试验项目4要点

1、实验项目名称：印刷电路板的设计学生姓名：试验时间：2014-3-28批改老师：戴勤实验学时：4实验地点：4-214实验成绩：批改时间：2012-4-20实验项目4印刷电路板的设计一、实验目的和要求1、掌握通过手工方式和系统内置的向导，新元件封装的制作方法与操作步骤。2、掌握对元件封装库进行管理的基本操作。3、掌握由原理图生成网络表4、理解电路板的物理边界和电气边界的区别及绘制方法，了解由向导生成电路板的过程。5、 重点掌握自动布线规则的设置及自动布线有关命令的使用，理解DRC校验的功能。6、 掌握几种手工调整布线的操作技巧，如将焊盘或元件接入到网络内的操作步骤，对导线、焊盘或字符串进行全局编辑

2、的操作方法等。二、实验仪器和设备已安装Protel 99se软件的PC 一台三、实验内容1、给出发光二极管的 SCH元件，如图4.1所示。请绘制出其对应的元件封装，如图4.2所示。两个焊盘的 X-Size和Y-Size都为60mil，Hole Size为30mil，阳极的焊盘为方形，编号为A，阴极的焊盘为圆形，编号为K，外形轮廓为圆形，半径为 120mil，并绘出发光指示。图4.1发光二极管的SCH元件图4.2发光二极管的PCB元件2、NPN型三极管的SCH元件，如图4.3所示，其对应元件封装选择TO-5，如图4.4所示。由于在实际焊接时，TO-5的焊盘1对应发射极，焊盘 2对应基极，焊盘 3

3、对应集电极，它们之间存在引脚的极性不对应问题，请修改TO-5的焊盘编号，使它们之间的保持一致，并重命名为TO-5A。TO52C皐电總3E发射扱图4.3 SCH元件3、通过封装制作导向，绘制出实验二中元件图4.4 PCB元件ICS512对应的封装 SOP-8，如图4.5所示。焊盘的X-Size为80mil, Y-Size为24mil。第一引脚的焊盘为矩形，其余焊盘的两端为半圆形。纵向相邻焊盘之间的距离为50mil，横向相邻焊盘之间的距离为220mil。图4.5 SOP-8封装4、通过封装制作导向，绘制出实验二中开关DIPSW8对应的封装DIP-16，如图4.6所示。焊盘的X-Size和Y-Siz

4、e均为50mil，Hole Size为30mil。第一引脚焊盘为方形，其余焊盘为圆形。纵向相邻焊盘之间的距离为100mil，横向相邻焊盘之间的距离为300mil。图4.6 DIP-16封装5、手工绘制二极管IN4007的封装RAD-0.2。如图4.7所示。两个焊盘的 X-Size和Y-Size都为60mil，Hole Size为30mil，二极管阳极的焊盘为方形，阴极的焊盘为圆形，外形轮廓为距形，并绘出方向指示。图4.7二极管的封装 RAD-0.26、使用电路板生成向导，新建一个边长为1500mil的正方形电路板，在电路板的四角开口，尺寸为100mil x lOOmil，无内部开口，双层板，过

5、孔不电镀，使用针脚式元件，元件管脚间 只允许一条导线穿过，最小走线宽度为10mil，走线间距15mil。所使用元件如表 4.1所示。电气原理图和PCB布局如图4.8所示。操作练习内容如下：1）分别使用直接装载和利用设计同步器两种方法装入网络表和元件。2）分别使用群集式和统计式两种方法进行自动布局，并使用手工方法对布局进行调整。3）采用全局自动布线。4）在电路板上添加三个焊盘，标注为VCC、GND和CLK ,并把他们连入相应的网络。表4.1元件一览表元件名称元件标号元件所属SCH库元件封装元件所属PCB库RES2R1、R2Miscellaneous Devices.ddbAXIAL0.4Advp

6、cb.DdbCAPC1Miscellaneous Devices.ddbRAD0.1Advpcb.DdbCRYSTALY1Miscellaneous Devices.ddbXTAL1Advpcb.Ddb74LS00U1A、U1B、U1CProtel DOS Schematic Libraries.ddbDIP14Advpcb.DdbX 二 0口兰 " 人 二壬 口cs1LCi ¥1j 1 iR2 -I 卜 LK辰 1 LOOM 1异1卜IK图4.8 电气原理图和 PCB布局图7、使用电路板生成向导，新建一个边长为1800mil的正方形电路板，在电路板的四角开口，尺寸为100

7、mil x lOOmil，无内部开口，双层板，过孔电镀，使用针脚式元件，元件管脚间只允许一条导线穿过，最小走线宽度为20mil，走线间距15mil。加载Advpcb.ddb元件封装库，所使用元件如表4.2所示。电气原理图和 PCB布局如图4.9所示。操作练习内容如下：1 ）利用设计同步器装入网络表和元件。2）先对集成电路555进行预布局（以555为布局的中心），再使用群集式方法进行自动布局，并使用手工方法对布局进行调整。3 ）先对电阻R1进行手工预布线，然后再采用自动布线完成其它布线任务。4）采用全局编辑，对电源和接地的走线线宽变为30mil。表4.2 元件一览表元件名称元件标号元件所属SCH

8、库元件封装元件所属PCB库RES1R1、R2Miscellaneous Devices.ddbAXIAL0.3Advpcb.DdbCAPC1、C2Miscellaneous Devices.ddbRAD0.1Advpcb.DdbUA555U1Protel DOS Schematic Libraries.ddbDIP8Advpcb.Ddb4HEADERJP1Miscellaneous Devices.ddbPOWER4Advpcb.Ddb设置为板长1800mil，宽1200mil，按照电路的功能进行元件的手工布局与调整，可参照图4.10的布局。C4CL C2Y1., u I；U2口U13 艮=L

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