00138LeadFree Electronics：They’re Here to Stay

1、lead-free electronics: theyre here to stay chris jorgensen ipc technical project manager lead-free electronics: positioning massachusetts companies as industry leaders north andover, mass. april 13, 2000 overview u10,000 tons of snpb solder used annually upb indicated as a hazardous element flegisla

2、tive action has pushed for its removal gplumbing solders and tin cans ghousehold paints gbullets fus electronics industry currently exempted from legislation uindustry lulled to sleep. overview wake up call! ueuropean legislation ustepped-up efforts by japanese oems unist - us industry stands to los

3、e $420 billion in three-year period following 2002 unless it has a competitive edge (nist atp web site) unow what? overview u ipc board of directors position statement the us electronic interconnection industry, represented by the ipc, uses less than 2% of the worlds annual lead consumption. further

4、more, all available scientific evidence and us government reports indicate that the lead used in us printed wiring board (pwb) manufacturing and electronic assembly produces no significant environmental or health hazards. nonetheless, in the opinion of ipc, the pressure to eliminate lead in electron

5、ic interconnections will continue in the future from both the legislative and competitive sides. ipc encourages and supports research and development of lead-free materials and technologies. these new technologies should provide product integrity, performance and reliability equivalent to lead-conta

6、ining products without introducing new environmental risks or health hazards. ipc prefers global rather than regional solutions to this issue, and is encouraging a coordinated approach to the voluntary reduction or elimination of lead by the electronic interconnection industry. worldwide activities

7、political activities ujapan fmiti take-back legislation 1997 fjapanese home electronic recycling law grevised in 1998 ghousehold appliance recycling in full force by april 2001 usweden frecommends lead phase-out by 2020 udenmark fprohibits import, sale and production of products containing metallic

8、lead political activities ueuropean commission (ec) waste electrical and electronic environment (weee) directive fcalls for lead ban in most electronics by 2004 fdelegate general (dg)-environment: industry is the problem and the solution ffourth draft stalled due to changes in european commission (e

9、c) ffourth draft scheduled for availability late april 2000 political activities uweee directive exemptions flead as an element in some alloys gsteel - containing up to 0.3% lead by weight galuminum - containing up 0.4% by weight gcopper - containing up to 4% lead by flead in electronic parts politi

10、cal activities uus freid bill - 1991 flead exposure reduction act - 1993 fepa proposed reporting requirements for lead usage limits from 25,000 lbs. to 10 lbs. - 1999 gipc opposes this proposal gcould prove very costly to smaller companies greconsidering small business impact gstaying focused on the

11、se activities political activities uus states fcalifornia gproposition 65 - safe drinking water and toxic enforcement act of 1986 fconnecticut gdepartment of environmental protection (dep) plans to issue general permit for recycling electronics this year fsouth carolina gstate legislature evaluated

12、a bill to establish a statewide electronic equipment recycling program. marketing/competitive pressures ujapan fhitachi glead usage in 1999 50% of that of 1997 gall products lead free by 2001 ginvesting 1.2 billion yen ($11.2 million) to expand production of lead-free solder fmatsushita (panasonic)

13、glead solder to be removed in 2000 from consumer electronics gall consumer electronics to be lead free by 2001 gwill begin marketing products in us ftoshiba glead removed from all cell phones by 2002 marketing/competitive pressures ujapan fsony glead usage in 1999 50% of that of 1996 glead removed f

14、rom all products except high-density packaging by 2001 gtold its 500 suppliers to provide lead-free products fnec glead usage by 2002 50% of that used in 1997 gcurrently using lead-free semiconductors gbegan shipping lead-free product in january glabeling lead-free from lead bearing products marketi

15、ng/competitive pressures uus fmonitoring japanese and european activities fresearching alternatives fprefer product-by-product switch rather than overall requirement fdont want marketing to drive legislation organizational activities uipc f gover 4000 visitors since august 1999 glead

16、 free grapevine gtechnical papers and articles ghost to ipc roadmap for lead-free electronics assemblies g2nd and 3rd drafts downloaded over 2000 times fl ge-mail forum for peer interaction g500+ subscribers gannouncements for future roadmap meetings organizational activities uipc fint

17、ernational summit on lead-free electronics assemblies g500+ attendees g35 presentations over five sessions ginitial roadmap development gproceedings include updated presentations fapex 2000 gtechnical forums, conference and roadmap work organizational activities ueia fsupports further research that

18、could lead to minimizing lead use in the electronics industry, including the funding of a university-affiliated research program unist - atp flucent ec must switch 100%) nipdauyesmaterial cost snbinothe assembly must be totally pb free. snyestin whiskers sncuyestin whiskers lead-free components udie

19、 attach fausi eutectic gnot applicable to large die because its brittle gtends to crack large silicon dies fausn eutectic gmelts at 180 gdefinition of new materials gfor new molding compounds fnew compounds need to meet high-temp requirements fcompounds should meet weee halogen free requirements for

20、ganic can use ag-filled epoxy lead-free components uflip chip/csp fno known solution ginternal to package gtemperature hierarchy fpotential for use of patented indium alloy or snagcu for direct chip fsome in industry may propose exemption for these parts lead-free components uconnectors and through

21、hole fmaterials same as molded components fmore data needed before making specific determinations ubga fform balls with snagcu gneed to pay attention to affects of high-temperature solder gconcerns with warpage of bgas fvery little data currently available, but being gathered by nemi and others pwbs

22、 uorganic solderability preservatives (osps) fviable candidate geasily processable grelatively free of ionic contaminants gflatter than hasl ggood solderability fconcerns gstorage life gneed to handle with care gdurability with high melting temperatures gneed to assess flux chemistries used pwbs ule

23、ad-free hot air solder leveling (hasl) fviable candidate gworks well with most alternative solders gwets faster than most plated finishes and coatings fconcerns gwarpage due to higher processing temperatures gpwb-absorbed process chemistries groundness of finish makes it hard to use with small leads

24、 gsafety issues with high-temperature solders fsome manufacturers may move away from hasl altogether if required to go lead free pwbs uimmersion finishes (precious metals) fviable candidate gsurface flatness gavailability gease of process fconcerns with thinness of coatings ghigh soldering temperatu

25、res may result in out-diffusion of base metals and oxidation greduced solderability pwbs uelectroless niau fviable candidate gresistant to damage during handling gimproved shelf life over other finishes gfree of ionic contaminants gcompatible with most flux chemistries gflatter than hasl pwbs umater

26、ials considerations freliability in processing gwarpage of pwb gmust be able to survive multiple reflows ghigh tg doesnt necessarily mean laminate can survive high soldering temperatures gpth reliability ghigh-temperature reflows also affect inks, adhesives and markings equipment unew equipment cons

27、iderations fsolder pots freflow ovens fconcerns gcost of new equipment gdowntime for transition and training staff gspace limitations fmay not be necessary in all cases when given lemons, make lemonade roadblocks and resolutions ulack of singularity of alloy findustry needs to continue consortia eff

28、orts in down-selection of alloys urework and repair impact fneed markings to indicate board is lead free urecycling requirements fmonitor state-level activities fcall upon consortia to make requirements uworker safety/exposure issues fneed data from epas dfe asf project roadblocks and resolutions un

29、o definition for lead free fcall on ipc membership to take initiative fpossibly 0.1%? ulack of industry partnership fcontinue efforts through consortia activities, such as roadmap development uneed to know process requirements findustry must share experiences fgo to suppliers for information findust

30、ry-sponsored lead-free assembly training roadblocks and resolutions uneed to know process requirements findustry must share experiences fgo to suppliers for information findustry-sponsored lead-free assembly training ulack of reliability and long-term data fsharing of data fconsortia must team together faccept or develop data for specific applications ffocus on what data is needed fdissemination and acceptance of data roadblocks and resolutions utoxicity/environmental impac