回焊炉温设定演示文稿

回焊炉温度设定演示文稿本文档共20页；当前第1页；编辑于星期二\12点11分Contents爐膛設計Profile四個區間說明融錫狀態PWI高溫影響CTE測溫線埋設爐溫升溫圖型說明速度與爐膛加熱計算模擬本文档共20页；当前第2页；编辑于星期二\12点11分InsideofOven(加熱爐膛內部)HeatingIntheovenUseVitronicsXPM21030本文档共20页；当前第3页；编辑于星期二\12点11分Reflowprofile本文档共20页；当前第4页；编辑于星期二\12点11分Angle-chipforCapacitor本文档共20页；当前第5页；编辑于星期二\12点11分tc1–smallSMDΔT:thesmallerthemass,thehotteritgets!

tc1–mediumSMDtc3–largeSMD本文档共20页；当前第6页；编辑于星期二\12点11分TimeTemp.230°C250°Ctc1–smallSMDtc1–mediumSMDtc3–largeSMD20°C20°CSmallSnAgCuProcessWindowTooHot!TooCold!Peak:230–250°Ctc1–255Ctc2–235°Ctc3–225°C本文档共20页；当前第7页；编辑于星期二\12点11分HighTemperatureProfilesforleadfreereflowsolderingHightemp.reflowprofilesareoftenrecommendedtosolderleadfreeassemblies.Peaktemperaturesupto260°Carewrittenintheliterature.Thisextremehightemperaturesmaydamagecomponents,PCBlaminateandinfluencesolderjointreliabilityandshape.SnPb SnAgCu SnAgCuTmax215°C Tmax235°C Tmax260°CComponent:ChipC1206AgPdBoard:NiAu

Pictures:Zollner,Zandt

LeadFreeReflowProcessConcerns本文档共20页；当前第8页；编辑于星期二\12点11分LeadFreeReflowProcessConcerns:ComponentDamage225ºC250ºCVaporpressureinELCOPictures:PhilipsLFPeak:230°C–250°C??本文档共20页；当前第9页；编辑于星期二\12点11分LeadFreeReflowProcessConcerns:ComponentDamage225ºC255ºCPictures:PhilipsLFPeak:230°C–250°C??本文档共20页；当前第10页；编辑于星期二\12点11分240ºC270ºCDeformationofthermo-plasticcomponentbodiesLeadFreeReflowProcessConcerns:ComponentDamagePictures:JabilLFPeak:230°C–250°C??本文档共20页；当前第11页；编辑于星期二\12点11分LeadFreeReflowProcessConcerns:OpenorNearOpenJointsResultofboardwarpageandcomponentbulgingduetohightemperaturePicture:Philips本文档共20页；当前第12页；编辑于星期二\12点11分Theriskofmicrocracksincreasewiththedistancetothecenter.Ashigherthetemperature,ashighertheexpansionthermalexpansion(CTE)本文档共20页；当前第13页；编辑于星期二\12点11分Highertemperatureincreasesmechanicalstressonsolderjoints本文档共20页；当前第14页；编辑于星期二\12点11分FailuretoproperlymountTCswillresultinanunwantedT!ReflowMachineProfiling–TheMostImportantStep!X??SurfacemeasurementBGAballmeasurement本文档共20页；当前第15页；编辑于星期二\12点11分ClassicalTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGASpeed:1m/minT=5,8°C!ThermalManagement:FlexibleProfiling–ClassicalSoak(1)HighPlateauTemperaturemaydamagePCBlaminate本文档共20页；当前第16页；编辑于星期二\12点11分ThermalManagement:FlexibleProfiling–ClassicalSoak(2)ClassicalTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGASpeed:1m/minT=4,5°C!RaisingPreheattempcanreduceT

本文档共20页；当前第17页；编辑于星期二\12点11分LinearTemperatureProfileofaHotflow2/24Gradients deltaT PCB PBGARunningjustalinearprofileonsuchahighsofisticatedmachinemakesnosense!DeltaTcanbereducedbydifferentsetup.T=9,3°C!Speed:1m/minThermalManagement:FlexibleProfiling–StraightLine(1)本文档共20页；当前第18页；编辑于星期二\12点11分LinearTemperatureProfileofaHotflow2/24withflatpeakGradients deltaT PCB PBGASettingupaflatpeakwillreducethedeltaTtremendously.T=6,0°C!Speed:1m/minThermalManagement:FlexibleProfiling–StraightLine(2)FlatpeakcanreduceT

本文档共20页；当前第19页；编辑于星期二\12点11分LinearTemp.ProfileofaHotflow2/24withflatpeak/slowspeedGradients deltaT PCB PBGASlightlyIncreasingtheprocesstimewillreduc