MEI-7.5-024PlacementMachineCPK贴片机CPK制作程序

1、話一mTITLE: Placement Machine CPK Procedure 标题：贴片机CPK制作程序DOC No.: MEI-7.5-024REV： EPage 1 of 12Revision History 更改记录REV 版本CHANGE更改内容WRITTEN编写DATE 日期ABCDENewUpdate DOC No and standard cover1. Update Doc No. from MEI-2001 to MEI-10-09 and format2. Update all contentsUpdate all contents and doc# from MEI

2、-10-09 to MEI-7.5-024Update all contents2003.4.152003.12.152005.1.62006.10.212008.6.5Check & Approva 检查和批准栏SIGNATUREDATESIGNATUREDATE签名日期签名日期OriginatorPrograni/Project是案者XXX2008-6-5项目组N/AN/AQuality Dept.Material质童部xxx2008-6-15物料部N/AN/AMIS Dept.HR许讯部N/AN/A人事部N/AN/AOps. Dept.GM运作部xxx2008-6-20总经理N/

3、AN/AChecked by DCC:Date:文控审核：xxx日期：2008-6-25Confidential & Proprietary htfonnation of Xxx (Xxx)話一mTITLE: Placement Machine CPK ProcedureDOC No.: MEI-7.5-024REV： E标题：贴片机CPK制作程序Page 3 of 121. Purpose 目的Evaluate placement capability衡量贴片机贴装能力2Scope范围This procedure only applicable to Xxx Xxx. 适用于xxxx

4、xx公司SMT生产线贴片机3. Definitions 定义Cp - Process Capability Index 过程能力指数。Cpk - Process Capability Index of Departure Status 有偏移的过程能力指数。USL - Upper spec limit. Ji限规格。Responsibility 职责SMT Engineer： Measure CPK data of SMT chip machines every year. 设备工程师对SMT 速贴片机每年测一次CPK。5. Procedure 程序5.1 Preparation of gla

5、ss JIG P.C.B 准备制作CPK的玻璃治具5.1.1 Attach a transparent adhesive double-faced tape for exclusive use on the glass jig P.C.B.将制作CPK的专用双面胶带贴到CPK的玻璃治具。2 Arach. ±e adhesive double-faced tape, recipOTarHy.Confidential & Proprietary bifonnation of Xxx (Xxx)3 Attach the tape, while peeling off the blu

6、e proiecnou sheet.4一Peel off 他ie yellowprorectLOH sheet.満一越DOC No.: MEI-7.5-024REV： EPage 5 of 12Confidential & Proprietary bifonnation of Xxx (X.xx)PC.B Origin5.1.2 Set the glass jig P.C.B origin on the machine.根据不同的机型定艾治具的原点。Align the machine reference point with the P.C.B origin of the glass

7、jig P.C.B 根扌居机器的原点定位將CPK治具放到机器上使之与机器原点一致。P.C.B. Origin5.2 Placement of the components 贴装元件5.2.1 How to mount the chip components on the glass jig P.C.B to the pattern coordinates is described.不同大小的CPK元件贴到玻璃治具的不同区域定义。Component size 元件大小Placement zone 贴片区域Capacity 贴片数量Remark 备注0402,06033005Zone A8 lin

8、es* 16rows= 128Up to the machine with16 heads1608Zone B8 lines* 16rows= 128Up to the machine with16 heads5.2.2 Placement method,贴片的方法When the automatic calculation of device offset or analysis of the placement accuracy for each angle is performed the Following four the items.用下列四种贴装方式来自动讣算机器贴装每一个角度的

9、精度和机器的OFFSET数据。mfew Lin 4 S R tihiwld Im ATITLE: Placement Machine CPK Procedure标题：贴片机CPK制作程序治具上的A行到B行是0度b. Placement angle for Line C to D should be 90 degrees 治具上的C行到D行是90度】 Placement angle for Line E to F should be 180 degrees 治具上的E行到F行是180度d. Placement angle for Line G to H should be 270 degrees

10、. 治具上的G行到H行是270度1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16I Head MO 3 Head NOPlacemen: angle for Line A to B should be 0 degrees. Placement angle for Line C to D should be P0 degrees.Placement angle for LineE to F should be J80 degrees Placement angle for Line G to H should be 270 degrees.Head NO 11.GXH

11、1S Pragraming5.2.3 Pattern programming 程序TCM35002Programing5.3 Procedure of CPK measure CPK 的测量过程5.3Assemble of the measure machine 安装CPK测量设备。TITLE: Placement Machine CPK ProcedureDOC No.: MEI-7.5-024REV： E标题：贴片机CPK制作程序Page 5of 12Macro-Ring Component Size 40mm20mmPov/er Switch for Back LightingUSB C

12、ameraUSS Dongle (Software License? Key)RS-232C (D-sub. 9-pin) For XY Stage ControlPower Cable (AC100 - 240V)0402 to 10051608Power Switch for XY Stage53.2 Setting the glass jig P.C.BCPK玻璃治具的安装。(l) Setting for measuring the component with the size from 0402 to 1005 press the glass jig P.C.B against th

13、e reference PinNO 1 and fix it.贴装0402到1005的元器件测量时，CPK玻璃治具原点紧靠Pinl固左。(2) Setting for measuring the component with the size 1608 remove the reference pinl and press the glass jig P.C.B agains the reference Pin 2 and fix it.贴装1608的元器件测量时，CPK玻璃治具原点移到紧靠Pin2固左。話一mDOC No.: MEI-11.5-024REV： EPage 11 of 12Co

14、nfidential & Propnetury Information of Xxx (X.xx)5.3.3 Starting up CPK measure software. JF始运行 CPK 测量软件。1) Click the icon of measure software on the desktop 双击桌面上测量CPK软件图表。u二.QB CH壬r 一】 |esr2) Click the INPUT tap on the Header'' window. 点击窗口顶端的"INPUTS钮。Input Tabrr3) Input of measure

15、 condition. 输入测莹CPK的条件数摇。TITLE: Placement Machine CPK Procedure 标题：贴片机CPK制作程序'二"竝戸5T nj|I，砌ytfjv可严ELSipsi 口 LSLpoS prbpo(She«<厂I诵扌冇己礙TWF 仔庁度 怦A 00 TC Tl 0 rrih初f oMpbi HEanmX"curtwx(D|dp§iM |行行、能彌cTTf/MW/DD) I mwwMx> wn!z-ti-=VS4-idoot* 04*0 IT计 OWGWvr1 rrB rr0R13 0门rr2

16、12 rr0 rrIDrrg pr18 (T*223 FT了 rv11is pri9 pr238 r)2is pr如fr34e OeH C 讪卸cecoucrrrrrrIT厂却DF厂厂厂 u V wFl_厂厂4) Click the start button on the operation panel. 点击操作画面上的Start按钮。Start Button3耳;60 afo»0/ ； /gwhen the Start button is press, the X/Y table stage automatically zero and then moved to first m

17、easure point 当点击STRAT按钮时，X/Y平台回原点并移到第一个测量点的位置。Move the first measurement point to the center of the screen. Move the X/Y table stage by clicking it move button (U,L, R. D)点击(U丄R. D)按钮移动X/Y平台使第一个测童点移到屏幕的中心。OpiRal AM.nXY" Stage Move ButtonUSB Camera Screen DisplayChip Comp on entC0O1ODQWO0.0000.0

18、0V1OKK歼y”尸JFluM bnnr/urlstO CctK-</or8Cf««LP1rM»rform“Sub PanerDialog BoxA01 Coordinates CharacterFiducia| Marks(Component Placement Addrox)OK Button for memorizing the measurement start position5) After the focus adjustment, click OK button on the "SUB panel" dialog box.

19、 调好焦距后点击面板上对话框OK按钮。When the alignment correction of the glass jig P.C.B has been completed, the measure is automatically started. 当玻瑪治具自动定位完成时，CPK的测量自动开始。満一越TITLE: Placement Machine CPK ProcedureDOC No.: MEI-7.5-024标题：贴片机CPK制作程序Page 15 of 126) When all items have been measured, the following dialog

20、box appears When the OK button is clicked. the X/Y Stage to be zeroed.全部的点位测量完成后弹出以下对话框。点击对话框中的OK后，X/Y平台自动回到原点。Confidential & Proprietary bifonnation of Xxx (X.xx)7) Click Save/end button , when the it clicked the following dialog box appears So click the OK button. 点击Save/end按钮，点击它弹出以下对话框，然后点击O

21、K按钮。# Operaton(8) Saving measurement results using Excl format. Open measurement result file (MIXY -sub.xls) and open the Analysis sheet to analysis data of machine offset.测量的结果使用Excl的格式保存。打开测董结果文件(MIXY-sub.xls),并打开数据分析页去分析机器 Offset 数据。Analysis Calculation Button /C miumuII (RLtt #JXY uaLt i&rx；

22、-1ID ”空甲*轡*幺年W- - - -pq 歹事A豪 RF力“丸"rp St七空哆叩-OKIM >wn» X ' «V* ' IX0UliS!0 烦0C19QQ»Min-QCiS-0D15TASQS-QOHCil)：6OCOl0 0)3OOi：e0011靱0B3)QCC4a on 1 onusaCETi妙I(O09)i® I org朗ICp2JD331zn2122S3：J152223C62BJE D>Rirol AICO個OHUMQU0»如YgIt shows the analysis results

23、in the direction X.Items of Max, Min, Average, 3s? Cp and Cpk are displayed.It shows the dispersion of the results for each head (nozzle) in the direction The value dispersion for each head nnd remedy cn be easily confirmed.5.3.4 If CPK less than 1.33 set up machine again or change relative spare pa

24、rts according (MEI-7.5-024-F001) CPK chart ij necessary. All adjusting should been record After those do CPK again according 5.15.3until pass如果计算的CPK值低于1.33时，应根据CPK图表(MEI-7.5-024-F001)反映的偏差值来调整机器或更换备件 并做好调整祈和调整后的数据记录，再按照5.1-5.3步骤重新测试CPK值，直到符合要求为止。5.3.5 Do CPK of SMT line each chip machine equipment

25、every year.SMT工程师需每年对毎条线使用的每台高速帖片机进行一次CPK测试。6. Reference 参考7. Records and Limited Time 记录及保存年限7.1 MEI-7.5-024-F001 CPK Computation SpreadsheetCPK数扌居表a year一年& Training 培训SMT Engineer/technician should be trainedSMT工程师/技术员接受培训9. Attachments 附录9.1 IPC-9850 Surface Mount Equipment Performance Characterization参照 IPC98509.1.1 Methodology 计算方法9.1.1.1 According to the output data from the template board. we can get Xi data and the following is the formula:在模板上贴装N个器件，取得Xi数据，计算公式如下:一 1 ,r