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《集成平面光波导器件》课程Chapter
13:
Optical
Modulators
Optical
Modulation
光调制就是将一个携带信息的信号叠加到载波光波上,完成这一过程的器件称为调制器。
直接调制(内调制):把承载信息的电信号作为驱动电流直接施加在激光器上即以调制信号去改变激光器的振荡参数,从而改变激光输出特性以实现调制
2
Direct/External
Modulation•Direct
Modulation
of
Laser
DiodeBias
+
DATA驱动电流
LD或LED•
Laser
Carrier
induced
(chirp)Temperature
variation
due
to
carrier
modulationExternal
Modulation
of
Laser
Diode
BiasLaser
Bias
+
DATAModulator《集成平面光波导器件》课程Issues
--
Additional
ComponentC
直流偏置
Direct
Modulation半导体激光器调制原理以及输出光功率与调制信号的关系曲线。为了获得线性调制,使工作点处于输出特性曲线的直线部分,必须在加调制信号电流的同时加一适当的偏置电流Ib,这样就可以使输出的光信号不失真。
t输出光强信号LD输出功率
L~
调制信号(a)直流偏置
t调制信号
(b)半导体激光器调制
(a)
电原理图;(b)
调制特性曲线
4PoutDirect
Modulation
PouttIOIOIbID
t(b)t(a)(a)
LED数字调制特性(b)
加Ib后LD数字调制特性5
External
Modulation
外调制:通过光调制器,将携带信息的电信号与输入光调制器的连续光载波相作用。包括:幅度调制、频率调制、相位调制、偏振调制。
电信号激光器光载波调制光信号输出外调制器
外调制方式6Direct/External
Modulation
信息
电信号激光器
输出调制光
连续光信号外调制器激光器
输出调制光信息电信号LD
输出连续光信息电信号01
010信息电信号输出调制光波输出调制光波01
0
1
0(a)
直接调制(b)外调制直接调制:电路简单,容易实现,高速率时输出光光谱变宽,易受光纤色散影响;外调制:适合高速率光纤传输系统7Optical
Modulator
光调制器---外调制方式中采用,把激光的产生和调制分开,
可避免对光源直接调制产生线性调频的限制。调制器能使载波光波的参数随外加信号变化而变化,这些参数包括光波的振幅、位相、频率、偏振等。承载信息的调制光波在光纤中传输,再由光探测器系统解调,然后检测出所需要的信息。与光开关的区别:如果一个器件的主要作用是通过暂时改变光波的某一特性将信息加到光波上去,则为调制器;而光开关则是改变光线的空间线路或控制其通断。8
Optical
Modulator
1.
调制带宽f3dB:
光调制器的频域响应类似与低通滤波器,其
带宽对应与光调器的响应度减小到一半时的微波频率。
2.
消光比
3.
插入损耗:
表征光经过调制器时光功率的损失,包
括耦合损耗和传速损耗。
4.
能耗:
定义为单位比特所需消耗的能量。
半波电压光纤通信系统对调制器的要求高的调制速率
宽的调制带宽
低的半波电压
高的消光比低的插入损耗《集成平面光波导器件》课程
Optical
ModulatorElectro-Optic
Modulator
(LiNbO3)
Semiconductor
based
Modulator(EA,
Si
Modulator)
Others(Polymer,
Slot
Waveguide,
PhCs,
Graphene)《集成平面光波导器件》课程Electro-Optic
Modulation《集成平面光波导器件》课程Pockels
Effect/Kerr
Effect《集成平面光波导器件》课程EO
Phase
Modulator《集成平面光波导器件》课程EO
Phase
Modulator《集成平面光波导器件》课程EO
Phase
Modulator《集成平面光波导器件》课程EO
Intensity
Modulator《集成平面光波导器件》课程《集成平面光波导器件》课程Optical
Modulator-EOM-Z型LiNbO3调制器是目前光通信中实用的电光调制器输入光信号在C处被分为相等的两束,分别进入两波导传输。波导的折射率随外加电压大小而变化,导致两路光信号到达D时的相位延迟不同。若两束光光程差是半波长的偶数倍,两束光相干加强;若是半波长的奇数倍,则两束光相干抵消,输出很小。因此,控制外加电压,就能实现光调制。17用LN晶体制作的M-Z调制器n
E
n
2
2
n3
VL
0
0d
T
cos
(
Optical
Modulator-EO波导臂上产生的折射率变化1
3
1
3
V2
2
d
n
对于对称型M-Z干涉仪,L1=L2=L,两臂的相位差为
(2
n)L
令
=
时的电压为半波电压
V
V
0d2n3
L)2
V
V2V
18Optical
Modulator-EO
电光调制的透过率(调制器被偏置在V
/2点上)
透射光强t
VV
/2V
调制电压半波电压V
是把调制器从最小光
强转换到最大光强所需的电压《集成平面光波导器件》课程注意:在调制的区域要求器件的线性度高。若调制器工作在非线性部分,则调制光将发生畸变。Optical
Modulator-EO《集成平面光波导器件》课程Optical
Modulator-EOData
From:
《集成平面光波导器件》课程Optical
Modulator-EO
Techniques
for
Down
Sizing-
reduction
the
driving
voltage
Ridge
Waveguideinstead
of
Diffused
Waveguide《集成平面光波导器件》课程Optical
Modulator-EO
Techniques
for
Down
Sizing-
reduction
the
driving
voltage《集成平面光波导器件》课程Optical
Modulator-EO《集成平面光波导器件》课程Optical
Modulator-EOFrequency
Response
of
an
Over-40
Gbps
Modulator
《集成平面光波导器件》课程Optical
Modulator-EO《集成平面光波导器件》课程Optical
Modulator-EO《集成平面光波导器件》课程Optical
Modulator-EO《集成平面光波导器件》课程Optical
intensityOptical
modulation-Semiconductor
ElectricaldriverModulated
opticalintensityt
OpticalmodulatorttElectroabsorption
Quantum
Confined
Stark
effect
Franz-Keldysh
effect
Electrorefraction
Free
carrier
concentration
variations
in
silicon
AccumulationInjectionDepletion《集成平面光波导器件》课程29Optical
modulation-Semiconductor
•
基于半导体材料的调制器的工作本质是通过
电信号改变介质的复折射率。
•介质的复折射率为:
~
n
jnn
r
i基于改变折射率nr的调
制器称为
折射率型光调制器基于改变折射率需不
虚部的调制器称为
电吸收型调制器
《集成平面光波导器件》课程Modulator-Electro-absorption《集成平面光波导器件》课程Franz-Keldysh
effect(弗兰茨-凯第希效应)Energy
band
diagram
of
a
semiconductor
exhibiting
the
Franz-Keldysh
effectin
the
presence
of
a
strong
electric
field.The
parameter
x
represents
the
distance
from
the
surface
of
thesemiconductor,
and
E
is
the
electron
energy.
Ec
and
Ev
are
the
conduction
andvalence
and
edges,
respectively.
《集成平面光波导器件》课程Franz-Keldysh
effectCurve
A
is
the
zero
field
absorption
curve
forGaAs.(Circular
dots
represent
experimentaldata
points
for
n-type
material
with
carrierconcentration
n=3x1016cm-3.
For
the
squaredot
n=5.3x1016cm-3)
Curve
B
shows
theshifted
absorption
edge
for
a
field
of1.3x105V/cm.A
very
effective
electro-absorption
modulatorcan
be
made
for
light
of
slightly
less
thanbandgap
wavelength.In
the
presence
of
a
strong
electric
field,
theabsorption
edge
of
a
semiconductor
is
shifted
tolonger
wavelengthvery
large
changes
in
absorption
of
wavelengthnear
the
band
edge
can
be
produced
byapplication
of
an
electric
field《集成平面光波导器件》课程Franz-Keldysh
shift
of
the
absorption
edge
of
GaAs.Franz-Keldysh
effectAluminum
concentration
b
in
the
waveguide
should
be
chosen
so
that
the
absorptionedge
wavelength
is
just
slightly
shorter
than
the
guided
wavelength,
i.e.,
the
guide
istransparent
with
V=0.
Carrier
concentrations
should
be
chosen
so
thatN3>>N2,
thus,
a
relatively
large
electric
field
is
produced
in
the
guide
when
V
isapplied.
《集成平面光波导器件》课程Franz-Keldysh
effectDevice
Structures
《集成平面光波导器件》课程Franz-Keldysh
effect《集成平面光波导器件》课程Quantum
Confined
Stark
effect(量子限制Stark效应)《集成平面光波导器件》课程Quantum
Confined
Stark
effect《集成平面光波导器件》课程Optical
Modulator-EA
Extinction
Ratio:
Insertion
Loss:
Modulation
Efficiency:《集成平面光波导器件》课程Optical
Modulator-EA
Reported
III-V
EAM
with
a
bandwdith
over
30GHz
after
2004《集成平面光波导器件》课程Optical
Modulator-III-V
EA集总电极行波电极UCSB.
Y.B
Tang,
40GbpsUCSB.
Y.B
Tang,
50Gbps在高频时,微波信号的波长和电极的长度可以比拟,因此需要将电极看成是传输线。利用行波电极,既能使器件的内部等效RC常数减小,也能使光波和微波信号的速度匹配从而提高调制器的带宽。
《集成平面光波导器件》课程Optical
Modulator-III-V
MZM
Reported
III-V
MZM
with
a
bandwdith
over
30GHz
after
2004
capacitively
loaded
TW
electrode(High
impedance,
low
RF
loss,
velocity
match)
《集成平面光波导器件》课程Klein
et
al.
(IPRM
2006)Modulator-III-V
QPSK
modulatorQPSK
constellation80Gb/s80Gb/s
QPSK
modulator
based
onnested
40GHz
III-V
MZMs(traditional
structure)《集成平面光波导器件》课程N.Kikuchi,
et.
al.,
PTL
21(12),
2009E1
2E
0,1
E2
E
(
1
j)E3
2
jE
0,1
Optical
Modulator-III-V
QPSK
modulator107Gb/s
1
2
(0,1)(0,0)
(1,1)(1,0)Compact
107Gb/s
QPSKmodulator
based
on
two
III-VEAMs
embedded
in
a
three-arminterferometer《集成平面光波导器件》课程C.Doerr,
et.
al.,
PTL
19(15),
2007Optical
Modulator-Si
PlatformPIPIN
diodeMetal
P‐doped
region
MetalN‐doped
region45Europe:
PSUD-IEF,
Surrey
Univ.
…Asia:
A*Star,
Petra,
AIST,
Chinese
Academy
ofSciences,
Samsung
Electronics,
Tokyo
Institute
ofTechnology
…North
America:Intel,
IBM,
Cornell,
Luxtera,
Ligthwire,
Kortura,
Oracle
…
《集成平面光波导器件》课程
Silicon
Modulators×
Kerr
Effect:
n=10-4@100V/
m×
Franz-Keldysh
effect:
~
1.1
m×
Thermal-Optic
effect:
1.86×10
-4/K√
Free
carrier
Plasma
dispersion
effect《集成平面光波导器件》课程
n
ne
nh=-
8.8
10-22
ne+8.5
10-18
nh
e
h=
8.5
10-18
ne
h
n
ne
nh=-
6.2
10-22
ne+6.0
10-18
nh
e
h=
6.0
10-18
ne
h
Free
carrier
Plasma
dispersion
effect
e
is
the
electron
charge,
c
is
the
light
velocity
in
vacuum,
ε0
is
the
vaccum
ermittivity,
λ
is
the
wavelength
in
vacuum,
n
is
the
refractive
index
of
intrinsic
silicon,
mce*
and
mch*
are
the
electron
and
hole
effective
masses,
μe
and
μhare
the
electron
and
hole
mobilities.当载流子浓度为5×10
17时,折射率变化达到10-3量级
《集成平面光波导器件》课程Drude–Lorenz
equation:
1550
nm:
0.8
+6.0
10-18
n
1310
nm:
0.8
+4.0
10-18
n
Silicon
Modulators
Free
carrier
Plasma
dispersion
effect
Carrier
accumulationThe
performance
of
the
freecarrier
plasma
dispersion
basedsilicon
modulator
is
essentiallydetermined
by
how
fast
and
howefficiently
the
free
carrier
densityis
modulated
in
the
area
whereoptical
mode
is
traveling.
Charging/discharging
over
a
capacitor.
Serious
RC
limit,
less
efficientCarrier
Injection
Forward
bias
Relative
efficient,
Slow
diffusion
processCarrier
Depletion
Reverse
bias
less
efficient,
fast
process《集成平面光波导器件》课程G.T.Reed,
et
.al.
Nat.
Photon
.
4,
518-526,2010Carrier
DepletionOptical
modulator-Si
Phase
shifters:
PN
diode
Figures
of
merit
Interleaved
PN
diode
PIN
diode
PIPIN
diodePIN
diodePIPIN
diode
V
L
ILfcERModulation
efficiencyInsertion
loss‐3dB
bandwidthExtinction
ratio
Interferometers
Ring
resonator
Voltage
swing
Power
consumption
Mach-Zehnder
Photonic
crystals《集成平面光波导器件》课程49Silicon
Modulators-Carrier
accumulationApply
VD
to
poly.
Charge
accumulation
on
both
sides
of
gate
oxide.
Ne
=
Nh
=
[
/etoxt]*(VD
–
VFB)
ne
=
-8.8
x
10-22
Ne
nh
=
-8.5
x
10-18(
Nh)0.8
=
(2
/
)
neffL
《集成平面光波导器件》课程Silicon
Modulators-Carrier
InjectionVD
is
applied
to
Anodevs.
Cathode.→
forward
biased
p-i-njunction.→
e
and
holes
injectedinto
guiding
region→
changes
refractiveindex《集成平面光波导器件》课程Silicon
Modulators-Carrier
Injection载流子浓度分布N+区深度影响
《集成平面光波导器件》课程Optical
Modulator-Si
Platform《集成平面光波导器件》课程Silicon
Modulators-Carrier
depletion3x1018cm-31.5x1017
cm-31x1020cm-3《集成平面光波导器件》课程Optical
Modulator-Si
PlatformMach-Zehnder
InterferenceHigh
Q
Structure
(Ring,
FP
etc)1,
wide
optical
bandwidth2,
high
speed
operation1,
large
footprint2,
pretty
large
power
consumption
Intel
2007,
OE.
15(2),
660;1,
very
compact2,
enhanced
ER/Voltage1,
environmental
sensitivity2,
small
optical
bandwidth/EObandwidth
limited.3,
high
resolution
lithographyrequired.
Cornell
2005,
Nat.
435,
325.
《集成平面光波导器件》课程Optical
Modulator-Si
PlatformMach-Zehnder
InterferenceHigh
Q
StructureIntel
2004,
Nat.
427,
616Intel
2009,
AOT,
ID
67894810Gb/s,
f3dB
:
10GHz,Vpp=1.1V,
ER=3.8dBVπL:
33
V
mmCornell
2005,
Nat.
435,
325Cornell
2007,
OE
15(2),
43012.5Gb/s,
Vpp=8V,
ER=9dBf3dB
:~1GHz,Pre-emphasis
to
16VIBM
2004,
OE.
15(25),
1710610Gb/s,
f3dB
:
~1GHz,Vpp=1.2V,
ER=?dBPre-emphasis
to
7V.VπL:
0.36V
mmIntel
2007,
OE.
15(2),
660Intel
2009,
AOT,
ID
678948Kotura
2009,
OE
17(25),
2248410Gb/s,
f3dB
=
11GHzVpp=2V,
ER=6.5dB《集成平面光波导器件》课程40Gb/s,
f3dB
:
33GHz,Vpp=6.2V,
ER=1.1dBPre-emphasis
to
7V.VπL:
40V
mmOptical
Modulator-Si
Platform《集成平面光波导器件》课程Optical
modulator
Space
charge
extension
due
to
carrier
depletion
is
limited
~100
nm
typically.n-Si
i-Sip-Si《集成平面光波导器件》课程58
The
optimization
of
“classical”
modulators
relies
on
the
optimization
of
the
overlap
between
the
optical
mode
and
the
depletedwaveguide
is
usually
much
smaller
than
the
modal
sizeFrom
the
idea
to
the
final
deviceOptimizationFigures
of
meriteSimulation
of
the
diode
CouplersOptimized
structure
10G
40G
Frequency
and
data
transmission《集成平面光波导器件》课程59TechnologyLayoutCharacterization(µm)
y
neffx
(µm)PIPIN
diode
principle
PIPIN
diodeActive
region8X10-42.0x10-4
Metal
Metal
P‐doped
region
N‐doped
region
Optimization
of
the
overlap
between
the
optical
mode
and
the
depleted
region.
Low
insertion
loss
2x101740,90,710,9
1.50,7-1V0
-5
-4
-3
-2Hole
concentration
variation3
1.00,50320,500.55410.0
20Refractive
Effective
variation
variationindex
index《集成平面光波导器件》课程
2,5x
(µm)2,5
3
Voltage
(V)60evel
(/cm3)
Doping
leSelf-aligned
fabrication
processDepth
(µm)《集成平面光波导器件》课程61RESISTInAll
silicon
carrier
depletionmodulator
OutModulator
lengths:
0.95
mm
and
4.7
mm《集成平面光波导器件》课程62RF
characteristics40Gbit/sL
=
4.7
mmExtinction
ratio:
6.6
dBInsertion
loss:
6
dB
《集成平面光波导器件》课程63Ring
resonator
modulators
PIPIN
diodeRing
radius:
50µmTETM10Gbit/sExtinction
ratio:
4-5
dBInsertion
loss:
~1dB《集成平面光波导器件》课程64DiodeV
L
Activeregionglength40Gbit/sEROn-chipIL(maximum(transmission)Opticallossat40Gbit/soperat.pointverticalpn[Intel]4V.cm1mm1dB4dB-lateralpn[Univ.Surrey]2.7V.cm3.5mm10dB15dB15dBMaincharalateralpn[Univ.Surrey]2.7V.cm
P1mmtobe3.5dB(improved:5dB35dBPowerlateralpn[Univ.Surrey]2.7V.cm
1mmti7dBJ/bit)5dB8dBVoltawrappedaroundpn14VV.cm[Univ.Surrey]geswing1.313mm(>5V)6.565dB15dB25dBpipin[Univ.ParisSud]3.5V.cm4.7mm6.6dB6dB6dBpipin[Univ.ParisSud]3.5V.cm0.95mm3.2dB4.5dB4.5dBState
of
the
art《集成平面光波导器件》课程65Power
consumption
evolution
Carrier
depletion
mo
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