MPMUP2中文操作手册[共73页]

1、Emergency Stop警急停止開關Temperature溫度控制表On電源啟動開關Relative Humidity濕度控制表Off電源關閉開關Power電源燈Start Cycle開始循環按鈕UP2000印刷機特性視覺自動對準裝置 Vision Alignment System慢速脫模功能 Slow Snap-off Function可程式設定刮刀頭 Programming Squeegee自動擦拭鋼板系統Stencil Wipper 2.1關於印刷週期Printing Cycle印刷週期包含下列過程1. 基板搬入Loading Board2. 基板定位 Locating Board3

2、. 視覺系統對位 Vision Alignment4. 印刷平台上升 Z Tower UP5. 刮刀向前後刮印錫膏 Printting6. 慢速脫模 Slow Snap-Off7. 印刷平台下降 Z Tower Down8. 基板搬出 Unloading Board2.2硬體2.2.1操作介面軌跡球或螢幕(Trackball or Monitor)Trackball軌跡球:1. 移動螢幕上的指標2. 移動各軸3. 數入數字、參數等等.3.軟體介面開機後,顯示如下的畫面For 7.0以上(因軟體版本新舊不一樣而不同)Ultraprint 2000內全部馬達,都是步進馬達,所以剛開機必需RESET

3、重新回原點後才能開始使用。MPM Corporation訊息先顯示區即時影像工作區關於MPM公司資訊VACUUMMOTORFRAMECLAMPUP/DOWN 啟動鋼板固定鈕 啟動真空馬達鈕DISPENSESOLVENTSQUEEGEECLAMPS 啟動刮刀座固定鈕 啟動溶劑幫浦鈕STENCILLIGHTSQUEEGEEFLIP 啟動前後刮刀座鈕 啟動照鋼板燈泡鈕BOARDLIGHTSQUEEGEEUP/DOWN 啟動刮刀組上下鈕 啟動照基板燈泡鈕WIPERPAPERVACUUMMOTOR 啟動真空馬達閘門鈕 啟動捲紙馬達鈕3.1.1下拉式功能表PrintAuto PrintManual Pri

4、ntPass ThroughDemo PrintSPC DataAuto Print自動印刷模式Manual Print手動印刷模式Pass Through將機器當做輸送帶Demo Print展示印刷模式SPC Data生產統計過程資料1.Auto Print自動印刷,機器會做印錫膏的動作Press SELECT to begin or(按SELECT開始自動印刷)Next to change Cycle Limits : No Limit 如下圖(按NEXT,以更換印刷片數:不限制)-Print Cycle Limits-Roll Trackball To Change ValuePrint

5、 Cycle Limit : 3 Press Exit When Done.-Print Cycle Limits-(印刷週期設定)Roll Trackball To Change Value(滾動軌跡球,以變更印刷片數)Print Cycle Limit : 3 (限定印刷週期: 3片)最高999片Press Exit When Done. (當設定完成後，按EXIT)PAUSE暫時停止印刷按鈕DISPENSERPENDING啟動加錫膏按鈕(必須在設定第2頁Enable Buttons內將Dispense打開為Yes)Press SELECT to raise squeegeeto allo

6、w move room when adding paste,or Press Next to continuePress SELECT to raise squeegee(按SELECT後刷刀會上昇，以便產生to allow move room when adding paste, 足夠空間,讓操作員加錫)or Press NEXT to continue(按NEXT後在原地,讓使操作員加錫) WIPERPENDING啟動一次擦拭鋼板按鈕 (必須在設定第2頁Enable Buttons內將Wiper打開為Yes)SPCDATA進入生產統計過程資料視窗按鈕2.Manual Print手動印刷,機

7、器會做印錫膏的動作3.Pass Through將機器當做輸送帶4. Demo Print展示印刷模式5.SPC Data生產統計過程資料Cycle Time 顯示機器在印刷時所花的時間,如有擦拭,時間必加長Idle Time 機器在印刷時所等待送板與出板時間Correction 顯示PCB板進入印刷位置與鋼板對位時X、Y、THETA軸修正值Shape Score 視覺系統辨別PCB板與鋼板Mark點亮度接受值顯示圖表Alignment 視覺系統辨別PCB板與鋼板Mark點X、Y修正補償顯示圖表2D Data 2D錫面覆蓋率檢查顯示圖表(需有此項功能才能顯示)3D Data 3D錫膏厚度檢查顯示

8、圖表(需有此項功能才能顯示)Temperature 顯示機器內的溫度(需有ECU溫溼度監控配備此項功能)Humidy 顯示機器內的濕度(需有ECU溫溼度監控配備此項功能)Save Info將生產統計過程資料存入磁片Clear All 將生產統計過程資料全部刪除Pan Left將放大過資料與圖形向左邊移動Pan Right 將放大過資料與圖形向右邊移動Zoom In將生產統計過程資料內(值及曲線)放大與縮小圖形Return toMain Menu回到主畫面按鈕S P COptions選擇預覽生產統計過程資料TeachTeach BoardTeach VisionDevice LayoutTeac

9、h IDTeach Custom BGATeach Offset MovesTeach Vision OffsetTeach Board做一片PCB板新程式Teach Vision做一片PCB新程式的Mark點Device Layout做2D檢查時,所要檢查零件Teach ID做辨識鋼板身分Teach Custom BGA編輯自行設計的BGA零件檔案Teach Offset Moves設定”印刷前的焊墊”與” 印刷後的焊墊”位置修正值Teach Vision Offset設定”視覺系統” 位置修正值1.Teach Board重做新程式About to begin TEACH operation

10、(開始設定操作)Press SELECT to teach a new board or(按SELECT,設定新基板)Press NEXT to continue on this board setup (按NEXT,繼續這基板的設定)按SELECT之後，出現下列訊息視窗：CAUTION, The machine must move toTEACH POSITION before teach can beginThe machine is now going to move.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine

11、 must move to(警告,設定開始前,機器必須移動到TEACH POSITION before teach can begin”設定位置”)The machine is now going to move. (機器即將移動)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)1.1 選擇Board Parameters 進入PCB參數設定Board ParametersHardware Required:BoardBoard Parameters基板(PCB)參數設定X size 228.600(PCB)基板X軸方向長度

12、Y size 406.400(PCB)基板Y軸方向寬度Thickness 1.570(PCB)基板厚度PCB板Y XEnter Board Dimensions into setup menu.Click on Y size to adjust Track Width.Press Done when finished.Enter Board Dimensions into setup menu. (輸入基板X、Y、厚度)Click on Y size to adjust Track Width. (點取Y方向尺寸，可調整軌道寬度)Press Done when finished. (當你做完上

13、述之步驟，按Done)點取X size，輸入基板寬度X size，按EXIT完成輸入，單位mm。例14.5cm = 145mm點取Y size輸入基板寬度Y size，按EXIT之後出現如下訊息視窗：About to adjust the TRACK WIDTH for the board.Press NEXT to Continue, or EXIT to Quit.About to adjust the TRACK WIDTH for the board. (調整基板的軌道寬度)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT

14、離開)按NEXT之後，出現下列訊息視窗：This is the current Track widthPress SELECT to fine adjust Press NEXT to acceptThis is the current Track width(這是目前的軌道寬度)Press SELECT to fine adjust (按SELECT微調軌道寬度)Press NEXT to accept(按NEXT，接受目前的軌道寬度)如果，你按SELECT之後，出現下列訊息視窗：Jog ACTIVETRK WIDTH 126.136Press NEXT to quit(調整完後，按EXIT

15、)Jog ACTIVE(這段訊息告訴你，用Jog方式去調整基板的軌道寬度)TRK WIDTH 126.136Press NEXT to quit(調整完後，按NEXT)點取Thickness，輸入基板厚度。使用游標卡尺測量。Press Done when finished. (當你做完上述之步驟，按Done)Stencil Dimensions鋼板尺寸設定參數Inner 660.400鋼板尺寸Enter stencil inner dimensionPress Done when finished.Enter stencil inner dimension(輸入內部鋼板尺寸)Press Don

16、e when finished. (當你做完上述之步驟，按Done)1.2 選擇Worknest 進入印刷工作平台參數設定WorknestHardware Required:Board ,Tactile , Vacuum ChucksPlease remove the stencil.Squeegee will now move back.Press SELECT when ready.Please remove the stencil. (請移開鋼板)Squeegee will now move back. (刮刀組現在將移動到後面)Press SELECT when ready. (準備好

17、後按SELECT)按NEXT之後，出現下列訊息：Now, adjust the vacuum rear and side platesIf you have a dedicated work holder, install it nowPress NEXT to Continue, or EXIT to Quit.Now, adjust the vacuum rear and (現在請調整後隔板和側(左右)隔板)side platesIf you have a dedicated work holder, (若有使用專用PCB板支撐架,請現在install it now 把他裝上)Press

18、NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)按NEXT之後，出現下列訊息：The Z TOWER is about to loadto tooling heightPress NEXT to Continue, or EXIT to Quit.The Z TOWER is about to load (Z軸上升到tooling height的位置)to tooling heightPress NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)你按NEXT之後，出現下列訊息：If

19、 you have X snuggers,adjust snugger pins now.Press NEXT to Continue, or EXIT to Quit.If you have X snuggers,adjust snugger pins now. (若有使用X方向夾板,請調整好)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)你按NEXT之後，出現下列訊息：CAUTION, The machine is now going toCenter itself for this size board. The Y

20、 AXIS is about to move forward.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine is now going to(注意,機器現在將移動到基板Center itself for this size board. 中心點)The Y AXIS is about to move forward. (Y軸即將移動到前面(基板中心點)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)Board Parameters基板(PCB)參數設定

21、Detent12.7PCB停於中心印刷位置值Load speed 432進板軌道皮帶轉速值(數字越大,轉速越快)Unload speed 381出板軌道皮帶轉速值(數字越大,轉速越快)Enter board loading parameters.Click on detent field to test.Press Done when finished.Enter board loading parameters. (輸入PCB進板參數)Click on detent field to test. (點取detent,測試PCB停於中心印刷位置值)Press Done when finishe

22、d. (按Done完成全部動作)1.3.選擇Teach Boardstops進入基板停止位置參數設定Teach BoardstopsHardware Required:, Stencil , TactileTeaching Boardstop-YPlace a board on the input track.Press SELECT to Continue.Place a board on the input track. (請將PCB板放到軌道輸入端)Press SELECT to Continue.(按SELECT 繼續)你按SELECT之後，出現開始做板邊視窗：Jog to the l

23、eading edge of the board.Stay 1/2 inch in from the rails. Press EXIT!Jog to the leading edge of the board. (請將十字游標移動到基板板邊Stay 1/2 inch in from the rails. Press EXIT! 中間位置後,按EXIT離開)此動作最主要是讓視覺系統內基板停止感應器,感應基板是否停止在印刷平台中心點位置 1.3.2 選擇Teach Boardstops-X進入PCB板停止到印刷平台中心點位置參數設定與PCB板和鋼板對位Mark點)Teaching Boardst

24、op-XIs the board centered correctly?Press SELECT to accept location.Press NEXT to-locate board.Press EXIT to abort process.Is the board centered correctly? (基板有無正確停止到印刷平台中心點位置)Press SELECT to accept location. (按SELECT接受目前位置 )Press NEXT to-locate board. (按NEXT調整基板正確停止到印刷平台中心點位置)Press EXIT to abort pr

25、ocess. (按EXIT 中止這一項步驟)你按NEXT之後，出現下列視窗：(將基板往前及往後送到印刷平台中心點位置)你按SELECT之後，出現下列訊息：Please insert a stencil. Press NEXT to continue!Please insert a stencil. (請放入鋼板)Press NEXT to continue! (按NEXT繼續)你按NEXT之後，出現下列訊息及視窗：Jog to any target on the board!Center the object. Press EXITJog to any target on the board!

26、 (請移動到基板上任一個對位Mark點)Center the object. Press EXIT(對正Mark中心點，按EXIT離開)你按EXIT之後，出現下列訊息及視窗：Jog to the same target on the stencil!Center the object. Press EXITJog to the same target on the stencil!(請移動到鋼板上任一個對位Mark點Center the object. Press EXIT，對正Mark中心點，但必須與基板上Mark點一樣,按EXIT離開)但如果X軸方向,超過軟體保護極限會出現下列訊息,可能需

27、重做對位點。-Warning Message-X AXIS SOFTWARE LIMIT WARNING!Press NEXT to Continue.1.3.3選擇Calc. Pre-Boardstops-X進入基板X方向停止位置參數設定Calc. Pre-Boardstop-XPre board stop position learnedPress SELECT to continuePress Done when finished.Pre board stop position learned (機器自行計算基板停止位置)Press SELECT to continue(按SELECT

28、繼續)Press Done when finished. (當你做完上述之步驟，按Done)1.4選擇Stencil進入測鋼板高度參數設定StencilHardware Required:Board , Stencil , Tactile , Please install a stencil now. The FRAME CLAMPS will activate whenyou press NEXT. Press NEXT to Continue, or EXIT to Quit.Please install a stencil now. (請現在放入鋼板)The FRAME CLAMPS w

29、ill activate when (按NEXT後,啟動鎖住鋼板)you press NEXT. Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)你按NEXT之後，出現下列訊息及視窗：The next step is to set STENCIL HEIGHT.Press NEXT to Continue, or EXIT to Quit.The next step is to set STENCIL HEIGHT. (然後進行測鋼板高度)Press NEXT to Continue, or EXIT to Quit. (按

30、NEXT繼續, 按EXIT離開)你按NEXT之後，出現下列訊息及視窗：CAUTION, The machine is now going tomove. STAY CLEAR.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine is now going to(警告,機器現在要移動,內部不能有move. STAY CLEAR.任何東西,需清除)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)你按NEXT之後，出現下列訊息及視窗：Press SELECT to

31、 JOG the sensor clear ofpaste or stecil apertures,or Press NEXT to CONTINUE.Press SELECT or NEXT to Continue.Press SELECT to JOG the sensor clear of(按SELECT移動偵測感應器,勿paste or stecil apertures,碰到鋼板上錫膏及鋼板上PAD孔)or Press NEXT to CONTINUE. (按NEXT馬上開始在本位置偵測鋼板高度)Press SELECT or NEXT to Continue. (按SELECT 或

32、NEXT繼續)你按SELECT之後，出現下列訊息及視窗：JOG ACTIVESQUEEGEE STROKE -112.050Press EXIT to quit.JOG ACTIVE(移動現在刮刀行程位置)SQUEEGEE STROKE -112.050Press EXIT to quit. (按EXIT離開)你按NEXT與EXIT之後，出現下列訊息及視窗：Locating the boardCAUTION：Auto height sensor in progress. Please wait (開始載入PCB,自動偵測鋼板高度)Stencil height FOUND.Press NEXT

33、to Continue.Stencil height FOUND. (完成偵測鋼板高度)Press NEXT to Continue. (按NEXT繼續下一步驟)1.5選擇Squeegee進入測刮刀高度與刮刀行程參數設定SqueegeeHardware Required:Squeegee Blades , Stencil , TactileThis Utility will set the SQUEEGEE height.Press NEXT to Continue, or EXIT to quit.This Utility will set the SQUEEGEE height.(使用測刮

34、刀高度)Press NEXT to Continue, or EXIT to quit. (按NEXT繼續, 按EXIT離開)按NEXT之後，出現下列訊息視窗：Please install a stencil now.The REAME CLAMPS will activate when you press NEXT.Press NEXT to Continue, or EXIT to quit.Please install a stencil now. (現在請放入鋼板)The REAME CLAMPS will activate when(按NEXT之後,啟動鋼板固定夾)you press

35、 NEXT. Press NEXT to Continue, or EXIT to quit. (按NEXT繼續, 按EXIT離開)按NEXT之後，出現下列訊息視窗：You must now install the squeegee blade.Press NEXT to Continue, or EXIT to quit.You must now install the squeegee blade. (你現在必須安裝刮刀)Press NEXT to Continue, or EXIT to quit. (按NEXT繼續, 按EXIT離開)按NEXT之後，出現下列訊息視窗：CAUTION,

36、The machine is now going toMove the Z TOWER and cyclethe SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to Quit. CAUTION, The machine is now going to(注意,機器的Z軸和刮刀上下將Move the Z TOWER and cycle會移動)the SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)按NEXT之後，出現下列訊息視窗

37、：Press SELECT to find Stencil Heightor NEXT to Bypass.Press NEXT to Continue, or EXIT to Quit. Press SELECT to find Stencil Height(按SELECT之後,再測一次鋼板高度or NEXT to Bypass. 按NEXT之後,不測鋼板高度)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)按NEXT之後，出現下列訊息視窗：Press SELECT to JOG the sensor clear ofpa

38、ste or stencil aperturesor press NEXT to CONTINUE.Press SELECT or NEXT to Continue. Press SELECT to JOG the sensor clear of(按SELECT移動偵測感應器,勿paste or stencil apertures碰到鋼板上錫膏及鋼板上PAD孔)or press NEXT to CONTINUE. (按NEXT馬上開始在本位置偵測刮刀高度)Press SELECT or NEXT to Continue. (按SELECT 或 NEXT繼續)你按SELECT之後，出現下列訊息及

39、視窗：JOG ACTIVESQUEEGEE STROKEPress EXIT to quit.JOG ACTIVE(移動現在刮刀行程位置)SQUEEGEE STROKE -112.050Press EXIT to quit. (按EXIT離開)你按NEXT與EXIT之後，出現下列訊息及視窗並開始測前後刮刀高度：Leveling front blade.Leveling rear blade.CAUTION：Auto height sensor in progress. Please wait (開始偵測刮刀高度。測前刮刀時,偵測感應器先下降碰到鋼板後,前刮刀下降,第一次先壓平刮刀,第二次自動偵

40、測前刮刀高度;測後刮刀時, 偵測感應器先下降碰到鋼板後,後刮刀下降,第一次先壓平刮刀,第二次自動偵測後刮刀高度)(測完刮刀高度後,開始設定刮刀行程)About to set SQUEEGEE STROKE.Press NEXT to Continue, or EXIT to quit.About to set SQUEEGEE STROKE. (開始設定刮刀行程)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)You must now jog to the Rear squeegee position. Press NEXT

41、 to Continue, or EXIT to quit.You must now jog to the Rear squeegee position. (你必須現在移動後刮刀位置)Press NEXT to Continue, or EXIT to quit. (按NEXT繼續, 按EXIT離開)JOG ACTIVESQUEEGEE STROKE -0.050Press EXIT to quit.(開始移動刮刀行程,完畢按EXIT離開)You must now jog to the front squeegee position. Press NEXT to Continue, or EX

42、IT to quit.You must now jog to the(你必須現在移動前刮刀位置)Rear squeegee position. Press NEXT to Continus, or EXIT to quit. (按NEXT繼續, 按EXIT離開)JOG ACTIVESQUEEGEE STROKE -0.050Press EXIT to quit.(開始移動刮刀行程,完畢按EXIT離開)1.6選擇Print Parameters進入印刷參數設定Print ParametersHardware Required:NoneSqueegee刮刀設定參數Total Force 5.4刮刀

43、向下壓力(刮刀長度X1.2)/2.2Down Stop 1.905刮刀碰到鋼板後再向下壓之距離Print Speed 25刮刀印刷行程之速度Enter squeegee printing parameters. (輸入刮刀印刷參數)(this affects front AND rear squeegees) (包含前後刮刀)Press Done when finished. (按Done完成)Board Parameters基板(PCB)參數設定Snap off 0.000PCB與鋼板之間隙(數字越大,間隙越大)Tooling TypeUnier. Dedicat.治具不使用治具使用治具En

44、ter Snapoff into setup menu. (輸入PCB與鋼板之間隙印刷參數)Set to zero for CONTACT printing. (接觸式印刷時，請設為”0”)Press Done when finished. (按Done完成)Slow Snop off慢速脫模參數設定Enabled NoYes不使用慢速脫模使用慢速脫模Down Delay 0.00脫離鋼板前延遲時間Distance 1.570慢速脫模之距離Speed 123456慢速脫模速度1脫模速度 5mil/s2脫模速度 10mil/s3脫模速度 15mil/s4脫模速度 20mil/s5脫模速度 25m

45、il/s6脫模速度 30mil/sEnter Slow snapoff parameters. (輸入慢速脫模參數)Press Done when finished. (按Done完成)TEACH is now complete. (程式現在設定完成)Press SELECT to save now, or(按SELECT現在存入檔案)Press NEXT to continue. (按NEXT繼續回主畫面按SELECT之後,出現存入檔案鍵盤畫面Press NEXT to continue. (按NEXT繼續,回主畫面)2. Teach Vision做一片PCB新程式的Mark點about t

46、o enter VISION TEACH operation.Press NEXT to Continue, or EXIT to Quit. about to enter VISION TEACH operation. (即將進入視覺系統設定操作)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)你按NEXT之後，出現下列訊息：Place a board on input track.Press NEXT to Continue, or EXIT to Quit. Place a board on input track.

47、(請將基板放到軌道輸入端)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續, 按EXIT離開)你按NEXT之後，出現下列訊息：Locating the boardADD or DELETE targets to change the(新增或刪除,所指Mark點位置或變更目current vision layout.前Mark點位置) Press EXIT when you are FINISHED. (當你已完成Teach vision按EXIT)ADD增加一個Mark點DELETE刪除一個Mark點VIEW辨視做完的PC板與鋼板Mark點ZO

48、OM IN將點選到位置放大與縮小你按ADD之後，出現下列訊息：Are you training synthetic fiducials?SELECT for YES, NEXT for NOAre you training synthetic fiducials? (你要選擇自設Mark點嗎？)SELECT for YES, NEXT for NO (按SELECT要；按NEXT不要)當你按SELECT後,需要輸入自設選擇Mark點長、寬、高、尺寸等.)當你按NEXT後,依影像視覺系統自行判別Mark點)按SELECT之後，出現下列視窗：當你按SELECT後,需要輸入自設選擇Mark點長、寬、

49、高、尺寸等.)ADD fiducial for the BOARD (增加Mark點到PCB上)Please SELECT the type of fiducial add. (請選擇Mark點型式)Press DONE when finished. (按DONE完成)按NEXT之後，出現下列視窗：Move the trackball pointer to the area(移動軌跡球指到PC板上Mark點位置後,where a target is to be Added and 按SELECT後，影像視覺系統會移動到你the press SELECT.所指的位置)按SELECT之後，出現下列

50、視窗：JOG to Board Target(移動到PC板上Mark點)Press NEXT for contrast ON, EXIT to finish. (按NEXT調整對比,按EXIT完成)按EXIT之後，出現下列視窗：Board Target 1(PC板上第一個Mark點)Adjusting : Position(調整搜尋範圍框大小、尺寸)X: 2.0258mm(搜尋範圍框X方向)Y: 2.0258mm(搜尋範圍框Y方向)Please Define the BOARD TARGET. (請定義基板上Mark點收尋範圍的位置與尺寸)Press NEXT to alternate between POSITION(按NEXT變換搜尋範圍框位置、尺adjust mode and SIZE adjust mode. 寸並調整)Press SELECT when DONE. (按SELECT完成)按SELECT完成後,會出現做第二個Mark點的訊息Press SELECT for Multi Model Teach orPress NEXT for Single Model Teach. 當做完第一個Mark點時,如果第二點與第一點形狀大小,都不一樣時按SELECT；如果第二點與第一點形狀大小,都一樣時按NEXT,此訊息主要是減少定義搜尋