SMT回流焊工艺中英文对照

1、SMT回流焊工藝中英文對照(表面貼裝技術)1. Fundamentals of Solders and Soldering（焊料及焊接基礎知識）Soldering Theory（焊接理論）Microstructure and Soldering（顯微結構及焊接）Effect of Elemental Constituents on Wetting（焊料成分對潤濕的影響）Effect of Impurities on Soldering（雜質對焊接的影響）2. Solder Paste Technology（焊膏工藝）Solder Powder ( 錫粉) Solder Paste Rheolo

2、gy（錫膏流變學）Solder Paste Composition & Manufacturing（錫膏成分和製造）3. SMT Problems Occurred Prior to Reflow（回流前SMT問題）Flux Separation（助焊劑分離)Paste Hardening（焊膏硬化）Poor Stencil Life（網板壽命問題)Poor Print Thickness（印刷厚度不理想）Poor Paste Release From Squeegee（錫膏脫離刮刀問題）Smear（印錫模糊） Insufficiency（印錫不足）Needle Clogging（針孔

3、堵塞）Slump（塌落）Low Tack（低粘性） Short Tack Time （粘性時間短）4. SMT Problems Occurred During Reflow（回流過程中的SMT問題）Cold Joints（冷焊） Nonwetting（不潤濕）Dewetting（反潤濕） Leaching（浸析）Intermetallics（金屬互化物） Tombstoning（立碑）Skewing（歪斜） Wicking（焊料上吸）Bridging（橋連）Voiding（空洞）Opening（開路） Solder Balling(錫球)Solder Beading（錫珠） Spatteri

4、ng（飛濺）5. SMT Problems Occurred at Post Reflow Stage（回流後問題）White Residue（白色殘留物） Charred Residue（炭化殘留物）Poor Probing Contact（探針測接問題）Surface Insulation Resistance or Electrochemical Migration Failure（表面絕緣阻抗或電化遷移缺陷）Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants（分層 / 空洞 / 敷形塗覆或包封的固化問題）6

5、. Challenges at BGA and CSP Assembly and Rework Stage（BGA、CSP組裝和翻修的挑戰）Starved Solder Joint（少錫焊點） Poor Self-Alignment（自對位問題）Poor Wetting（潤濕不良）Voiding（空洞）Bridging（橋連） Uneven Joint Height（焊點高度不均）Open（開路） Popcorn and Delamination（爆米花和分層）Solder Webbing（錫網） Solder Balling（錫球）7. Problems Occurred at Flip C

6、hip Reflow Attachment（倒裝晶片回流期間發生的問題）Misalignment（位置不准） Poor Wetting（潤濕不良）Solder Voiding（空洞） Underfill Voiding（底部填充空洞）Bridging（橋連） Open（開路）Underfill Crack（底部填充裂縫） Delamination（分層）Filler Segregation（填充分離） Insufficient Underfilling（底部填充不充分）8. Optimizing Reflow Profile via Defect Mechanisms Analysis（回流曲

7、線優化與缺陷機理分析）Flux Reaction（助焊劑反應） Peak Temperature（峰值溫度）Cooling Stage（冷卻階段） Heating Stage（加熱階段）Timing Considerations（時間研究） Optimization of Profile（曲線優化）Comparison with Conventional Profiles（與傳統曲線的比較）Linear Ramp Up Profile(斜坡式曲線)典型的表面貼裝工藝分為三步：施加焊錫膏-貼裝元器件-回流焊接工藝中不良現象中英文對照表1.缺件(MISSING PARTS)28.腳未彎(PIN N

8、OT BENT)55.印章錯誤(WRONG STAMPS)2.錯件(WRONG PARTS)29.缺蓋章(MISSING STAMP)56.尺寸錯誤(DIMENSION WRONG)3.多件(EXCESSIVE PARTS)30.缺標籤(MISSING LABEL)57.二極體壞(DIODE NG)4.短路(SHORT)31.缺序號(MISSING S/N)58.電晶體壞(TRANSISTOR NG)5.斷路(OPEN)32.序號錯(WRONG S/N)59.振盪器壞(XTL NG)6.線短(WIRE SHORT)33.標籤錯(WRONG LABEL)60.管裝錯誤(TUBES WRONG)7

9、.線長(WIRE LONG)34.標示錯(WRONG MARK)61.阻值錯誤(IMPEDANCE WRONG)8.拐線(WIRE POOR DRESS)35.腳太短(PIN SHORT)62.版本錯誤(REV WRONG)9.冷焊(COLD SOLDER)36.J1不潔(J1 DIRTY)63.電測不良(TEST FAILURE)10.包焊或多錫(EXCESS SOLDER)37.錫凹陷(SOLDER SCOOPED)64.版本未標(NON REV LABEL)11.空焊(MISSING SOLDER)38.線序錯(W/L OF WIRE)65.包裝損壞(PACKING DAMAGED)12

10、.錫尖(SOLDER ICICLE)39.未測試(NO TEST)66.印章模糊(STAMPS DEFECTIVE)13.錫渣(SOLDER SPLASH)40.VR變形(VR DEFORMED)67.標籤歪斜(LABEL TILT)14.錫裂(SOLDER CRACK)41.PCB翹皮(PCB PEELING)68.外箱損壞(CARTON DAMAGED)15.錫洞(PIN HOLE)42.PCB彎曲(PCB TWIST)69.點膠不良(POOR GLUE)16.錫球(SOLDER BALL)43.零件沾膠(GLUE ON PARTS)70.IC座氧化(SOCKET RUST)17.錫橋(S

11、OLDER BRIDGE)44.零件腳長(PARTS PIN LONG)71.缺UL標籤(MISSING UL LABEL)18.滑牙(SCREW LOOSE)45.浮件(PARTS LIFT)72.線材不良(WIRE FAILURE)19.氧化(RUST or OXIDIZED)46.零件歪斜(PARTS TILT)73.零件腳損壞(PIN DAMAGED)20.異物(FOREIGN MATERIAL)47.零件相觸(PARTS TOUCH)74.金手指沾錫(SOLDER ON GOLDEN FINGERS)21.溢膠(EXCESSIVE GLUE)48.零件變形(PARTS DEFORMED)75.包裝文件錯(RACKING DOC WRONG)22.錫短路(SOLDER BRIDGE)49.零件損壞(PARTS DAMAGED)76.包裝數量錯(PACKING QTY WRONG)23.錫不足或少錫(SOLDER INSUFFICIENT)50.零件腳髒(PIN DIRTY)77.零件未定位元(PARTS UNSEATED)24.極性反(WRONG POLARITY)51.零件多裝(PARTS EXCESS)78.金手指沾膠(GLUE ON GOLDEN FINGERS)25.腳未入