soldercheckingstandard焊接检查标准

STYLEREFDocCodeSTYLEREFDocTitleSoldercheckingstandard焊接检查标准1/20名称:Soldercheckingstandard焊接检查标准文件编号审查核准制定部门适用部门CL:版本:Purpose/目的(1)Forsolderinstructionstandard/作为焊接作业遵循的标准(2)AccordingascreatingSOP/作为标准操作规程制定依据(3)ForQCchecking/作为QC检查依据ReferenceDocuments/参考文件IPC-A-610DScope/范围ThisdocumentisvalidwithinforPCBASoldering/适用于PCBA焊接检查.Description/内容NO序号item/项目Picture/图示(PASS)Picture/图示(NG)1MinimumEndJointWidth最小末端焊点宽度(PASS)(NG)Endjointwidthisequaltoorgreaterthanleadwidth末端焊点宽度等于或大于引脚宽度.Minimumendjointwidthislessthan50%leadwidth(W)最小末端焊点宽度小于引脚宽度的50%2MinimumSideJointLength最小侧面焊点长度(PASS)(NG)Evidenceofwettedfilletalongfulllengthoflead引脚全长焊点润湿Theminimumsidejointlength(D)islessthanthreeleadwidths(W)or(D)islessthan75%(L)最小焊点长度D小于3倍引脚宽度W或75%引脚长度Widthtoheightratiodoesnotexceedtwotoone(2:1)ratio宽度对高度的比例不超过二比一(2:1).Completewettingatlandorendcapmetallization焊盘和元器件可焊端表面完全润湿.Widthtoheightratioexceedstwotoone(2:1)ratio;Incompletewettingatlandorendcapmetallization;Lessthan100%overlapofthecomponetterminationandtheland元件宽度与高度之比大于2:1；元件焊接端与焊盘未完全润湿；元件端头与焊盘重叠小于100%；3Toeoverhangviolates引脚超焊盘(PASS)(NG)Evidenceofwettedfilletalongfulllengthoflead引脚全长焊点正常润湿Toeoverhangviolatesminimumelectricalclearance元件脚趾部违反最小电气间隙（0.13mm)4RectangularorsquareEnd长方体元件偏移(片式元件侧面偏移)(PASS)(NG)Nosideoverhang无侧面偏移Sideoverhangisgreaterthan25%componentterminationwidthor25%landwith,whicheverisless.侧面偏移大于元件可焊端宽度的25%或焊盘宽度的25%5MountingUpsideDown翻面(PASS)(NG)Elementofchipcomponentwithexposeddepositedelectricalelementismountedawayfromtheboard.有暴露存积电气材质的片式元件将材质面朝离印制板面贴装.Elementofchipcomponentwithexposeddepositedelectricalelementismoundedtowardboard片式元件的外露电极朝向印刷板面安装6EndOverlap空焊 (PASS) (NG)Evidenceofoverlapcontactbetweenthecomponentterminationandthelandisrequired元件可焊端与焊盘间的重叠部分清楚可见Insufficientendoverlap末端没有重叠(空焊)7Tombstoning立碑(PASS) (NG)Chipcomponentsflatingonaterminalend片式元件末端平放在焊盘上.Chipcomponentsstandingonaterminalend片式元件末端翘起(立碑).8EndJointWidthisless片式元件水平少锡(PASS) (NG)Endjointwidthisequaltocomponentterminationwidthorwidthofland末端焊点宽度等于元件可焊端宽度或焊盘宽度Endjointwidthislessthan75%ofcomponenttermination片式元件焊锡涵盖于焊垫及零件端点处之宽度,水平方向小于元件宽度的75%.9MininumFilletHeight片式元件垂直少锡(最小焊点高度)(PASS) (NG)Minimumfilletheightissolderthicknessplus25%terminationheightor0.5mm[0.02in]最小焊点高度为焊锡厚度加可焊端高度的25%或0.5毫米[0.02英寸]Minimumfilletheight(F)islessthansolderthickness(G)plus25%(H),orsolderthickness(G)plus0.5mm,whicheverisless最小焊缝高度(F)小于焊锡厚度(G)加可焊端高度(H)的25%或0.5mm10EndOverhand末端偏移(PASS)(NG)NOsideoverhang无侧面偏移Terminationoverhangsland可焊端偏移超出焊盘11EndJointWidth(ChipComponents)末端焊点宽度(片式元件)(PASS)(NG)Endjointwidthisequaltocomponentterminationwidthorwidthofland末端焊点等于元件可焊端宽度或焊盘宽度Endjointwidthislessthan50%componentdiameter,orlandwidth末端焊点小于元件直径或焊盘宽度的50%12MaxinumFilletHeight最大焊点高度(PASS) (NG)Maximumfilletheightisthesolderthicknesspluscomponentterminationheight最大焊点高度为焊锡厚度加元件可焊高度Solderfilletextendsontothetopofthecomponentbody最大焊接高度(E)可超出焊盘或爬伸到元件金属镀层端帽可焊端的顶部,但不可接触元件体.13MinimumFilletHeight最小焊点高度(PASS)(NG)Minimumfilletheight(F)issolderthickness(G)plus25%terminationheight(H).or0.5mm[0.02in]最小焊点高度(F)为焊锡厚度(G)加可焊端高度(H)的25%或0.5毫米[0.02英寸]Minimumfilletheight(F)islessthansolderthickness(G)plus25%(H),orsolderthickness(G)plus0.5mm,whicheverisless最小焊点高度(F)小于焊锡厚度(G)加可焊端高度(H)的25%或焊锡高度(G)加0.5毫米14Nonwetting焊点拒焊(无润湿焊点)SMD(贴片元件)(PASS) (NG)Solderhastowettedtothelandorterminationwheresolderisrequired需要焊接的引脚或焊盘已润湿Solderhasnotwettedtothelandorterminationwheresolderisrequired需要焊接的引脚或焊盘不润湿(75%以上)15ExcessSolder焊锡过量(PASS)(NG)Noexcesssolderontheprintedwiringassemble没有过多的焊锡留在电路板线路上 (NG)Soldersplashes/webbing网状焊锡16Solderballs锡珠(PASS)(NG)Nosolderballsaroundthecomponent(lend)元器件(焊盘)周围没有锡珠Solderballsarenotentrappedinno-cleanresidueorencapsulatedwithconformalcoating,ornotattached(soldered)tometalsurface焊锡球未固定在免清洗的残渣内或覆盖在保护涂敷层下,或未粘附于金属表面(PASS)(NG)Nosolderballsbetweenlend(orcomponent)tolead(orcomponent)在引脚之间或元器件之间没有锡珠Solderballsviolateminimumelectricalclearance(0.13mm)焊锡球违反最小电气间隙.(0.13mm)17Bridging桥接(PASS)(NG)Solderhasn’tbridgedtoadjacentnoncommonconductororcomponent在相邻的不同导线或元器件间没有形成桥接Asolderconnectionacrossconductorsthatshouldnotbejoined.Solderhasbridgedtoadjacentnoncommonconductorrocomponent.焊锡连接不应该连接的导线及焊锡在相邻的不同导线或元件间形成桥接18SolderProjections拉尖(焊锡毛刺)(PASS) (NG)Noevidencesolderprojectiononthesoldersurface在焊点表面上没有明显的拉尖或毛刺SolderProjection,violatesminimumelectricalclearance(0.13mm)焊料拉尖违法最小电气间隙(0.13mm)19Componetdamage元件损害(PASS) (NG)Nonicks,cracksorstressfracture无刻痕,缺口,或压痕Anynickorchip-outthatexposestheelectrodesCracks,nicksoranytypeofdamageinbodiedcomponentsAnychip-outsinresistiveelementsAnycracksorstressfractures任何暴露电极的裂痕或缺口.元件上有裂缝,刻痕或任何损害任何电阻材质的缺口20DisturbedSolder焊锡紊乱 (PASS)(NG)Noevidencetraceonthesurfaceofsolder在焊点表面没有明显的紊乱痕迹Characterizedbystresslinesfrommovementintheconnection焊接因外力影响而被移动,焊点呈现紊乱痕迹21Nonwetting焊点拒焊(无润湿焊点)PTH(插件元件)(PASS)(NG)Landareacompletelycoveredonthesecondaryside轴面的焊盘完全润湿覆盖(NG)Soldercoveragedoesnotmeetrequirementfor75%焊锡的覆盖率不满足大于75%焊料没有完全润湿焊盘或元件端头;22FluxResidues助焊剂残留物(PASS) (NG)Clean,nodiscernibleresidue清洁,无可见残留物Discernibleresiduesfromcleanablefluxes,oranyactivatedfluxresiduesonelectricalcontactsufaces可辨别清洗助焊剂的残留物,或者在电气连接表面有活性助焊剂残留物23FracturedSolder锡裂/焊接破裂(PASS) (NG)Nofracturebetweenleadandsolder引脚和焊点无裂痕Evidenceoffracturebwtweenleadandsolderfillet引脚与焊缝之间有明显的裂纹24Solder包焊(PASS)(NG)Leaddiscernibleinthesolder焊锡中可以辨别引脚Filletconvex,andasanexceptiontotable,leadnotdiscernibleduetoexcesssolder,providingvisualevidenceofleadintheholecanbedeterminedontheprimaryside焊缝凸起,由于焊料过多,无法看到元件引脚,25Theheightofsupportedhole浮高(PASS) (NG)Theentirebodylengthofcomponentisincontactwiththeboardsurface全部元器件本体与板面完全接触Thedistancebetweenthecomponentbodyandtheboardislargerthan1.5mm元件本体与PCB之间距离大于1.5mm,26Wire/leadprotrusion导线/引脚伸出(PASS) (NG)Leadprotrusionisequalorlessthan2.5mm引脚伸出焊盘长度等于或小于2.5mmLeadprotrusionisn’tvillateminmumelectricalclearance引脚伸出长度没有违反最小电气化间隙Leadprotrusiondoesnotover2.5mmLeadprotrusionviolateminimumelectricalclearance引脚伸出焊盘长度大于2.5mm引脚伸出长度违反最小电气化间隙27PinHoles/BlowHoles针孔/吹孔(PASS)(NG)Noevidencepinholes,blowholesonthesolder焊点没有明显的针孔、吹孔Solderconnectionwherepinholes,blowholes,voids,etc.reducetheconnectionbelowminimumrequirement针孔、吹孔等减少焊接至不满足最低条件的要求28FilletLift焊点跷起(PASS)(NG)Noseparationbetweenconductor,padorlandlaminatesurface.在导线,焊盘与基板之间没有分离现象Filletliftingdamagesthelandattachment焊点跷起损坏焊盘29Unsupportedholes非支撑孔(PASS)(NG)NOvoidareaorsurfaceimperfection无空洞或表面瑕庇leadorlandarewellwetted,and100%引脚和焊盘润湿良好solderfilletaroundthelead引脚周围焊锡100%填充Solderconnectionofstraightterminationdoesnotmeetminimumof270°circumferentialfilletorwettingandlessthan75%landcoverage垂直穿孔的焊接不满足周边270度焊接层覆盖或润湿要求及焊盘覆盖不足75%30Insulationdamage绝缘皮损害 (PASS)(NG)Theinsulationhavebeentrimmedneatlywithnosignsofpinching,pulling,frayingdiscolorationcharringorburning焊接后绝缘层切口整洁,没有拉伸,磨损,烧伤的痕迹Insulationthicknessisreducedbymorethan20%绝缘层的厚度减少超过20%31Insulationdamage绝缘皮损害(PASS)(NG)Theinsulationhavebeentrimmedwithnopulling绝缘皮没有被拉伸Unevenorraggedpiecesofinsulation(frays,tail,tags)aregreaterthan50%oftheinsulationoutsidediameteror1mmwhicheverismore不整齐的绝缘层碎片(磨损,尾端,突出部分)大于绝缘层外径的50%或1mm(PASS)(NG)Theinsulationhavebeentrimmedneatlywithnoburning焊接后绝缘层,没有烧伤的痕迹Insulationischarred绝缘层