8、by: civvy chen22Solder PasteScreen PrintPassive PlacementForDie AttachPassiveSolder PastePassiveSubstratePrepare by: civvy chen23Die AttachWire BondingWet CleanChipSensorAreaAu WireChipSensorAreaAu WirePrepare by: civvy chen24IR Glass MountIR Glass SAWWafer RingIR GlassIR GlassPrepare by: civvy chen

9、25Glue DispenseIR Glass AttachHolderHolderGlueGlueIR cut GlassIR GlassPrepare by: civvy chen26Glue DispenseHolder AttachGlueGlueBarrel InsertBarrelHolderPrepare by: civvy chen27SinglationcutcutPrepare by: civvy chen28Focus adjustBarrelBarrel FixationMotorLighting（ （Percolation Method)chartAchromatic

10、 LensND4（ （Adjustment of Light Quantity） ）LaserPrepare by: civvy chen29Part V 问与答问与答Prepare by: civvy chen30Part VI 专业名词介绍专业名词介绍Prepare by: civvy chen31Prepare by: civvy chen32Bonding ProcessPrepare by: civvy chen33Free air ball is captured in the chamferPrepare by: civvy chen34Free air ball is capt

11、ured in the chamferSEARCH HEIGHTPrepare by: civvy chen35Free air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 1Prepare by: civvy chen36Free air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 1Prepare by: civvy chen37Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1P

12、repare by: civvy chen38Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Prepare by: civvy chen39Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Prepare by: civvy chen40Formation of a first bondSEARCH SPEED1SEARCH TOL 1Prepare by: civvy chen41Formation of a first bond

13、SEARCH SPEED1SEARCH TOL 1IMPACT FORCEPrepare by: civvy chen42Formation of a first bondContact Prepare by: civvy chen43Formation of a first bondBase Prepare by: civvy chen44Capillary rises to loop height positionPrepare by: civvy chen45Capillary rises to loop height positionPrepare by: civvy chen46Ca

14、pillary rises to loop height positionPrepare by: civvy chen47Capillary rises to loop height positionPrepare by: civvy chen48Capillary rises to loop height positionPrepare by: civvy chen49Capillary rises to loop height positionPrepare by: civvy chen50Formation of a loopRD (Reverse Distance)Prepare by

15、: civvy chen51Formation of a loopPrepare by: civvy chen52Prepare by: civvy chen53Calculated Wire LengthWIRE CLAMP CLOSEPrepare by: civvy chen54Calculated Wire LengthPrepare by: civvy chen55SEARCH DELAYPrepare by: civvy chen56TRAJECTORYPrepare by: civvy chen57TRAJECTORYPrepare by: civvy chen58TRAJECT

16、ORYPrepare by: civvy chen59TRAJECTORYPrepare by: civvy chen60TRAJECTORYPrepare by: civvy chen61TRAJECTORYPrepare by: civvy chen62TRAJECTORYPrepare by: civvy chen63TRAJECTORYPrepare by: civvy chen64TRAJECTORYPrepare by: civvy chen65TRAJECTORYPrepare by: civvy chen662nd Search HeightSearch Speed 2Search Tol 2Prepare by: civvy chen67Search Speed 2Search Tol 2Prepare by: civvy chen68Search Speed 2Search Tol 2Prepare by: civvy chen69Formation of a second bondPrepare by: civvy chen70Formation of a second bondContactPrepare by: civvy chen71Prepare by: civvy chen72Prepare by: civvy