高等教育：基板设计规则.docVIP

1、高等教育：基板设计规则SiPDesignGuidelines5W5ChipCDecember11,20_DGL003REVAConfidentialConfidentialSWSChipCSWSChipCConfidentialConfidentialRevisionHistoryRevisionDescriptionofChangesDateRevisedUpdatedbyApprovedAAdded“RevisionHistorynpage12/11/06T.SherwoodP.WingateNotes:1.Revisionstothisdocumentmustbereviewed&;ac

2、knowledgedbytheDesign&;CharacterizationOrganizationHeadofDesignEngineering2.ThisGuidelineisuncontrolledinprintorSoftCopyformwhennotlocatedontheSTATSChipPACDesignPortal.ForcurrentrevisionpleasecontactSTATSChipPACDesignCenter.57_T5Chi瀚CSiPDesignGuidelinesGeneralNotes:RefereneeDetailsareusedtohelpcorre

3、latedesignfeaturestodimensionaltables?Notallfeaturesaredepictedineachdiagram?NominalDesigncolumndataisintendedtoprovideafeaturedimensionforreliablesubstratedesign.Thesedimensionsshouldbeusedwhenspaceisavailable?SomeassemblycapabilitiesarenotyetalignedbetweenfactoriesthesearenotedinthetablesasSCSorSC

4、K?Allothercapabilitiesareconsideredinalignment.3DESCRIPTIONMINIMUMNOMINALMA_IMUMDie&;PackageLayoutA:DiePadSizeDieSize+205DieSize+400B:DiePad&;MOSCAPPadSoldermaskpullback(forexposeddiepaddesiqns)6565C:DiepadtoDiepadSpace125200D:DietoDieDistance375500EDiepadtoWirebondpostspace200200F:DieedgetoWirebond

5、postspace,padlessDesignsorsoldermaskcoveredpaddesiqn325400G:Tracetodiepadspace125150H:DiepadtoPackageedge1502501:DietoPackageedge(w/o/w/bonding)325400ANotel.Diethickness<100=Size+100,Diethickness”00=Size+150SolderMaskoverLaminateSolderMaskoverMetalExposedMetalExposedLaminate5?5ChipCWireBondLeadDe

6、signRuleMINIMUMNOMINALMA_IMUMA:TopFlatwirebondablearea,FinishedRefertoFBGADesignRuleB:SinglewirebondpadWidthMin(Drawn)200C:WirebondPadtoPadSpace100D:WirebondPadPitch(Singlewidthpad)300E:Multiplewirebondpadwidth(Finished)-SameRefertoFBGADesignRuleF:MultipleWirebondpadwidthMin(Drawn)200+(n-1)x0.075)G:

7、Wirebondpadpitch(Multiwidthpad)300+(n-1)x0.075)H:Wirebondpadlength(Finished)RefertoFBGADesignRuleJ:WirebondPadlength(Drawn)200ConfidentialConfidential#hilltlldLtUtItConfidentialConfidential#hilltlldLtUtItConfidentialConfidential5?5ChipC#5?5ChipC#idtlLilitii!I!IiiWireBondleadspacingDesignruleMINIMUMN

8、OMINALMA_IMUMA:DistanceofwirebondpadedgetovialandedgeSame(ExposedVia)0A:DistanceofwirebondpadedgetovialandedgeSame(MaskedcoveredVia)95B:Distanceofwirebondpadedgetovialandedqe,different100C:Soldermaskoffsetfromwirebondpadarea506575D:WirebondpadtoPackageedge150200E:Wirebondpadtotracespacing130PKGEdgeS

9、olderMaskoverLaminateSolderMaskoverMetalExposedMetalExposedlaminatePKGEdgeSolderMaskoverLaminateSolderMaskoverMetalExposedMetalExposedlaminateWireBondpadDesignruleMINIMUMNOMINALMA_IMUMA:WireLengthQnn3000QWB:Distancetodieedgetodownbondon350SeepadNote13000C:Wirepitchatdie63D:Diebondpadsizeforfirstbond

10、(PadOpening)RefertoFBGADesignRulee:Diebondpadsizeforsecondbond(padOpening)94x94F:Dietodiewirebondlength3003000G:Substratebondpadtosubstratebondpadwirelength3003000SolderMaskOpeningEBDSolderMaskoverLaminateSoldermaskoverMetalExposedMetalExposedLaminate#GeneralponentRuleMINIMUMNOMINALMA_IMUMNonSolderm

11、askDefinedtypeA:PadLength0201(0603)oqnVfcV1/fcw-0402(1005)350500-0402(1005)350500-0402(1005)650700-0402(1005)800850B：PadtoPadClearance-0201(0603)200200275-0402(1005)380400500-0403(1008)3804005000603(1608)500600700-0805(20_)6007001030C:PadWidth-0201(0603)300350-0402(1005)500550-0403(1008)800850-0603(

12、1608)800850-0805(20_)12501300D:SoldermasktoPadMin.ClearanceAllponent506575e:PadtoAdjacentTraceMin.ClearanceAllponent130F:Min.soldermaskWidthAllponent100G:PadtoDieFlagClearance-0201(0603)175300-0402(1005)175300-0403(1008)175300-0603(1608)175350-0805(20_)175500H1:PadtoPadClearance(SidebySide)-0201(060

13、3)230250-0402(1005)230300-0403(1008)230300-0603(1608)230350-0805(20_)230350ConfidentialConfidentialConfidentialConfidential12llSolderMaskoverLaminateExposedMetalSolderMaskoverMetalExposedLaminateSWSChipC#H2:PadtoPadClearance(SidebySide)MINIMUMNOMINALMA_IMUM-0201(0603)175250-0402(1005)1753000403(1008

14、)175300-0603(1608)175350-0805(20_)仃535011:PadtoPadClearance(EndtoEnd)0201(0603)230250-0402(1005)230300-0403(1008)230300-0603(1608)230350-0805(20_)230350I2:PadtoPadClearance(EndtoEnd)0201(0603)125250-0402(1005)125300-0403(1008)125300-0603(1608)125350-0805(20_)125350J:SoldermaskWingWidth0201(0603)5006

15、30-0402(1005)700830-0603(1608)1000-0805(20_)1450K:ponentSMO(NSMD)toPackageEdgeMin.Clearance0201(0603)150250-0402(1005)1502500403(1008)150250-0603(1608)150250-0805(20_)150250ConfidentialConfidentialSolderMaskoverMetalSolderMaskoverLaminate|ExposedMetalriExposedLaminateSolderMaskoverMetalSolderMaskove

16、rLaminate|ExposedMetalriExposedLaminateSWSChipCMINIMUMNOMINALMA_IMUMA:PadLength-0201(0603)250250-0402(1005)350500-0403(1008)3505000603(1608)6507000805(20_)800850B:PadtoPadClearance-0201(0603)200200275-0402(1005)3804005000403(1008)3804005000603(1608)5006007000805(20_)6007001030C:PadWidth0201(0603)300

17、3500402(1005)500550-0403(1008)800850-0603(1608)800850-0805(20_)12501300D:SoldermasktoPadMin.ClearanceAllponent506575E:PadtoAdjacentTraceMin.ClearanceAllponent75100F:Min.SoldermaskWidthAllponent100G:PadtoDieFlagClearance-0201(0603)175300-0402(1005)1753000403(1008)1753000603(1608)1753500805(20_)175500

18、ConfidentialConfidential#ConfidentialConfidential#SolderMaskoverMetalSolderMaskoverMetalExposedLaminateSWSChipCH:PadtoPadClearance(SidebySide)MINIMUMNOMINALMA_IMUM0201(0603)175250-0402(1005)仃5300-0403(1008)1753000603(1608)175350-0805(20_)17535011:PadtoPadClearance(EndtoEnd)-0201(0603)175250-0402(100

19、5)175300-0403(1008)175300-0603(1608)仃5350-0805(20_)仃5350I2:PadtoPadClearance(EndtoEnd)0201(0603)125250-0402(1005)125300-0403(1008)125300-0603(1608)125350-0805(20_)125350J:SoldermaskWingWidth-0201(0603)5006300402(1005)700830-0603(1608)1000-0805(20_)1450K:ponentSMO(SMD)toPackageEdgeMin.ClearanceSMDpad

20、openingisused0201(0603)150250-0402(1005)150250-0403(1008)150250-0603(1608)150250-0805(20_)150250ConfidentialConfidential#ConfidentialConfidential#IEESolderMaskoverLaminateExposedMetalSolderMaskoverMetalSolderMaskoverMetalExposedLaminate,SWSChiptCConfidentialConfidential#ConfidentialConfidential#Stit

21、chDownBondRequirementMINIMUMNOMINALMax.LoopHeightDieThickness<355um,MoldCapHeight=800200DieThickness355um,MoldCapHeight=800200DieThickness<355um,MoldCapHeight800<1170250DieThickness355um,MoldCapHeight800<117025057_T5Chi57_T5Chi瀚CSYMBOLWirelo叩modELoopheightmilH：Singleinlinepadvieiomoldcap

22、clearanceMin20milHi:Ho:StaggeredpadwithtiersubsMClearancebetweeninnerandouterwieOuterpadrawwieiomoldcapclearanceMinUsingwediameteilxMin20milClearanceRequirementofSurfaceMountDeviceandWirebondMIMIMUMNOMINALMA_IMUMA:Min.clearancebondingawayfromPassivePassiveHeight:200um375PassiveHeight:300um475Passive

23、Height:400um500PassiveHeight:500um550-PassiveHeight:600um575PassiveHeight:700um600PassiveHeight:800um650PassiveHeight:900um700B:Min.ClearanceBondingtowardspassivePassiveHeight:200um175-PassiveHeight:300um275PassiveHeight:400um300PassiveHeight:500um350PassiveHeight:600um375-PassiveHeight:700um400-Pas

24、siveHeight:800um450PassiveHeight:900um500C:Min.ClearanceBondingparallelalongwithPassivePassiveHeight:200um175PassiveHeight:300um275-PassiveHeight:400um300PassiveHeight:500um350PassiveHeight:600um375-PassiveHeight:700um400PassiveHeight:800um450PassiveHeight:900um500D:Min.JumperDistanceNoPassiveDefinedPassiveHeight:200um2753000PassiveHeight:300u