田中银合金线AgSEA技术资料

1、Ag 合金线SEA型号Tanaka Denshi Kogyo K.K.Technical Department TANAKA DENSHI KOGYO K.K.半导体市场的发展趋势小型化微间距低线弧的运用缩减成本降低材料成本低成本提高生产力UPHMTBA参数范围简单的参数设定客户的要求: 低价格材料高生产力LED Device市场的发展趋势小型化低线弧短弧长缩减成本降低材料成本低价格材料提高生产力UPH参数范围简单的参数设定高亮度高反射率客户的要求:低价格材料高生产力高性能Yes (气体配件No 资金总额Yes (N2-H2No 混合气体芯片损伤第一焊点参数生产力(UPH etc 反键合第二焊

2、点参数材料成本铜线金线项目Ag 为主的键合线Yes (气体配件Yes (N2银线Au, Cu, 和Ag 合金线的比较(坏(好材料成本/ 接合性4 TANAKA新Ag合金线的命名命名:S E A序号Enhanced的英文首字母Silver的英文首字母SEA 型号的特点1. 材料成本低以银为主,低材料成本的键合线2. 键合性SEA 型号能在金线打线参数下打线3. 微间距SEA 的压着球真圆度良好5机械特性设备: 拉伸试验机UTM-拉伸速度: 10mm/min 试料长度: 100mm 测定数= 10键合线: SEA(Ag 合金线TCA1(裸铜线CLR-1(镀钯铜线GFC(金线0.8 1.0 1.2

3、1.4 1.6Wire diameter (milB r e a k i n g L o a d (g f SEATCA1 (Bare CuCLR-1 (coated CuAu (GFC6电阻率SEA型号的电阻率比金线高测定方法根据直流4端子法,通过一定的电流,测定当时的电压。根据测定值计算电阻。R=V / I(R:电阻V:电压I:电流根据右侧公式,计算电阻率。= R×S/L(:电阻率S:横截面积L:长度99.99%Au 99.99%CuAg alloy GPG-2GPH GFCTCA1SEAR e s i s t i v i t y (u c m

4、 3N 4N7熔断电流计算公式0.00.02.0 4.0 6.0Wire Length (mmF u s i n g C u r r e n t (A 0.7mil0.8mil 0.9mil 1.0mil0.02.0 4.0 6.0Wire Length (mmF u s i n g C u r r e n t (A 0.8mil SEA0.8mil Cu wire 0.8mil A u alloy 0.8mil 4N-AuSEA的熔断电流与金合金线的一样。在Eugene Loh技术报告中提到的公式:IEEE Trans.Comp.,Hybrids,Manu.Tech.,Vol6,no.2,P

5、.209,JUNE1983.报告的标题是“Fussed-Open Bond Wires 物理分析资料”FAB形成性气体流量的确认8打线机:UTC-3000 装有气体配件, 保护气体:N21.0 l/min0.2 l/min0.4 l/min0.6 l/min0.8 l/min好901002003004005006005101520Deformation (um C o m p r e s s i o n L o a d (m N SEACoated Cu Bare Cu 4N-AuFAB 压缩试验Flat tool FAB【FAB 制造条件】线径:20um FAB:38m打线机:Shinkaw

6、a UTC-1000气体:N 2, 0.6l/min EFO 时间:0.36msEFO 电流:36mA(银合金49mA(镀钯铜46mA(4N-金【测定设备】压缩装置:MCT-W500(SHIMADZU 【测定概图】【测定条件】压缩速度:23.5mN/sec 最大负荷:400mN 硬度比较软Au wire >SEA > Cu wire 硬10第一焊点【Al-Splash】【Bonding condition 】Bonder:Shinkawa UTC-1000Gas :N2 0.6l/minDie-Pad:Al-0.5%Cu(t=0.8umCapillary :SPT SI (H:25

7、, T:130, CD:38, FA:8, OR:30Wire diameter :20umFAB diameter :38um镀钯铜线US-Power 260 US-Power 200SEA US-Power 170Search Level :120umSearch Speed :8.0mm/sSearch Force :40gfBond Force :40gfUS-Power :170230US-Mode :-2Pre US-Power :40Bond Time :6.0ms11第一焊点Squashed Ball & Shear Force【Bonding condition 】B

8、onder : UTC-3000Gas : N2 0.6l/min Die : Al-1.0Si-0.5Cu(t=0.8um Capillary : SPT SI Wire dia. : 20um FAB dia. : 38um S-Level : 150um S-Speed : 4mm/s Bond Time : 6ms Pre-US : 40N=24Ave. (Std.25320280240US Power203015Search Force & Bond Force (gfXYToolGap: 3um12样品型号: SEA,GFC 线径: 18um观察项目纵切面: FAB &am

9、p; HAZ 横切面: FAB , Wire设备Focused Ion Beam (FIB : Hitachi FB2000A横切面纵切面结晶观察1399.99%Au (GFCSEA结晶观察(纵切面14Wire SEA99.99%Au(GFCFAB结晶观察(横切面15第二焊点Wire Pull at 2nd Position【Bonding condition 】Bonder :Shinkawa UTC-1000Gas :N2 0.6l/minDie-Pad :Al-0.5%Cu (t=0.8um Capillary :SPT SI(H:25, T:130, CD:38, FA:8, OR:3

10、0Wire diameter :20umSearch Level :100um Search Speed :4.0mm/sSearch Force & Bond Force :52gf US-Power :440560Bond Time :6.0ms:2nd bond lift occurred.23456784204605005405802nd US-PowerP u l l F o r c e (g f TANAKA Ag alloy wire23456784204404604805005205405605802nd US-PowerP u l l F o r c e (g f E

11、rror bar is STD.Pd coated Cu wireN=3016可靠性【Migration Test】Pass SEA 0/22Sample-30 / 22Sample-30/22Sample-20 / 22Sample-20/220 / 21PassSample-14N-Au wireSample-1ResultFailure / sample size (pinTerminal distance : 30 50 umVoltage : DC 6VHAST Machine : PC-R8D (HIRAYAMAMetal : Al-0.5%Cu 0.6um 40umFAB siz

12、e 0.8mil Wire dia.Size :6mm ×6mm ×300um Device130deg C 85%RH 96hHAST ConditionsQFP200pinFrame UTC-1000 ( Shinkawa Bonder SEA / 4N-Au wire Wire DC 6V+-+-+-3050um1743 44 umTarget squashed ball 33um FAB diameter ElBL 3.0 %8.9 gf Mechanical Properties 19.0 um Wire diameter SEA Wire type Thickn

13、essMetallization GE-7470 / non halogen compound Mold Resin QFP-200pin / Ag plating Flame 0.8 umAl-1%Si-0.5%Cu DieK&S 414FF-2021-R35(H10 CD13 T28 OR5 FA11Capillary 0.6 l / minForming Gas Shinkawa UTC-3000 with Cu kit Bonding Machine 121 deg / 100% / 2 atmPCT conditionPCT (Pressure Cooker test18PC

14、T【1st Bonding condition 】Bonder :Sinkawa UTC-3000Cu-kit Gas :N2 0.6l/minDie-Pad :Al-1.0%Si-0.5%Cu (t=0.8um Frame :QFP200pin Resin :NITTO DENKOGE-7470(non halogen Capillary :K&S 414FF-2021-R35(H10 CD13 T28 OR5 FA11Wire diameter :19.0um FAB diameter :33umSpark Current : 30mASpark Time : 0.26msTarg

15、et of Squashed all size : 44umTail Length : 100umSearch Speed : 4mm/secBond Force :15-30gfUS Power : 180-320Bond Time : 10msec US Time : 8msecUS mode : 0【SEA1】Shear force: 6.2kgf/mm2Bond Force : 20gf, US : 180【SEA2】Shear force : 11.5kgf/mm2Bond Force : 20gf, US : 280【SEA3】Shear force: 12.7kgf/mm2Bond Force : 20gf, US : 320【Au wire 】Shear force : 10kgf/mm2up0.04.04.55.0020040060080010001200