BONDING制程简介精选文档

1、Westinghouse Digital Electronic,LCMA,bonding,製程介紹,issue,探討,A to A,WDE,LCMA,A to A,2,整条,Bonding,线全貌,unloader,clean,COG,OLB,PCB,PCBI,WDE,LCMA,A to A,3,Panel Load,吸取,Spacer,机台从,PP,BOX,中将,Panel,之间的,Spacer,吸走,WDE,LCMA,A to A,4,Panel Load,吸取,Panel,机台从,PP,BOX,中将,Panel,取出,WDE,LCMA,A to A,5,Panel Load,贴附,Pan

2、el ID,标签,自动,Bar-Code,机,台读取,Panel ID,并贴附,ID,标签,WDE,LCMA,A to A,6,Panel Clean Unit,将,IPA,溶液滴到,不织布上面清洁,Panel,端子部,清洁方向,WDE,LCMA,A to A,7,不織布,IPA,WDE,LCMA,A to A,8,COG,介紹,ACF,貼附,Pre-bond,Main-bond,WDE,LCMA,A to A,9,製程,Pre-bond,Main-bond,LCD panel,ACF Attach,COG,完成,IC,Teflon sheet,Head,上刀,WDE,LCMA,A to A,

3、10,製程基本原理,利用,ACF,異方性導電膠,作媒介，將,Panel,端子,與,Chip IC,藉由加熱加壓予以結合,使,ACF,之導電粒子破裂變形，構成導通電路,讓面板內的,TFT,能接收到,IC,輸出的正確信號及資,料,CF,TFT,Polarizer,Polarizer,Table,下刀部,Chip IC,ACF,熱壓頭,Teflon sheet,WDE,LCMA,A to A,11,製程相關材料,A,直接材料,ACF,異方性導電膠,Chip IC,B,間接材料,Teflon sheet,WDE,LCMA,A to A,12,COG IC,構造,input Bump,Input Bum

4、p,Output Bump,Dummy Bump,Align mark,Align mark,WDE,LCMA,A to A,13,ACF,材料規格,型號規格,AC-8405Z-23,供應商,Hitachi Chemical,重要尺寸,導電粒子大小,3,m,厚度,23,m,寬度,1.5 mm,WDE,LCMA,A to A,14,ACF,構造,ACF,厚度,23.0,2.0,Polyethylene,聚乙烯,Separator,離型膜,50,Conductive Particle,導電粒子,直徑,3,密度,50K,6000 pcs,2,Adhesive,膠,廠商,Hitachi Chemica

5、l,型號,AC-8405Z-23(FOR COG,寬度,1.5,0.1,8,15,WDE,LCMA,A to A,15,ACF,構造,中間塑膠部份當成緩,衝材可避免熱脹冷縮後,造成,Peeling,金無法直接,Coating,在塑膠,上,附著性不佳,因此先鍍,鎳再鍍金,鍍金的原因是,金有最佳的延展性以及活,性很小不會與其他材料起,化學反應，導電性好僅次,於銀與銅,WDE,LCMA,A to A,16,ACF,導電原理,Heat & Pressure,Conductive Particles,IC Bump,Adhesive,Panel Lead,WDE,LCMA,A to A,17,ACF,壓

6、著程度,ACF,粒子破裂適中，成小精,靈狀,Bump,開窗區上至少要,有五顆小精靈,ACF,粒子未破裂，成小圓,點狀：壓力不足,ACF,粒子過碎，成不規則狀,壓力過大,WDE,LCMA,A to A,18,相關部材,Telfon sheet,使用,telfon sheet,之目的,利用其表面光滑的特性,隔开,ACF,与热压头黏附,避免由于热压头高温造,成,Chip IC,温度急剧变化缩短产品寿命,PANEL,Teflon,Sheet,ACF,Head,BUMP,BUMP,IC,IC,WDE,LCMA,A to A,19,製程相關點檢,COG,偏移量,Production: MH0E5,X,方向

7、,Lx,Rx,10,m Y,方向,Ly,Ry,15,m,Production: MH0E5-L05,以,PANEL,的視窗中心為基準，量測視窗中心到,chip ic,對位,mark,中心的距,離,方向表示如右,Ly,Lx,X,Y,X,Y,WDE,LCMA,A to A,20,製程點檢,Head,平整度確認,目的,使用感壓紙確認,Head,與,Backup,的平整度,廠商,FUJIFILM,品名,Pressure measuring film,型號,LLLW,極超低壓,壓力量測範圍,0.5,2.5 MPa,使用條件,20,35,35,80%RH,平整度量測注意事項,1,感壓紙壓著時間不可過久,約

8、,0.2 sec,否則會影響平整度之判定,色度均相同,2,感壓紙拿取須小心，避免損傷影響平整度量測,3,感壓紙壓著確認時須將機台壓力調小去,Check,以避免壓力過大無法檢測出刀頭平整度,不佳,WDE,LCMA,A to A,21,感壓紙,Teflon,Sheet,同一條壓痕不得超過二個,LEVEL,否則判定為平整度不佳須修機調整,L1,L2,L3,L4,L5,製程點檢,Head,平整度確認,WDE,LCMA,A to A,22,檢查圖示導電粒子壓痕狀態,檢查,BUMP,壓著位置處，導電粒子滲入,LEAD,之凹凸痕狀態,良品,壓痕明顯,製程點檢,COG,壓痕,WDE,LCMA,A to A,2

9、3,導電粒子,壓著,破裂狀況,檢查下圖中單顆,IC,之左及右位置，其,ACF,導電粒子破裂之狀況,粒子破裂狀態，需有,5,個以上呈現小精靈狀,製程點檢,COG,導電粒子,WDE,LCMA,A to A,24,製程主要異常,PANEL,磨邊量過大,WOA wire,斷,Chip IC,Chip IC,誤配,缺,bump/bump,傷,異物,Chip IC,沾黏在,chip tray,上,G-line,弱線,WDE,LCMA,A to A,25,製程主要異常,COG,位移,ACF Attach NG,反摺,過短,貼附位置錯誤,Machine,Bonding,不良,壓痕異常,拋料,pick up m

10、iss/prebond head,撞,CF,COG Mura,WDE,LCMA,A to A,26,COG,異常圖片,1,磨邊量過大,WDE,LCMA,A to A,27,COG,異常圖片,2. WOA wire,斷,畫面異常,WDE,LCMA,A to A,28,COG,異常圖片,3. IC,損傷,1,WDE,LCMA,A to A,29,COG,異常圖片,3. IC,損傷,2,WDE,LCMA,A to A,30,COG,異常圖片,4,壓著異物,short,WDE,LCMA,A to A,31,COG,異常圖片,5.COG,位移,1,WDE,LCMA,A to A,32,COG,異常圖片,

11、5.COG,位移,2,WDE,LCMA,A to A,33,COG,異常圖片,6.ACF Attach NG(1,ACF attach,上偏,導致,ACF,未涵蓋處壓著不良,ACF attach,上偏,導致,ACF,未涵蓋處壓著不良,WDE,LCMA,A to A,34,COG,異常圖片,6.ACF Attach NG(2,ACF attach,反褶,過短,導致,ACF,未涵蓋處無壓痕,ACF attach,反褶,過短,導致,ACF,未涵蓋處無壓痕,WDE,LCMA,A to A,35,COG,異常圖片,7.COG,壓痕異常,1,WDE,LCMA,A to A,36,COG,異常圖片,7.CO

12、G,壓痕異常,2,WDE,LCMA,A to A,37,製程主要異常,COG,位移,以顯微鏡觀察位移狀態,純位移的情況,1,調整,Prebond,的位置,OK,NG,WDE,LCMA,A to A,38,COG Mura,COG stage,高度異常所造成之,mura,Westinghouse Digital Electronic,LCMA,OLB,製程介紹,A to A,WDE,LCMA,A to A,40,OLB,介紹,ACF,貼附,Pre-bond,Main-bond,WDE,LCMA,A to A,41,製程,Pre-bond,Main-bond,LCD panel,ACF Attac

13、h,OLB,完成,Teflon sheet,Silicone Rubber,Head,上刀,WDE,LCMA,A to A,42,製程基本原理,利用,ACF,異方性導電膠,作媒介，將,Panel,端子,與,TAB,端子藉由加熱加壓予以結合,使,ACF,之導電粒子破裂變形，構成導通電路,讓面板內的,TFT,能接收到,TAB IC,輸出的正確信,號及資料,熱壓頭,下刀部,TAB,ACF,CF,TFT,Polarizer,Polarizer,Table,Silicon rubber,Teflon sheet,WDE,LCMA,A to A,43,製程相關材料,A,直接材料,ACF,異方性導電膠,TA

14、B/COF,B,間接材料,Silicon rubber,Teflon sheet,WDE,LCMA,A to A,44,ACF,構造,ACF,厚度,16.0,2.0,Polyethylene,聚乙烯,Separator,離型膜,50,Conductive Particle,導電粒子,直徑,2,4,密度,11000,1000 pcs,2,Adhesive,膠,廠商,Hitachi Chemical,型號,AC-4255U1-16,寬度,1.2,0.1,WDE,LCMA,A to A,45,製程相關點檢,端子偏移量,Source: D,1/2 Panel,端子寬度,w,Gate: D,1/2 Pa

15、nel,端子寬度,w,拉力測試,P,400g/cm,COF (L )cm,COF,端子,Panel,端子,D,W,TAB,L,Panel,WDE,LCMA,A to A,46,製程相關點檢,ACF,導電粒子破裂狀況檢查,ACF,粒子未破裂,成小圆点状：压,力不足,ACF,粒,子,破,裂,适中,成小精,灵状,ACF,粒,子,过,碎,成,不,规,则,状,压力过大,WDE,LCMA,A to A,47,製程相關點檢,ACF,导电粒子破裂数量检查,下图中单颗,TAB/COF,之左及右开窗区位置导电粒子至少破裂,5,颗,以上,毎一,TAB/COF lead,导电粒子至少破裂,20,颗以上,PANEL,T

16、AB/COF,左,右,WDE,LCMA,A to A,48,製程相關點檢,OLB,压痕宽度检测,使用显微镜将,OLB Bonding,区调整成压痕可见之状态,确认,Metal,端子区是否有明显凹凸痕,压痕,存在,ACF,导,电,粒,子破裂完全,凹,凸,痕,明,显及均一性,判定,OK,WDE,LCMA,A to A,49,宽度,A,之量测值，即为,OLB,压着宽度，规格为,A,0.8 mm,宽度,A,量测起点,位置最高之压痕,宽度,A,量测终点,位置最低之压痕,A,WDE,LCMA,A to A,50,製程主要異常,WDE,LCMA,A to A,51,製程主要異常,Line defect,點燈

17、確認,Line defect,狀態,1 lead or 2 lead,以上,有幾條線,使用放大鏡,取得,Line defect,位置,使用顯微鏡尋找,Panel,座標,Open,Short,check Bonding,區是否有異物,WDE,LCMA,A to A,52,Line defect,異常圖片,1,線狀異物,2,金屬異物,WDE,LCMA,A to A,53,Line defect,異常圖片,1,黑色異物,2.TAB,屑,WDE,LCMA,A to A,54,如何判定压着异物位置,假设异物在,ACF,之上,如下图所示，因会压到,ACF,导电粒,子,因此从,panel,背面可以看到,AC

18、F,粒子亮点,反之则看不,到,異,物,ACF,粒子亮点,panel,ACF,COF,WDE,LCMA,A to A,55,製程主要異常,OLB,位移,以小眼睛或顯微鏡觀察位移狀態,內縮或外擴,1,確認部材或機台的差異性,2,調整本壓頭下降的速度,3,調整溫度,純位移的情況,1,調整,Prebond,的位置,WDE,LCMA,A to A,56,OLB,無位移,WDE,LCMA,A to A,57,OLB,位移異常圖片,完全位移,WDE,LCMA,A to A,58,OLB,位移異常圖片,內縮,WDE,LCMA,A to A,59,OLB,位移異常圖片,外擴,WDE,LCMA,A to A,60

19、,PCB,制程简介,WDE,LCMA,A to A,61,PCB,製程,ACF,貼附,Main-bond,WDE,LCMA,A to A,62,Back up,PCB,製程原理,Main Bond,Silicone rubber,Main bond Head,WDE,LCMA,A to A,63,相關部材,ACF,構造,ACF,厚度,35.0,2.0,Polyethylene,聚乙烯,Separator,離型膜,75,Conductive Particle,導電粒子,直徑,4,1,密度,5K,pcs,2,Adhesive,膠,廠商,Hitachi Chemical,型號,AC-9845RS-3

20、5,寬度,1.5,0.1mm,WDE,LCMA,A to A,64,相關部材,ACF,構造,導電粒子的大小及密度會影響到,COF,的,LEAD PITCH,設計,ACF,膠材會依據,COF,的製程及材料不同而選用不同的膠材，會影響膠的流動性及拉力值,導電粒子構造,PCB,之材質較軟,鍍,金,故直接以,Ni,粒子,崁入使,lead,導通，金,太軟了無法嵌入,Ni particle,WDE,LCMA,A to A,65,相關部材,ACF,原理,膠材軟化流動充填於,Lead,間隙,溫度、壓力、時間,ACF,粒子受壓變形,使上下兩端導通,電流行進方向,Z,方向高度導電性,X-Y,方向不導通,Bondi

21、ng,WDE,LCMA,A to A,66,製程點檢,PCB,自主檢查,目的：篩檢不良品，防止流入後續工程,項目,頻率,1,PANEL外觀檢查,1,片,160pcs,2,Head 平整度,1次/每班及品種更換,3,製程參數,1次/每班或品種更換,4,拉力測試,1片/week及品種更換,項目,頻率,1,偏移量檢查,1,片,160pcs,2,壓痕檢查,1,片,160pcs,作業後點檢,作業前點檢,WDE,LCMA,A to A,67,製程點檢,拉力測試,拉力,方式,垂直往上拉,至拉斷為止,速度,5080 mm/min,規格,400gf/cm,型號,HF-10(10kg,治具,PCB,夾具,治具,WDE,LCMA,A to A,68,管制限, SPEC,COF lead,中心偏移量,S,管制限,Source,15 m,Gate,20 m,SPEC,