COF-Presentation-(I)--V5.ppt

1、,Topic 1: LCD Module Trend Topic 2: COF Advantages Topic 3: Low Cost Solutions Topic 4: COF Material Topic 5: ILB and OLB for COF Topic 6: Reliability Topic 7: COF Capability in Kingtron,Contents,從日本、韓國對LCD Module的觀點來探討STN及TFT模組的發展趨勢。,Topic 1 : LCD Module Trend,The Comparison of Different Driver IC

2、Packages,LCD Driver IC Module Milestones,TCP Total thickness: max.1000 um Inner Lead Pitch: min. 45 um Flying leads with device hole Flex resin for bending slit Conventional alignment method Application: driver IC TFT,COF-TAB Total thickness: max.800 um Inner Lead Pitch: min. 35 um No flying leads w

3、ithout device hole Flexible thin film without bending slit New alignment method Application: driver IC TFT,COF module Total thickness: max.800 um Inner Lead Pitch: min. 35 um COF-TAB technology Passive components integrated Application: driver IC STN,1999,2000,2001,2002,The Driver IC Package Trend o

4、f LCD Module,Bending slit,No bending slit,TFT-LCD,STN-LCD,Driving force: Color/Larger Panel/High resolution/Light&Thin/Low cost,Driving force: Low cost/Fine pitch,Now: Flex-TAB,Now: COG,Future: COF,Advantages: (1) Fine line capability (2) Light&Thin (3) Simplify assembly procedure (4) Low cost,Desig

5、n rule,200um pitch,80um pitch,40um pitch,Main color LCD,Driver IC with TAB,Back light,Sub B/W LCD,Double side COF,Control IC,Driver IC(2chips) with TAB,Control IC,1 chip,Finer pitch CSP Flip Chip,Rigid board (4 layer),Thinner and Lighter Rigid board COF,Unification of main and sub LCDs Common back l

6、ight Reducing SMT area,2002 2Q,2001 3Q,STN Color LCD Current,200um pitch COF 80um pitch COF 40um pitch,Replace rigid board Thinner and Lighter,Latest Needs for STN color LCD Module,Latest Needs for TFT color LCD Module,TFT color LCD Current,Control IC,Power supply IC,Driver IC,Finer pitch CSP Flip C

7、hip,Multicolored 25665,000 colors Needs controller IC,Driver IC,Control IC,Power supply IC,Narrower flame Driver IC on Flex board COG COF,2002 2Q,Design rule,150um pitch,80um pitch,40um pitch,* Narrower flame Increasing indication area,* More complicated pattern on glass Lower yield,COG COF,COG 優缺點比

8、較,缺點: 1. Fine pitch (40um)無法達到 晶片需微縮以降低成本，無法跟上IC趨勢。 RSDS設計可達省電目的，但需細線製程。 2. Reliability問題 只能使用ACF，無法使用Eutectic bonding。 fine pitch時，接觸的導電粒子數目少且微細的導電粒子製程能力受限，成本高。 ITO導電層電阻大及ACF接點導電性差。 3. 晶片尺寸佔用面板面積 因應整合晶片趨勢，達到降低成本目 的，晶片尺寸會變大，若使用fine line製程縮小晶片尺寸，則又面臨fine pitch及reliability問題。 4. Known Good Die問題 若應用在大

9、尺寸面板，KGD問題變大。 5. 線路變更設計問題 牽涉到面板光罩變更，減少面板設計的彈性。 6. 玻璃平坦性問題 當玻璃厚度逐漸降低時，維持玻璃在高溫高壓下組裝的平坦性困難。,優點: 1. IC底下可自由設計線路及array bump型式 相較於TAB具有更高的設計彈性。 2. 使用FPC，tape成本較低廉 3. 與面板一起測試，可省IC/Tape/Assembly分開測試的成本 4. ILB及OLB的部份均可自行組裝，技術來源相同，可節省製造成本。 5. 較TAB具有細線路能力及tape不易變形，但細線能力則較COF低 6. 節省Tape及封裝的lead time,SMT元件,驅動IC,

10、FPC軟性電路板,TAB Eutectic bonding,TAB + FPC soldering,COF SMT assembly,FPC SMT assembly,FPC + COF soldering,COF Eutectic (or ACF) bonding,TAB ACF bonding,COF ACF bonding,COG ACF bonding,COF + PCB soldering (or ACF bonding),Substrate : TAB COF FPC PCB _ Finish Plating : Tin Tin or Ni/Au Solder or Ni/Au S

11、older or Ni/Au ILB : Eutectic Eutectic or ACF - - OLB : soldering ACF (soldering) Soldering (ACF) Soldering (ACF) SMT assembly : - Solder paste printing Solder paste printing Solder paste printing Flexibility : Need slit hole Bending no limit Curve bending - Multi-layers : One layer One or Two layer

12、 24 layer Multi-layers Flying Lead : OK - OK - Fine pitch : 45um 30um 150200um 150200um Format : Reel Reel or Piece Piece Piece,The Properties Comparison of various Substrates,Color TFT LCD Module - COF sample spec.,2002.APR.1,1.Tape: 48SW,10孔,單面,鍍錫 2.ILB pitch: 38/40/45/50/55 um (COG+COF) 3.SMT com

13、ponent: 有24個及10個兩種 4.Stiffener貼付:需要,36mm,29mm,10mm,20mm,5.COF ILB之後需測試 (probe card) 6.Component SMT: 印錫膏 (Stencil) 7.成型模具:將捲帶衝成片狀 (punch tool) 以上為可能發生的Tooling charge,比較COG、COF及TCP的結構差異性，並介紹COF的LCD模組優點。,Topic 2 : COF Advantages,片狀,捲帶,Eutectic bonding,ACF bonding,連接LCD面板 (Output side),驅動IC (LSI),連接PCB

14、或連接器 (Input side),被動元件(Passive),二層Tape (2-layer : PI 38um, Cu 8um),COF Structure,TFT LCD,STN LCD,Advantages of COF (Structure and Properties),Flex-TCP,COF,Adhesive (12 um),Cu (18um),PI (75 um),1. Device hole & Fingered leads,2. 18 um copper & 75 um polyimide,3. Laminated structure with adhesive,Lead

15、s are floating in the air.,1. No device hole No custom tooling needed Short development cycle time Thinner & Finer patterning pitch （Patterning under die & stagger connection）,2. Flexible by thin film 8 um Copper, 38 um Polyimide Fine pitch patterning No need of flex slit,3. Adhesive free Higher dim

16、ensional stability due to no stress by lamination,Cu (8 um),PI (38 um),Leads are supported by PI,No flex slit needed.,Die,Film,COF Advantages,Topic 3 : Low Cost Solutions,根據LCD Module的發展趨勢所衍生出的製程問題，尋找新的低成本解決方案。,IC Design for COF,COF Stagger bonding,COF Patterning under die,TCP Flying Lead,Min. pitch

17、 = 45um,Min. pitch = 30um,No limit for COF tape pattern design and easy to make fine pitch connection,5%,Square LSI COF,60 m,40 m,Slim LSI TAB,Pad Pitch,37%,Increase die/wafer by fining pad pitch and change to square,33%,Die Cost Reduction (simulation),LCD Module 降低成本的對策,(1),1. 設計: 採用高良率及穩定的通用製程(減少修

18、補)；減少材料耗用,1. Gate IC與Source IC同側、COG+COF 面板窄框化、省Tape成本(節省一塊FPCB),2. 晶片製程微縮 : 1 SlimSquare : 增加IC產出數量(5%) 2 Peripheral padArray pad : 減少tape面積 晶片功能整合 : 1 整合Power IC,RAM,Control IC,Capacitor等周邊元件(節省總體IC的總成本)-晶片變大, I/O變多,3. Tape : 1 以COF取代TCP,FPC,PCB : 細線路節省Tape使用面積及分段組裝的費用 2 使用便宜的材料及尋找便宜的Source,4. Ass

19、embly : 1 ILB : (1) Sn/Au Eutectic 取代 ACF (2) Reel 取代 Piece 2 OLB : (1) 保持soldering , 減少ACF的使用量 : 使用Hot bar assembly 3 SMT component : 將SMT component加入於COF tape中,2. 元件: SoC及fine line/fine pitch,3. 材料: 減少面積及多利用細線能力,4. 組裝: 減少ACF使用面積及組裝次數,5. 模具: 整合上下游製程，減少開模,(2),Cost down Solutions,LCD Module Structure

20、 2 chips of driver,COG+COG,COF+COF,COG+COF,Need Substrate Technology: TAB、COF、FPC、PCB substrate Need ILB Technology: ACF、Eutectic bonding Need OLB Technology: ACF (on glass and board)、SMT assembly,FPC SMT assembly,FPC ACF bonding,COG ACF bonding,COF SMT assembly,COF ACF bonding (LCD),COF ACF bonding

21、 (IC),COF SMT assembly,COF Sn/Au bonding,COF ACF bonding (LCD),COG ACF bonding,COF+PCB (ACF bonding or insert to connector),COF+PCB (ACF bonding or insert to connector),FPC+PCB (Soldering or insert to connector),設計重點: 1. No alignment hole 能夠不設計alignment hole最佳(利用Tape透光的特性，設計無實孔的孔環)，可省模具費(NT20萬)及縮短交期

22、(1014天) 2. Tin Plating instead of Gold plating 鍍錫為化學錫，不需拉導線及切導線，易於線路設計縮小tape面積，可省鍍金成本及二次衝孔的模具費用並可縮短交期。 若考慮面板及PCB端需鍍金及信賴性考量而無法避免二次衝孔，建議使用選擇性鍍金鍍錫板 3. Eutectic bonding for ILB 採用錫金共晶的方式，產品信賴度高且省去使用昂貴的ACF材料成本，尤其對於大面積的SoC 晶片，效果驚人。 4. Fine line/Fine pitch/Flexible design 多利用COF的製程能力特性，將線路設計於4060um pitch之間

23、以節省tape面積。 除非必要，否則避免使用雙面的COF tape或將COF的Input端開天窗，將大幅增加tape成本，儘量利用可撓的特性將tape局部反折成類似雙面COF使用。,Low Cost and Short Lead time,5. SoC Solution SoC不僅可節省元件的總成本、因元件個數減少，也可節省 tape面積及組裝費用。 * 一般tape是以面積(或孔數)計價，組裝則以顆數計價，測試則依時間計。 6. No complicate assembly design 目前的產業結構及能力尚無法做複雜的組裝(如兩顆COF eutectic ILB、Reel SMT ass

24、embly、Chip的兩側做SMT assembly等) 適當地利用COG及COF組合,Alignment hole,Flexible to 2-layer COF,Topic 4 : COF Material,介紹目前主流的Sputtering(濺鍍)方式及Casting(塗佈)方式。,Die,Substrate,ACF bonding,Eutectic bonding,ACF & Sn-Au COF ILB Comparison,1. 2000年市場主流為 PI casting COF,2. 2002年後 Cu sputtering COF 將大幅增加市場佔有率 Higher resolu

25、tion trend of LCD panel Finer pitch of driver IC (typical below 40 um) More sputtering COF makers joined Lower IC bonding cost Higher HT/HH reliability,COF Material 市場推定,Comparison of 2-layer tape (I),Comparison of 2-layer tape (II),- ESPANEX superior to peel strength,Comparison of 2-layer tape (III

26、),- HHBT: SPERFLEX will be same to others,Topic 5 : ILB and OLB for COF,ILB 及 OLB 的組裝方式及製程優缺點介紹，並提出合適的建議方案,ACF connection & Sn-Au joint for ILB,1.ACF connection:,Bond tool 500oC,Bond tool 250oC,Stage 100200oC,Stage 450oC,TCP,COF,1. Tape 熱脹縮問題 (PI之CTE、Tg 物性?),2. ILB Eutectic bonding問題 (Sn/Au共熔點? bond

27、 tool&Stage 溫度、時間、out-gassing?),2.Sn-Au joint:,Die,Substrate,180oC Pressure,3. Tape 熱脹縮問題 (PI之CTE、Tg 物性?),1. Particle size& reliability 2. Fine pitch capability,The bond tool structure for COF ILB,Topic 6 : Reliability,COF Qualification Reliability Test Flow,Topic 7 : COF Capability,COF 的檢視重點,市場競爭力重

28、點,1.Pattern - (1) Min. Pitch (2) Etching Factor (3) Dimension Tolerance Control 2.Finish - Solderability: (1) ILB (2) OLB - Solder Resist: (1) Position Tolerance 3.Cost - (1) Unit price (2) Tooling (3) ECN 4.Lead Time - Much Shorter Much Better 5.Customer Relationship & Service,OLB,Fine line,S/R,The

29、 Key Items of COF Capability,1.Roughness(Front/Side),2.Tin whisker/Abnormal,3.Lead tip shape,1.Min. pitch/Min. width,2.Position accuracy,3.Linearity,4.Surface impedance,4.Peeling force,5.Solder resist bleeding and Concave,6.SR printing accuracy,crystallization(side wall),Min. Pitch: Line Width/Line

30、Space/Etch Factor,T,H,B,Line Space (L/S ),Line Width (L/W),PI film,Cu,Etch Factor = 2H/(B-T),H,T,B,1. Min. Pitch = 30 m (for copper = 8 m) (Line Width = 15 m，Line Space = 15 m) 2. Min. Line Width = 5 m (Line Top) 3. Min. Line Space = 15 m (On PI film) 4. Etching Factor 2.5,COF tape for Car TV 38um p

31、itch,Key Items: 1 Total Pitch Tolerance (1,2,3) 2 Inner lead pitch capability (4) 3 Solder Resist position and bleeding control (5) 4 Tin plating tie coat treatment (6) 5 Sprocket hole pitch and deformation (7) 6 Yield rate improvement,2,1,3,4,5,6,7,Inner Lead and Solder Resist-(38um pitch),Inner le

32、ad (Front side),SR bleeding,Product Overview,Inner lead (Back side),PI film(),After Etching,A (12 second),PI film Tie coat remove : Side Wall Roughness : Front Side Roughness : Pattern Dimension Stability : ,C,B,A,A (20 second),C (12 second),Tie Coat Treatment - Evaluation,Chemical,Samples Book (1),

33、40um COF (Eutectic) - C company (Evaluation),38um COF (Eutectic) - E company (Car TV),Inkjet printer head - B company,60um TCP - E company (E-book),50um COF (ACF) - A company (Color mobile phone),Samples Book (2),38um COF (Eutectic) - E company (Car TV),50um COF (ACF) - A company (Color mobile phone),45um COF (Eutectic) - R company (Color OLED),60um COF (Eutectic) - U c