石墨烯泡沫应用于宽屏电磁波屏蔽fileWentaoZhai知识分享

1、1Microcellular graphene foam for improved broadband electromagnetic interference shielding石墨烯泡沫应用于宽屏电磁波屏蔽石墨烯泡沫应用于宽屏电磁波屏蔽(pngb)Wentao Zhai翟文涛翟文涛Ningbo Institute, CAS中科院宁波材料所中科院宁波材料所20161018第一页，共38页。Our research interests我们的研究我们的研究(ynji)兴趣兴趣Development of extrusion foaming technology开发开发(kif)连续挤出发泡技术连

2、续挤出发泡技术 Extrusion foaming system with using CO2 as the blowing agent; 以超临界CO2流体(lit)为发泡剂 Regular PP was used to produce PP foam 通用PP用作发泡体系第二页，共38页。Development of autoclave foaming technology开发开发(kif)釜压发泡技术釜压发泡技术EPPEPPEPLAEPIETPUOur research interests我们我们(w men)的研究兴趣的研究兴趣第三页，共38页。4Development of mult

3、i-functional polymer foam film开发开发(kif)多功能聚合物发泡薄膜多功能聚合物发泡薄膜 Polymer/filler/DMFPrecipitationDryingRedissolving Water vapor induced phase separationWater vaporH2OSolution blendingPolymer nanocompositePolymer foam filmDryingFilm casting Our research interests我们我们(w men)的研究兴趣的研究兴趣第四页，共38页。5Advantages of

4、 (microcellar) foaming微发泡的优势微发泡的优势(yush) lightweight/轻量化轻量化; Thermal insulation/隔热隔热; Sound insulation/隔音；隔音； Improved impact/cushion properties/提高了冲击提高了冲击/缓冲性能缓冲性能(xngnng)； Reduced dielectric properties/降低了介电性能降低了介电性能(xngnng)第五页，共38页。 Absorbing the microwave as a maze structure; 为电磁波提供为电磁波提供(tgng)迷

5、宫迷宫结构；结构；EMI shielding materials电磁电磁(dinc)屏蔽材料屏蔽材料Advantages of (microcellar) foaming微发泡的优势微发泡的优势(yush)第六页，共38页。EM interference effects 电磁电磁干扰干扰 Compromise the performance and lifetime of devises Interfere with the function of other nearby components EM information leakage 电磁电磁泄露泄露Computer, cell pho

6、ne,To damage the human body 危害危害(wihi)人体人体Harmful effects of EM wave电磁波的危害电磁波的危害(wihi)第七页，共38页。8Radar detection雷达探测雷达探测Electromagnetic stealth materialsRadar detection: Broad band EM wavetransmitted or received by radar第八页，共38页。Classical protection against EMIMetal sheetsBut: high density Poor mecha

7、nical flexibility Corrosion Limited tuning of the shielding effectiveness (SE)Advantages brought by polymersEasy shapingLightweightLow costBut most polymers are transparent to the EMI waveMethods to improve the EMI SE of polymersTo disperse electrically conductive fillers in polymer matrixThe carbon

8、 materials such as carbon black, graphite, carbon nanotube, graphene nanosheets are usually selected as the conductive fillers.Classical materials for EMI shielding经典经典(jngdin)的电磁屏蔽材料的电磁屏蔽材料第九页，共38页。Novel cellular structure of polymer composites for EMI shieldingPolymer/conductive filler compositePo

9、lymer/conductive filler composite foam金属材料的电磁屏蔽机制为反射损耗；金属材料的电磁屏蔽机制为反射损耗；聚合物复合材料以反射损耗为主；聚合物复合材料以反射损耗为主；均易导致电磁波二次污染问题。均易导致电磁波二次污染问题。 入射波能量入射波能量 反射波能量反射波能量透射波能量透射波能量聚合物发泡材料以吸收损耗为主，有效聚合物发泡材料以吸收损耗为主，有效避免电磁波的二次污染问题避免电磁波的二次污染问题透射波能量透射波能量入射波能量入射波能量反射波能量反射波能量第十页，共38页。Tendency of EMI shielding materials电磁电磁(d

10、inc)屏蔽材料发展趋势屏蔽材料发展趋势Lighter/轻量化轻量化Thinner/更薄更薄Higher EMI SE/更高的屏蔽更高的屏蔽(pngb)效能效能For the application in special fields such as aerospace, weapon equipment, microelectrionics.Superior thermal stability/耐高温耐高温Flame retardancy/阻燃阻燃Excellent mechanical properties/有益的性能有益的性能Flexible/柔性柔性第十一页，共38页。High Tg:

11、 220 C;Flame retardant;Solid stat foaming using compressed CO2 as the physical blowing agentPreparation of high performance PEI microcellular foam 制备制备(zhbi)高性能高性能PEI微发泡材料微发泡材料Miller, D. et al., Polymer, 2011, 52, 2910.第十二页，共38页。Published data of microcellular high performance foam/发表发表(fbio)的高性能聚合物

12、发泡材料论文的高性能聚合物发泡材料论文Expansion ratio lower than 5 times膨胀膨胀(png zhng)倍率低于倍率低于5倍倍第十三页，共38页。Method to improve the expansion ratio of PI microcellular foam/提高膨胀提高膨胀(png zhng)倍率的方法倍率的方法Density：90 kg/m3Expansion rate: 15timesW.T. Zhai*, W.W. Feng, J.Q. Ling, W.G. Zheng, Ind. Eng. Chem. Res., 2012, 51, 1282

13、7. THF as a co-blowing agentTg: 265 C第十四页，共38页。50 mCell size：2030 mCell morphology of microcellular PI bead foam PEI微发泡粒子微发泡粒子(lz)的泡孔形态的泡孔形态第十五页，共38页。Compression molding of PI bead foam模压模压(my)粘结成型粘结成型第十六页，共38页。Tg:230C, 50 times expansion/50倍膨胀倍膨胀(png zhng);翟文涛，郑文革，凌建强，中国(zhn u)发明专利， 201210171721.X翟

14、文涛，郑文革，冯卫卫，凌建强，中国(zhn u)发明专利， 201210170254.9PI microcellular foam with superhigh volume expansion/制备超高倍率制备超高倍率PI泡沫泡沫第十七页，共38页。Compression molding模压模压(my)成型成型第十八页，共38页。 High processing temperature up to 320-360 C/加工温加工温度高达度高达320-360度；度； High viscosity of composite melt and difficult to disperse high

15、content of nanofillers/体系粘度高，难以体系粘度高，难以(nny)分散分散; Difficult to achieve a high foam expansion ratio/难以难以(nny)得到高的膨胀倍率；得到高的膨胀倍率； A high filler content requirement to achieve a good EMI shielding properties/优异的屏蔽效能需要添加高含量的吸收优异的屏蔽效能需要添加高含量的吸收剂！剂！Challenging in the preparation of PI composite foam with h

16、igh filler loading 制备高填充制备高填充PI复合材料泡沫复合材料泡沫(pom)的挑战的挑战第十九页，共38页。20Polymer/filler/DMFPrecipitationDryingRedissolving Water vapor induced phase separationWater vaporH2OSolution blendingPolymer nanocompositePolymer foam filmDryingFilm casting Method to solve the challenging/解决办法解决办法第二十页，共38页。Preparatio

17、n of PEI/graphene microcellular foam/制备制备(zhbi)PEI/石墨烯发泡材料石墨烯发泡材料J.Q. Ling, W.T. Zhai*, W.W. Feng. et al., ACS Appl. Mater. Interfaces, 2013, 5, 2677.B. Shen, D.D. Lu, W.T. Zhai*, et al., ACS Appl. Mater. Interfaces, 2013, 5, 11383.PEI/Graphene/DMF solutionSample size: 2.3 mm第二十一页，共38页。22EMI SE test

18、/电磁屏蔽效能电磁屏蔽效能(xionng)测试测试R&S ZVA67 vestor network analyzer 网络(wnglu)分析仪 Sample size: 22.5 mm 10.0 mm第二十二页，共38页。Foaming: Volume expansion of 5 timesFor the commercial usage 20dB商用电磁屏蔽材料需要商用电磁屏蔽材料需要(xyo)效能大于效能大于20dBPEI/graphene microcellular foam used for EMI shielding/电磁屏蔽电磁屏蔽(pngb)效能效能第二十三页，共38页

19、。24Preparation of high thermal stable PI/graphene microcellular foam/制备制备(zhbi)泡沫泡沫The improved dispersion of graphene oxide by in-situ polymerization通过原位聚合来改善氧化通过原位聚合来改善氧化(ynghu)石墨烯的分散石墨烯的分散Y. Li, W.T. Zhai*, et al., RSC Adv., 2015, 5, 24342.第二十四页，共38页。25Thermal imidization at 350 C350度亚胺化Cell morp

20、hology of PAA/graphane and PI/graphene microcellular foams/泡孔形态泡孔形态(xngti)第二十五页，共38页。Samples with the thickness of 0.8 mm样品样品(yngpn)厚度仅为厚度仅为0.8毫毫米米 EMI SE of PI/graphene microcellular foam/PI/石墨石墨烯泡沫烯泡沫(pom)的电磁屏蔽效能的电磁屏蔽效能16 wt % rGO第二十六页，共38页。27PMDA/ODA/GO/DMFCarbonization and graphitizationImidizat

21、ionCasting on glass substrateIn situ polymerizationPhase separationMicrocellular PI/graphene foamsCarbon/graphene foamGraphite plateN2 atmospherePAA/GO casting solutionCoagulant bathPreparation of carbon/graphene microcellular foam/制备石墨制备石墨(shm)烯烯/碳泡沫碳泡沫Y. Li, W.T. Zhai*, et al., Carbon, 2016, 100,

22、375-385.第二十七页，共38页。350 C1000 C1500 C2100 C2600 C2600 C5 m5 m5 m5 m5 m1 m10203040506070802600 C2100 C1500 C1000 C(004)(100) (002)350 C Intensity (a.u.)2 100015002000250030002600 CID/IG= 0.429ID/IG= 0.814ID/IG= 2.207ID/IG= 1.425ID/IG= 1.972G-bandD-bandG-bandD-band350 C1000 C1500 C Intensity (a.u.)Rama

23、n shift (cm-1)2100 CPI (350C) Carbonization (1000-1500C) Graphitization (2100-2600 C) Cell morphology evolution during the pyrolysis/碳化碳化/石墨化过程中泡孔结构石墨化过程中泡孔结构(jigu)的演变的演变第二十八页，共38页。EMI SE of carbon/graphene microcellular foam/石墨石墨(shm)烯烯/碳复合泡沫的屏蔽效能碳复合泡沫的屏蔽效能第二十九页，共38页。Preparation of graphene film by

24、 direct evaporation of GO suspension/GO薄膜薄膜 self-assembly of GO into the GO film 自组装自组装(z zhun)成成GO薄膜；薄膜； GO was thermal reduction into graphene film； 热还原成石墨烯薄膜热还原成石墨烯薄膜B. Shen, W.T. Zhai*, W.G. Zheng*, Advanced Functional Materials, 2014, 24, 4542.第三十页，共38页。Proofs of the thermal reduction of graphene oxide into graphene/热还原热还原(hun yun)的证据的证据第三十一页，共38页。Conductivity of GO and grpahene电导率电导率sp3 Csp2 C第三十二页，共38页。The EMI SE of GO and graphene屏蔽屏蔽(pngb)效能效能 第三十三页，共38页。B. Shen, W.T. Zhai* et al., Carbon, 2016, 102,154.Preparation of graphene foam by the hydrazine foaming/水合肼发泡制备水合肼发泡制备(zhbi)石墨烯泡沫