信赖性基本知识-讲师版 (2)

1、1Outline of Material 課程大綱 Item 項 次 Outline of Material 課 程 大 綱 1 Reliability concept 可靠度觀念篇可靠度觀念篇 2 Reliability test and failure mechanism 可靠度測試與失效可靠度測試與失效機制機制 3 Reliability test and qualification 可靠度測試與產品資格認定可靠度測試與產品資格認定 2環境條件影 響溫度氧化、擴散等化學反應的促進，膨脹、收縮後造成的受熱，機械性歪斜、軟化、脆性濕度絕緣性降低、腐蝕及電解結露或乾燥時造成靜電氣阻礙振動、衝擊

2、機械性搖動鬆弛，疲乏破壞、斷線、共振造成的破損發霉絕緣性降低氣壓電氣耐壓降低，氣封不良(封漏)鹽害腐蝕、生鏽、絕綠性降低有害氣體氯氣、亞硫酸等造成腐蝕絕緣性降低砂或塵埃阻塞、帶電、絕綠性降低、磨耗臭氧氧化、有機材料脆弱化帶電電磁誘導妨害電波、破壞絕緣、附著異物、灰塵3 Nineteen century十九世紀開始研究 World war II 二次世界大戰 Military system軍事系統 Aviation system 航太系統 Commercial商用4 Not only predict data but also test dada要求証實資料而不是預估可靠度 Standard 標

3、準的定訂? Better and better 科技不斷變化，可靠度要維持/更好 Low recall rate 回修率越低越好5: Tech. Change quickly技術快速變化 High reliability product 高可靠度產品 Utilization widely使用範圍廣 Short market life 產品市場壽命短 Short time to market 快速上市時間 traditional test method 傳統測試方法? new acceleration test method 創新加速測試!6:High reliability assurance

4、 提出高可靠度的保證 Reliability system公司可靠度制度 Experience公司經驗 Reliability plan產品可靠度計劃 Reliability test data產品可靠度測試記錄 TQM7Traditional 傳統思考： reliability is the responsibility of RA personnel 可靠度是品保或可靠度工程人員的職責New 現代思考： reliability is team-work result 可靠度是 Team-work 的成果，公司其他成員如設計、製程、 製造工程師，必須在其職責中，考慮如何提昇可靠度81.00

5、5.00 10.00 50.00 90.00 99.00 100.00100000.001000.0010000.00Probability PlotTime, (t)Unreliability, F(t)PM 03:56:522000/3/11APICRICHARDWeibullData 1P=3, A=RR3-SF=8 | S=0Weibull 3P1.00 5.00 10.00 50.00 90.00 99.00 100.00100000.001000.0010000.00Probability PlotTime, (t)Unreliability, F(t)PM 03:56:52200

6、0/3/11APICRICHARDWeibullData 1P=3, A=RR3-SF=8 | S=0Weibull 3P9Design for Reliability Reliability predict可靠度預估 FMEA(失效模式效果分析) FTA(失效樹分析) Margin 預估 Design Guideline 制定 設計審核(Design Review)10產品在規定的使用環境中，能於規定的期 間內毫無故障的發揮其特定功能的機率 (某信心水準下)Quality over time11nMTTF:mean time to failure平均失效時間nMTBF:mean time b

7、etween failure平均失效間隔nBurn-in:催熟(將early failure產品去除)nFIT: failure in time單位時間失效, 10912l(t)13:find out potential failure mechanism發現潛在的失效機制evaluate failure rate評估產品的失效率make sure wear out mechanisms do not operate in product life period 確保於老化階段之失效機制不會出現在產品 正常的壽命階段14:環境條件環境條件試驗種類試驗種類 溫度溫度試驗、溫度循環試驗高、低溫放置

8、試驗濕度溫度試驗、溫度循環試驗、HAST試驗振動、衝擊振動試驗、衝擊試驗發霉溫度試驗、HAST試驗氣壓滅壓試驗、HAST試驗鹽害鹽水噴霧試驗有害氣體腐蝕試驗、混合氣體試驗砂或塵埃砂塵試驗、塵埃試驗臭氧臭氧、環境試驗帶電電磁誘導靜電試驗電氣雜音試驗15Reliability Lab. capabilitySPIL ConfidentialJEDECMIL or otherJ-STD-020, JESD22-A113JESD22-A104MIL-STD-883 Method 1010.7 JESD22-A106MIL-STD-883 Method 1011.9 JESD22-A102 JESD22

9、-A103MIL-STD-883 Method 1008 JESD22-A108JESD22-B101EIAJ-IC-121JESD22-A110, A118kkkkkIPC-9701JESD63JESD22-B102MIL-STD-883 Method 2003.7 JESD22-B105MIL-STD-883 Method 2004 JESD22-B107MIL-STD-883 Method 2015.11 16:Reference參考規範: J-STD-020, JEDC-22-A113Purpose目的: simulate SMT process模擬元件上板製程Failure mode

10、常見電性失效: 斷路(open), 功能失效(functional fail)Failure mechanism常見失效機制:脫層(Delamination), 爆米花 (Popcorn),晶片斷裂(die crack), 金球脫(ball lifted), 金線斷(2nd bond broken).等 1718:19:20Soak requirement Floor life standard Accelerated equivalent level time condition Time condition time condition 1 unlimited 30/85%RH 168+5

11、/-0 85/85%RH 2 1 year 30/60%RH 168+5/-0 85/60%RH 2a 4 weeks 30/60%RH 696+5/-0 30/60%RH 120+1/-0 60/60%RH 3 168 hours 30/60%RH 192+5/-0 30/60%RH 40+1/-0 60/60%RH 4 72 hours 30/60%RH 96+2/-0 30/60%RH 20+0.5/-0 60/60%RH 5 48 hours 30/60%RH 72+2/-0 30/60%RH 15+0.5/-0 60/60%RH 5a 24 hours 30/60%RH 48+2/-

12、0 30/60%RH 10+0.5/-0 60/60%RH 6 Time on label 30/60%RH Time on label 30/60%RH 21* PACKAGE : EDHS-BGA35*35* MOLD COMPOUND : KE1100AS3 / 7730L* SUBSTRATE : PPT(4L)DATE : 11/2201PREPARED : RA / KEVIN CHENNVIDIA EDHS-BGA35*35 ABSORPTION & DESPORTION CURVE* Follow J-STD-020A B SO R PTIO N C U R V E0.

13、 00%0. 02%0. 04%0. 06%0. 08%0. 10%0. 12%0. 14%0. 16%024487296120144168192H O U R SMOISTURE %K E1100A S3(30C / 60% R H )7730L(85C / 85% R H )7730L(60C / 60% R H )7730L(30C / 60% R H )D ESO R PTIO N C U R V E 125C0. 00%0. 02%0. 04%0. 06%0. 08%0. 10%0. 12%0. 14%0. 16%04812162024H O U R SMOISTURE %K E11

14、00A S3(30C / 60% R H )7730L(85C / 85% R H )7730L(60C / 60% R H )7730L(30C / 60% R H )22: 流程流程: :(1) Electrical testing 電性測試電性測試(2) SAT inspection 超音波檢驗超音波檢驗(3) Temperature cycling, 5 cycles, -65150C（option） 溫度循環溫度循環, 5 cycles-(選擇選擇)(4) High temperature bake, 24hours 125C 高溫烘烤高溫烘烤,24小時小時,125C(5) Mois

15、ture soak吸濕吸濕(level 1:85C/85%R.H 168h,level 2:85C/60%R.H 168h, level 2A:60C/60%RH 120h,level 3:30C/60%R.H192h)(6) SMT simulation, 3 cycles IR reflow 225C/240C/250C上板模擬上板模擬,流焊流焊3次次 (7) Electrical testing 電性測試電性測試(8) SAT inspection 超音波檢驗超音波檢驗 23qDelamination 脫層qPackage Crack 膠體破裂qDie Crack 晶片破裂qVoid 氣

16、洞qTilt 傾斜DelaminationPKG CrackVoidPKG CrackChip CrackSAT 可檢出不良:24超音波遇到脫層(空氣)時波的相位會反轉180度25Die Crack 晶片破裂PKG BottomPKG CrackPad BottomPKG Crack 膠體破裂Through scan 脫層26SAT accept criteria Item 0 hour After precondition * Die surface 0% 0% * Wire bond surface of Leadframe pad(top), leadframe pad(bottom)

17、0% 10% * total lead finger(top) 0% 10% * one lead finger(top), tie bars(top) 0% 100% * heat sink 0% 10% * Underfill 0% 10% * Die attach (for BGA) 0% 10% Delamination * Substrate 0% 10% Void * Underfill disallow cross two bumps N/A *Package Disallow Disallow Crack * die (for die thickness=8mil or PKG

18、 thickness=1.2mm or PKG thickness=2 or stack die or triple die) Disallow Disallow :27IR/Convection reflowOven Temp. and humidity chamber28有鉛流銲溫度曲線Sn/Pb reflow profile Slope: M ax. 3 /sec (183 to peak) Ram p down rate : Max. 6 /sec. Preheat: 100150 25 183 Tim e (sec) peak: 225+0/-5 or 240+0/-5 60 120

19、 sec. 60 150sec 1030 sec. 29 C Slope: M ax. 3 /sec (217 to peak) Ram p down rate : Max. 6 /sec. Preheat: 150200 25 217 Tim e (sec) peak: 250+0/-5 60 180 sec. 60 150sec 2040 sec. 無鉛流銲溫度曲線Leadfree reflow profile30Reference參考規範: JESD22-A102Purpose目的: To detect moisture related defect偵測與濕相關之不良 Condition

20、常用條件: 121C/100%RH/ 2ATM, 168HFailure mode常見電性失效: 短路(short), 漏電(leakage), 斷路(open) Failure mechanism常見失效機制:金屬離子遷移(iron migration/dendrite), 脫層(Delamination), 金屬層剝離(metal peeling),腐蝕(corrosion) 等 3132金屬層剝離(metal peeling)33Temperature cycling chamberqC condition: -65150CqB condition: -55125CqG conditio

21、n: -40125CThermal shock chamberqD condition: -65150CqC condition: -55125CqOthers34Reference參考規範: MIL-STD-883E Method1010.7,JESD22-A104Purpose目的: To detect the defect that related to packaging structure, material, process偵測與封裝結構, 材料, 製程相關之不良 Condition常用條件: -65C 150C(C條件), -55 125C (B條件), 1000CYCFailu

22、re mode常見電性失效:斷路(open),功能失效(functional fail)Failure mechanism常見失效機制:晶片斷裂(die crack), 金球脫, 金線斷, 脫層(Delamination), 導孔斷裂(via hole crack), 線路斷裂(trace broken),掉球(ball missing) 等 353637Reference參考規範: MIL-STD-883E Method1011.9, JESD22-A106Purpose目的: To detect the defect that related to packaging structure,

23、 material, process偵測與封裝結構, 材料, 製程相關之不良 Condition常用條件: -65C 150C(D條件), -55 125C (C條件), 500CYCFailure mode常見電性失效:斷路(open),功能失效(functional fail)Failure mechanism常見失效機制:晶片斷裂(die crack), 金球脫, 金線斷, 脫層(Delamination), 導孔斷裂(via hole crack), 線路斷裂(trace broken), 掉球(ball missing) 等 38150 CAir-65 CAir150 Cliquid

24、-65 Cliquid39Reference參考規範: EIA/JESD22-A101Purpose目的: To detect moisture related defect 偵測與濕相關之不良 Condition常用條件: 85C/85%RH, Bias, 1000HFailure mode常見電性失效: 短路(short), 漏電 (leakage)Failure mechanism常見失效機制:金屬離子遷移 (iron migration/dendrite),過大電流(electrical over stress),腐蝕(corrosion)等 4041Reference參考規範: JE

25、SD22-A103Purpose目的: To accelerate the diffusion of inter-metallic(Au/Al,Sn/Au),and confirm whether to cause open failure 加速合金(金/鋁,錫/金IMC)之擴散並 確認其是否因而造 成開路 Condition常用條件: 150C, 1000HFailure mode常見電性失效:斷路(open),功能失效(functional fail)Failure mechanism常見失效機制:金球脫(紫斑效應), 掉球(ball missing), 過大電流(electrical o

26、ver stress)等 42434445Reference參考規範: JESD22-A110Purpose目的: To evaluate on the device resistance to high humidity and temperature (with pressure) under specified bias condition. 評價產品在高溫、高濕 (壓力)及偏壓條件 下之耐久性Condition常用條件: 130C,85%RH, 96H/100H, Bias or un-biasFailure mode常見電性失效:短路(short), 漏電(leakage)Failure mechanism常見失效機制:金屬離子遷移(iron migration/dendrite), 過大電流(electrical over stress),腐蝕(corrosion)等 4647鋁墊腐蝕(Al pad corrosion)48Reference參考規範: EIA/JESD22-B102P