CB专业英译术语汇集

PCB专业英译术语一、综合词汇1、印制电路：printedcircuit2、印制线路：printedwiring3、印制板：printedboard4、印制板电路：printedcircuitboard(PCB)5、印制线路板：printedwiringboard(PWB)6、印制元件：printedcomponent7、印制接点：printedcontact8、印制板装配：printedboardassembly9、板：board10、单面印制板：single-sidedprintedboard(SSB)11、双面印制板：double-sidedprintedboard(DSB)12、多层印制板：mulitlayerprintedboard(MLB)13、多层印制电路板：mulitlayerprintedcircuitboard14、多层印制线路板：mulitlayerpritedwiringboard15、刚性印制板：rigidprintedboard16、刚性单面印制板：rigidsingle-sidedprintedborad17、刚性双面印制板：rigiddouble-sidedprintedborad18、刚性多层印制板：rigidmultilayerprintedboard19、挠性多层印制板：flexiblemultilayerprintedboard20、挠性印制板：flexibleprintedboard21、挠性单面印制板：flexiblesingle-sidedprintedboard22、挠性双面印制板：flexibledouble-sidedprintedboard23、挠性印制电路：flexibleprintedcircuit(FPC)24、挠性印制线路：flexibleprintedwiring25、刚性印制板：flex-rigidprintedboard,rigid-flexprintedboard26、刚性双面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28、齐平印制板：flushprintedboard29、金属芯印制板：metalcoreprintedboard30、金属基印制板：metalbaseprintedboard31、多重布线印制板：mulit-wiringprintedboard32、陶瓷印制板：ceramicsubstrateprintedboard33、导电胶印制板：electroconductivepasteprintedboard34、模塑电路板：moldedcircuitboard35、模压印制板：stampedprintedwiringboard36、顺序层压多层印制板：sequentially-laminatedmulitlayer37、散线印制板：discretewiringboard38、微线印制板：microwireboard39、积层印制板：buile-upprintedboard40、积层多层印制板：build-upmulitlayerprintedboard(BUM)41、积层挠印制板：build-upflexibleprintedboard42、表面层合电路板：surfacelaminarcircuit(SLC)43、埋入凸块连印制板：B2itprintedboard44、多层膜基板：multi-layeredfilmsubstrate(MFS)45、层间全内导通多层印制板：ALIVHmultilayerprintedboard46、载芯片板：chiponboard(COB)47、埋电阻板：buriedresistanceboard48、母板：motherboard49、子板：daughterboard50、背板：backplane51、裸板：bareboard52、键盘板夹心板：copper-invar-copperboard53、动态挠性板：dynamicflexboard54、静态挠性板：staticflexboard55、可断拼板：break-awayplanel56、电缆：cable57、挠性扁平电缆：flexibleflatcable(FFC)58、薄膜开关：membraneswitch59、混合电路：hybridcircuit60、厚膜：thickfilm61、厚膜电路：thickfilmcircuit62、薄膜：thinfilm63、薄膜混合电路：thinfilmhybridcircuit64、互连：interconnection65、导线：conductortraceline66、齐平导线：flushconductor67、传输线：transmissionline68、跨交：crossover69、板边插头：edge-boardcontact70、增强板：stiffener71、基底：substrate72、基板面：realestate73、导线面：conductorside74、元件面：componentside75、焊接面：solderside76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductivepattern80、非导电图形：non-conductivepattern81、字符：legend82、标志：mark[/size]ilww2004-11-1016:18:00)二、基材：1、基材：basematerial2、层压板：laminate3、覆金属箔基材：metal-cladbadematerial4、覆铜箔层压板：copper-cladlaminate(CCL)5、单面覆铜箔层压板：single-sidedcopper-cladlaminate6、双面覆铜箔层压板：double-sidedcopper-cladlaminate7、复合层压板：compositelaminate8、薄层压板：thinlaminate9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate10、金属基覆铜层压板：metalbasecopper-cladlaminate11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm12、基体材料：basismaterial13、预浸材料：prepreg14、粘结片：bondingsheet15、预浸粘结片：preimpregnatedbondingsheer16、环氧玻璃基板：epoxyglasssubstrate17、加成法用层压板：laminateforadditiveprocess18、预制内层覆箔板：masslaminationpanel19、内层芯板：corematerial20、催化板材：catalyzedboard,coatedcatalyzedlaminate21、涂胶催化层压板：adhesive-coatedcatalyzedlaminate22、涂胶无催层压板：adhesive-coateduncatalyzedlaminate23、粘结层：bondinglayer24、粘结膜：filmadhesive25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm26、无支撑胶粘剂膜：unsupportedadhesivefilm27、覆盖层：coverlayer(coverlay)28、增强板材：stiffenermaterial29、铜箔面：copper-cladsurface30、去铜箔面：foilremovalsurface31、层压板面：uncladlaminatesurface32、基膜面：basefilmsurface33、胶粘剂面：adhesivefaec34、原始光洁面：platefinish35、粗面：mattfinish36、纵向：lengthwisedirection37、模向：crosswisedirection38、剪切板：cuttosizepanel39、酚醛纸质覆铜箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)40、环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)41、环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates42、环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates44、聚酯玻璃布覆铜箔板：ployesterwovenglassfabriccopper-cladlaminates45、聚酰亚胺玻璃布覆铜箔板：polyimidewovenglassfabriccopper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates47、环氧合成纤维布覆铜箔板：epoxidesyntheticfiberfabriccopper-cladlaminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiberglasscopper-cladlaminates49、超薄型层压板：ultrathinlaminate50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates51、紫外线阻挡型覆铜箔板：UVblockingcopper-cladlaminatesilww2004-11-1016:19:00)三、基材的材料1、A阶树脂：A-stageresin2、B阶树脂：B-stageresin3、C阶树脂：C-stageresin4、环氧树脂：epoxyresin5、酚醛树脂：phenolicresin6、聚酯树脂：polyesterresin7、聚酰亚胺树脂：polyimideresin8、双马来酰亚胺三嗪树脂：bismaleimide-triazineresin9、丙烯酸树脂：acrylicresin10、三聚氰胺甲醛树脂：melamineformaldehyderesin11、多官能环氧树脂：polyfunctionalepoxyresin12、溴化环氧树脂：brominatedepoxyresin13、环氧酚醛：epoxynovolac14、氟树脂：fluroresin15、硅树脂：siliconeresin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphouspolymer19、结晶现象：crystallinepolamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosettingresin24、热塑性树脂：thermoplasticresin25、感光性树脂：photosensitiveresin26、环氧当量：weightperepoxyequivalent(WPE)27、环氧值：epoxyvalue28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curingagent32、阻燃剂：flameretardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiatedpolyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimidefilm(PI)38、聚四氟乙烯：polytetrafluoetylene(PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(FEP)40、增强材料：reinforcingmaterial41、玻璃纤维：glassfiber42、E玻璃纤维：E-glassfibre43、D玻璃纤维：D-glassfibre44、S玻璃纤维：S-glassfibre45、玻璃布：glassfabric46、非织布：non-wovenfabric47、玻璃纤维垫：glassmats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weftyarn52、经纱：warpyarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：threadcount57、织物组织：weavestructure58、平纹组织：plainstructure59、坏布：greyfabric60、稀松织物：wovenscrim61、弓纬：bowofweave62、断经：endmissing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fisheye68、毛圈长：featherlength69、厚薄段：mark70、裂缝：split71、捻度：twistofyarn72、浸润剂含量：sizecontent73、浸润剂残留量：sizeresidue74、处理剂含量：finishlevel75、浸润剂：size76、偶联剂：couplintagent77、处理织物：finishedfabric78、聚酰胺纤维：polyarmidefiber79、聚酯纤维非织布：non-wovenpolyesterfabric80、浸渍绝缘纵纸：impregnatinginsulationpaper81、聚芳酰胺纤维纸：aromaticpolyamidepaper82、断裂长：breakinglength83、吸水高度：heightofcapillaryrise84、湿强度保留率：wetstrengthretention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductivefoil88、铜箔：copperfoil89、电解铜箔：electrodepositedcopperfoil(EDcopperfoil)90、压延铜箔：rolledcopperfoil91、退火铜箔：annealedcopperfoil92、压延退火铜箔：rolledannealedcopperfoil(RAcopperfoil)93、薄铜箔：thincopperfoil94、涂胶铜箔：adhesivecoatedfoil95、涂胶脂铜箔：resincoatedcopperfoil(RCC)96、复合金属箔：compositemetallicmaterial97、载体箔：carrierfoil98、殷瓦：invar99、箔（剖面）轮廓：foilprofile100、光面：shinyside101、粗糙面：matteside102、处理面：treatedside103、防锈处理：stainproofing104、双面处理铜箔：doubletreatedfoililww2004-11-1016:20:00)四、设计1、原理图：shematicdiagram2、逻辑图：logicdiagram3、印制线路布设：printedwirelayout4、布设总图：masterdrawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aideddesign.(CAD)7、计算机辅助制造：computer-aidedmanufacturing.(CAM)8、计算机集成制造：computerintegratmanufacturing.(CIM)9、计算机辅助工程：computer-aidedengineering.(CAE)10、计算机辅助测试：computer-aidedtest.(CAT)11、电子设计自动化：electricdesignautomation.(EDA)12、工程设计自动化：engineeringdesignautomaton.(EDA2)13、组装设计自动化：assemblyaidedarchitecturaldesign.(AAAD)14、计算机辅助制图：computeraideddrawing15、计算机控制显示：computercontrolleddisplay.(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logicsimulation22、电路模拟：circitsimulation23、时序模拟：timingsimulation24、模块化：modularization25、布线完成率：layouteffeciency26、机器描述格式：machinedescriptionmformat.(MDF)27、机器描述格式数据库：MDFdatabse28、设计数据库：designdatabase29、设计原点：designorigin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominantaxis32、表格原点：tableorigin33、镜像：mirroring34、驱动文件：drivefile35、中间文件：intermediatefile36、制造文件：manufacturingdocumentation37、队列支撑数据库：queuesupportdatabase38、元件安置：componentpositioning39、图形显示：graphicsdispaly40、比例因子：scalingfactor41、扫描填充：scanfilling42、矩形填充：rectanglefilling43、填充域：regionfilling44、实体设计：physicaldesign45、逻辑设计：logicdesign46、逻辑电路：logiccircuit47、层次设计：hierarchicaldesign48、自顶向下设计：top-downdesign49、自底向上设计：bottom-updesign50、线网：net51、数字化：digitzing52、设计规则检查：designrulechecking53、走（布）线器：router(CAD)54、网络表：netlist55、计算机辅助电路分析：computer-aidedcircuitanalysis56、子线网：subnet57、目标函数：objectivefunction58、设计后处理：postdesignprocessing(PDP)59、交互式制图设计：interactivedrawingdesign60、费用矩阵：costmetrix61、工程图：engineeringdrawing62、方块框图：blockdiagram63、迷宫：moze64、元件密度：componentdensity65、巡回售货员问题：travelingsalesmanproblem66、自由度：degreesfreedom67、入度：outgoingdegree68、出度：incomingdegree69、曼哈顿距离：manhattondistance70、欧几里德距离：euclideandistance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logicdesignautomation76、分线：separatedtime77、分层：separatedlayer78、定顺序：definitesequencilww2004-11-1016:21:00)丧五英、纽形嗽状返与尺滥寸挡：螺1叼、誉导线锄（通逆道）故：梦co宪nd成uc象ti倾on气(月tr起ac莫k使)兔2旧、壁导脾线（崭体）壁宽度傻：塑co健nd法uc习to恋r化wi屈dt绩h删3未、愿导线刑距离什：烛co己nd续uc锻to录r谷sp盆ac曾in剖g财4肢、络导线醒层侦：商co排nd恼uc艘to帖r写la扬ye院r番5沉、爬导线矛宽剩度瓶/结间距作：牢co经nd厌uc娃to液r芝li绩ne闻/s雁pa布ce代门6巷、拾第一梢导线废层惕：肆co世nd拐uc洗to昌r果la吼ye顾r庙No劣.1帝挥7坛、枣圆形虑盘属：斥ro救un申d靠pa盒d却8锄、土方形石盘者：敏sq典ua偷re鞋p膝ad稍蛮9披、肉菱形助盘沫：贤di糟am将on仔d况pa薄d竭1绸0毙、尼长方辈形焊挪盘麻：育ob注lo剑ng报p归a下d驴1悉1鼠、垄子弹龄形盘厕：睡bu牧ll旧et灿p斤ad者百1今2耻、香泪滴让盘索：灯te帽a芦rd刑ro脱p稻pa谁d速1雀3原、拢雪人仅盘乐：龄sn烧ow弟ma怀n避pa粥d匆1汁4状、申V戏形盘火：牲V-贺sh葡ap彼ed回p拉ad敏茫1蚊5乐、脸环形怀盘蚊：蛇an麻nu挺la嘴r倍pa震d振1压6散、鸭非圆包形盘怨：阵no誉n-扶ci绕rc守ul辛ar剃p疮ad偏玻1营7出、骆隔离抵盘袄：舅is争ol睬at削io惭n跌pa贴d催1认8涨、穷非功绑能连敌接盘售：斯mo魄nf吹un遥ct谱io哑na龄l唉pa翁d映1盏9胃、失偏置禾连接致盘雄：包of余fs次et泰l快an嫌d眯2缘0燥、药腹（恳背）斯裸答盘兴：朗ba缎ck山-b钳ar毯d止la哪nd技阔2俊1尼、庄盘址号：壶an顶ch盖or针in乓g容s鉴pa屡ur踏油2倘2披、桃连接稼盘图廊形立：揪la邀nd澡p棒at崖te勾rn愈攻2枣3围、何连接宾盘网撒格志阵列哥：关la倚nd选g袍ri格d仔ar劫ra烘y屠2柴4源、符孔环望：扭an鞋nu订la究r虫ri乒ng勾们2评5量、都元件呆孔嫌：焰co虽mp链on话en皆t混ho陵le曲裤2冻6离、钉安装罪孔何：禽mo扔un言ti热ng灿h识ol遇e月2番7乌、验支撑过孔萌：煎su痒pp不or韵te厌d弊ho耐le齿勿2符8止、旨非支米撑孔亡：染un犹su搜pp写or燕te饭d絮ho增le鲁顶2黄9啦、向导通使孔闯：炮vi施a荒3凉0膊、培镀通掩孔孕：月pl深at把ed迁t写hr煮ou解gh紧希ho鞭le歪(企PT杠H)些捐3协1揪、倡余隙框孔宝：尘ac凳ce嗓ss虫h俯ol查e艇3缺2狸、城盲孔壮：映bl眯in待d巩vi堵a立(h凶ol鸦e)洪步3砍3恋、格埋孔纷：翻bu资ri肯ed压v央i号a穴h任ol肿e倘3朵4妹、招埋羽/都盲孔际：有bu书ri溜ed恐/裁bl仰in睬d雀vi悬a坝3搏5欲、淋任意喘层内续部导孕通孔努：眨an释y互la扩ye清r械in枣ne宿r邮vi碰a依ho然le肺(抹AL滤IV设H)迎仇3报6惭、腿全部椒钻孔傲：陵al星l盟dr葡il屈le蓝d泊ho针le爆嚼3筑7旅、闪定位趁孔壶：争to沟al涛in点g架ho雕le袄庆3莲8攀、状无连桥接盘则孔订：弹la奴nd扛le台ss锹h遗ol虚e歌3激9蹦、抖中间赌孔强：嗽in寸te膛rs纸ti庄ti葬al降h犯ol激e楚4丸0滤、粗无连眨接盘冰导通紫孔绪：宜la申nd技le务ss歌v干ia敬h暴ol疗e扁4大1角、肚引导怨孔咽：枯pi偶lo刃t果ho侍le祸营4扇2帜、迁端接娱全隙召孔漠：丙te纤rm奇in啦al安c帐l叙e常ar但om泰ee寨h昂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*****A*****AbieticAcid松脂酸.AbrasionResistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).AcImpedance交流阻抗.AcceleratedTest(Aging)加速老化(試驗).Acceleration速化反應.Accelerator加速劑,速化劑.Acceptability,Acceptance允收性,允收.AccessHole露出孔,穿露孔.Accuracy准確度.AcidNumber(AcidValue)酸值.AcousticMicroscope(AM)感音成像顯微鏡.Acrylic壓克力(聚丙烯酸樹脂).ActinicLight(orIntensity,orRadiation)有效光.Activation活化.Activator活化劑.ActiveCarbon活性炭.ActiveParts(Devices)主動零件.Acutance解像銳利度.AdditionAgent添加劑.AdditiveProcess加成法.Adhesion附著力.AdhesionPromotor附著力促進劑.Adhesive膠類或接著劑.Admittance導納(阻抗的倒數).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.AirInclusion氣泡夾雜.AirKnife風刀.Algorithm演算法.AliphaticSolvent脂肪族溶劑.AluminiumNitride(AlN)氮化鋁.AmbientTamp環境溫度.Amorphous無定形,非晶形.Amp-Hour安培小時.AnalogCircuit/AnalogSignal類比電路/類比訊號.AnchoringSpurs著力爪.Angleof

Contack接觸角.AngleofAttack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal韌化(退火).AnnularRing孔環.Anode陽極.AnodeSludge陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-FoamingAgent消泡劑.Anti-pitAgent抗凹劑.AOI自動光學檢驗.Apertures開口,鋼版開口.AQL品質允收水準.AQL(AcceptableQualityLevel)允收品質水準.AramidFiber聚醯胺纖維.ArcResistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器.AspectRatio縱橫比.Assembly組裝裝配.A-stageA階段.ATE自動電測設備.Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Azeotrope共沸混合液.

*****B*****BackLight(BackLighting)背光法.BackTaper反錐斜角.Backpanels,Backplanes支撐板.Back-up墊板.BalancedTransmissionLines平衡式傳輸線.BallGridArray球腳陣列(封裝).Bandability彎曲性.BankingAgent護岸劑.BareChipAssembly裸體晶片組裝.Barrel孔壁,滾鍍.BaseMaterial基材.BasicGrid基本方格.Batch批.Baume波美度(凡液體比重比水重則

Be=145-(145÷Sp.Gr)凡液體比重比水輕則

Be=140÷(Sp.Gr-130)*Sp.Gr為比重即同體勣物質對"純水"1g/cm的比值).Beamlead光芒式的平行密集引腳.Bed-of-NailTesting針床測試.BellowsConact彈片式接觸.BetaRayBackscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-LevelStencil]雙階式鋼板.Binder粘結劑.Bits頭(DrillBits).BlackOxide黑氧化層.Blanking沖空斷開.Bleack漂洗.Bleeding溢流.BlindViaHole肓通孔.Blister局部性分層或起泡.BlockDiagram電路系統塊圖.Blockout封綱.Blotting干印.BlottingPaper吸水紙.BlowHole吹孔.BluePlaque藍紋(錫面鈍化層).BlurEdge(Circle)模糊邊帶(圈).BombSight彈標.BondStrength結合強度.Bondability結合性.BondingLayer結合層接著層.BondingSheet(Layer)接合片.BondingWire結合線.Bow,Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425℃~870℃下進行熔接的方式).BreakPoint顯像點.Break-awayPanel可斷開板.BreakdownVoltage崩潰電壓.Break-out破出.Bridging搭橋.BrightDip光澤浸漬處理.Brightener光澤劑.BrownOxide棕氧化.BrushPlating刷鍍.B-stageB階段.BuildUpProcess增層法制程.Build-up堆積.Bulge鼓起.Bump突塊.BumpingProcess凸塊制程.Buoyancy浮力.BuriedViaHole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.BusBar匯電杆.ButterCoat外表樹脂層.

*****C*****C4ChipJointC4晶片焊接.Cable電纜.CAD電腦輔助設計.CalenderedFabric軋平式綱布.CapLamination帽式壓合法.Capacitance電容.CapacitiveCoupling電容耦合.CapillaryAction毛細作用.Carbide碳化物.CarbonArcLamp碳弧燈.CarbonTreatment,Active活化炭處理.Card卡板.CardCages/CardRacks電路板搆裝箱.CarlsonPin卡氏定位稍.Carrier載體.Cartridge濾心.Castallation堡型勣體電路器.CatalyzedBoard,CatalyzedSubstrate催化板材.Catalyzing催化.Cathode陰極.Cation陰向離子,陽离子.CaulPlate隔板.Cavitation空泡化半真空.Center-to-CenterSpacing中心間距.Ceramics陶瓷.Cermet陶金粉.Certificate証明書.CFC氟氫碳化物.Chamfer倒角.CharacteristicImpedance特性阻抗.Chase綱框.CheckList檢查清單.Chelate螯合.ChemicalMilling化學研磨.ChemicalResistance抗化性.Chemisorption化學吸附.Chip晶片(粒).ChipInterconnection晶片互連.ChiponBoard晶片粘著板.ChipOnGlass晶玻接裝(COG).Chisel鑽針的尖部.ChlorinatedSolvent含氯溶劑,氯化溶劑.CircumferentialSeparation環狀斷孔.Clad/Cladding披覆.CleanRoom無塵室.Cleanliness清潔度.Clearance余地,余環.ClinchedLeadTerminal緊箝式引腳.Clinched-wireThroughConnection通孔彎線連接法.ClipTerminal繞線端接.Coat,Coating皮膜表層.CoaxialCable同軸纜線.CoefficientofThermalExpansion熱膨脹系數.Co-Firing共繞.ColdFlow冷流.ColdSolderJoint冷焊點.CollimatedLight平行光.Colloid膠體.ColumnarStructure柱狀組織.CombPattern梳型電路.ComplexIon錯離子.ComponentHole零件孔.ComponentOrientation零件方向.ComponentSide組件面.Composites,(CEM-1,CEM-3)復合板材.CondensationSoldering凝熱焊接,液化放熱焊接.Conditioning整孔.Conductance導電.ConductiveSalt導電鹽.Conductivity導電度.ConductorSpacing導體間距.ConformalCoating貼護層.Conformity吻合性,服貼性.Connector連接器.ContactAngle接觸角.ContactArea接觸區.ContactResistance接觸電阻.Continuity連通性.ContractService協力廠,分包廠.ControlledDepthDrilling定深鑽孔.ConversionCoating轉化皮膜.Coplanarity共面性.Copolymer共聚物.CopperFoil銅皮.CopperMirrorTest銅鏡試驗.CopperPaste銅膏.Copper-Invar-Copper(CIC)綜合夾心板.CoreMaterial內層板材,核材.CornerCrack通孔斷角.CornerMark板角標記.Counterboring方型擴孔.Countersinking錐型擴孔.CouplingAgent偶合劑.Coupon,TestCoupon板邊試樣.Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.CrossectionArea截面積.CrosshatchTesting十字割痕試驗.Crosshatching十字交叉區.Crosslinking,Crosslinkage交聯,架橋.Crossover越交,搭交.Crosstalk雜訊,串訊.CrystallineMeltingPoint晶體熔點.C-StageC階段.Cure硬化,熟化.CurrentDensity電流密度.Current-CarryingCapability載流能力.CurtainCoating濂塗法.

*****D*****DaisyChainedDesign菊瓣設計.DatumReference基准參考.DaughterBoard子板.Debris碎屑,殘材.Deburring去毛頭.DeclinationAngle斜射角.Definition邊緣逼真度.Degradation劣化.Degrasing脫脂.DeionizedWater去離子水.Delamination分離.DendriticGrowth枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計)).Densitomer透光度計.Dent凹陷.Deposition皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像.Deviation偏差.Device電子元件.Dewetting縮錫.D-glassD玻璃.DiazeFilm偶氮棕片.Dichromate重鉻酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die沖模.DieAttach晶粒安裝.DieBonding晶粒接著.DieStamping沖壓.Dielectric介質.DielectricBreakdownVoltage介質崩潰電壓.DielectricConstant介質常數.DielectricStrength介質強度.DifferentialScanningCalorimetry(DSC)微差掃瞄熱卡分析法.DiffusionLayer擴散層.Digitizing數位化.DihedralAngle雙反斜角.DimensionalStability尺度安定性.Diode二極體.DipCoating浸塗法.DipSoldering浸焊法.DIP(DualInlinePackage)雙排腳封裝體.Dipole偶極,雙極.Direct/IndirectStencil直接/間接版膜.DirectEmulsion直接乳膠.DirectPlating直接電鍍.DiscreteCompenent散裝零件.DiscreteWiringBoard散線電路板,復線板.DishDown碟型下陷.Dispersant分散劑.DissipationFactor散失因素.DisspationFactor散逸因子.DisturbedJoint受擾焊點.DoctorBlade修平刀,刮平刀.DogEar狗耳.Doping摻雜.DoubleLayer雙電層.DoubleTreatedFoil雙面處理銅箔.DragIn/DragOut帶[進/帶出.DragSoldering拖焊.Drawbridging吊橋效應.Drift漂移.DrillFacet鑽尖切削面.DrillPointer鑽針重磨機.DrilledBlank已鑽孔的裸板.Dross浮渣.DrumSide銅箔光面.DryFilm干膜.DualWaveSoldering雙波焊接.Ductility展性.DummyLand假焊墊.Dummy,Dummying假鍍(片).Durometer橡膠硬度計.DYCOstrate電漿蝕孔增層法.DynamicFlex(FPC)動態軟板.

*****E*****E-Beam(ElectronBeam)電子束.EddyCurrent渦電流.EdgeSpacing板邊空地.Edge-BoardConnector板邊(金手指)承接器.Edge-BoardContact板邊金手指.Edge-DipSolderabilityTest板邊焊錫性測試.EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級玻璃.Elastomer彈性體.ElectricStrength(耐)電性強度.Electrodeposition電鍍.Electro-depositionPhotoresist電著光阻,電泳光阻.Electroforming電鑄.Electroless-Deposition無電鍍.ElectrolyticToughPitch電解銅..Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動,電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation延伸性,延伸率.Embossing凸出性壓花.EMF(ElectromotiveForce)電動勢.EMI(ElectromagneticInterference)電磁干擾.Emulsion乳化.EmulsionSide藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.EndTap封頭.Entek有機護銅處理.Entrapment夾雜物.EntryMaterial蓋板.EpoxyResin環氧樹脂.EtchFactor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.EtchingIndicator蝕刻指標.EtchingResist蝕刻阻劑.EuteticComposition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.

*****F*****Fabric綱布.FaceBonding反面朝下結合.Failure故障.FanOutWiring/FanInWiring扇出布線/扇入布線.Farad法拉.Farady法拉第.FatigueStrength抗疲勞強度.Fault缺陷.FaultPlane斷層面.FeedThroughHole導通孔.Feeder進料器.FiberExposure玻纖顯露.FiducialMark基准記號.Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.FilmAdhesive接著膜,粘合膜.Filter過濾器.FineLine細線.FinePitch密腳距,密線距,密墊距.Fineness粒度,純度.Finger手指.Finishing終修(飾).FiniteElementMethod有限要素分析法.FirstArticle首產品.FirstPass-Yield初檢良品率.Fixture夾具.Flair刃角變形.FlamePoint自燃點.FlameResistant耐燃性.FlammabilityRate燃性等級.Flare扇形崩口.FlashPlating閃鍍.Flashover閃絡.FlatCable扁平排線.FlatPack扁平封裝(之零件).Flatness平坦度.FlexiblePrintedCircuit(FPC)軟板.FlexuralFailure撓曲損壞.FlexuralModule彎曲模數,抗撓性模數.FlexuralStrength抗撓強度.FlipChip覆晶,扣晶.Flocculation絮凝.FloodStrokePrint覆墨沖程印刷.FlowSoldering(WaveSoldering)流焊.Fluorescence熒光.FlurocarbonResin碳氟樹脂.FlushConductor嵌入式線路

,貼平式導體.FlushPoint閃火點.Flute退屑槽.Flux助焊劑.FoilBurr銅箔毛邊.FoilLamination銅箔壓板法.Foot殘足(干膜殘余物).FootPrint(LandPattern)腳墊.ForeignMaterial外來物,異物.Form-to-List布線說明清單.FourPointTwisting四點扭曲法.FreeRadical自由基.Freeboard干舷.Frequency頻率.Frit玻璃熔料.Fully-AdditiveProcess全加成法.FungusResistance抗霉性.FusedCoating熔錫層.Fusing熔合.FusingFluid助熔液.

*****G*****G-10由連續玻纖所織成的玻纖布與環氧樹脂粘結劑所復合成的材料.Gage,Gauge量規.GalliumArsenide(GaAs)砷化鎵.GalvanicCorrosion賈凡尼式腐蝕(電解式腐蝕).GalvanicSeries賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.GateArray閘列,閘極陣列.GelTime膠化時間.GelationParticle膠凝點.GerberData,GerberFile格博檔案(是美商Gerber公司專為PCB面線路圖形與孔位,所發展一系列完整的軟體檔案).GhostImage陰影.Gilding鍍金(現為:GlodPlating).GlassFiber玻纖.GlassFiberProtrusion/Gouging,Groove玻纖突出/挖破.GlassTransitionTemperature,Tg玻璃態轉化溫度.Glaze釉面,釉料.GlobTop圓頂封裝體.GloubleTest球狀測試法.Glycol(EthyleneGlycol)乙二醇.GoldenBoard測試用標準板.GrainSize結晶粒度.GrassLeak大漏.Grid標准格.GroundPlane/EarthPlane接地層.GroundPlaneClearance接地空環.GuidePin導針.Gull/WingLead鷗翼引腳.

*****H*****Halation環暈.HalfAngle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名.HardAnodizing硬陽極化.HardChromePlating鍍硬鉻.HardSoldering硬焊.Hardener(CuringAgent)硬化劑(或CuringAgent).Hardness硬度.Haring-BlumCell海固槽.Harness電纜組合.HayWire跳線.HeatCleaning燒潔.HeatDissipation散熱.HeatDistortionPoint(Temp)熱變形點(溫度).HeatSealing熱封.HeatSinkPlane散熱層.HeatTransferPaste導熱膏.HeatsinkTool散熱工具.Hertz(Hz)赫.HighEfficiencyParticulateAirFilter(HEPA)高效空氣塵粒過瀘機.HipotTest高壓電測.Hi-Rel高度靠度.Hit擊(鑽孔時鑽針每一次"刺下"的動作).HoldingTime停置時間.HoleBreakout孔位破出.HoleCounter數孔機.HoleDensity孔數密度.HolePreparation通孔准備.HolePullStrength孔壁強度.HoleVoid破洞.Hook切削刀緣外凸.HotAirLevelling噴錫.HotBarSoldering熱把焊接.HotGasSoldering熱風手焊.HTE(HighTemperatureElongation)高溫延伸性.HullCell哈氏槽.HybridIntegratedCircuit混成電路.HydraulicBulgeTest液壓鼓起試驗.HydrogenEmbrittlement氫脆.HydrogenOvervoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.

*****I*****I.C.Socket勣體電路器插座.Icicle錫尖.Illuminance照度.ImageTransfer影像轉移.ImmersionPlating浸鍍.Impedance阻抗.ImpedanceMatch阻抗匹配.Impregnate含浸.In-CircuitTesting組裝板電測.Inclusion異物,夾雜物.IndexingHole基准孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert,Insertion插接.InspectionOverlay套檢底片.InsulationResistance絕緣電阻.IntegratedCircuit(IC)勣體電路器.InterFace介面.Interconnection互連.IntermetallicCompound(IMC)介面共化物.InternalStress內應力.Interposer互邊導電物.InterstitialVia-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).IonCleanliness離子清潔度.IonExchangeResins離子交換樹脂.IonMigration離子遷移.Ionizable(Ionic)Contaimination離子性污染.Ionization游離,電離.IonizationVoltage(CoronaLevel)電離化電壓(電纜內部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國印刷電路板協會.Isolation隔離性,隔絕性.

*****J*****JEDEC(JointElectronicDevice

聯合電子元件工程委員會.EngineeringCouncil)J-LeadJ型接腳.JobShop專業工廠.Joule焦耳.JumperWire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.

*****K*****Kapton聚亞醯胺軟板.Karat克拉

(1克拉(鑽石)=0.2g

純金則24k金為100%的鈍金.Kauri-ButanolValue考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵KeyBoard鍵盤.KissPressure吻壓,低壓.KnoopHardness努普硬度.KnownGoodDie(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).KraftPaper牛皮紙.

*****L*****LamdaWave延伸平波.LaminarFlow平流.LaminarStructure片狀結搆.LaminateVoid板材空洞.Laminate(s)基板.LaminationVoid壓合空洞.Laminator壓膜機.Land孔環焊墊,表面焊墊.LandlessHole無環通孔.LaserDirectImaging(LDI)雷射直接成像.LaserMaching雷射加工法.LaserPhotogenerator(LPG),LaserPhotoplotter雷射曝光機.LaserSoldering雷射焊接法.LayBack刃角磨損.LayOut布線,布局.LayUp疊合.LayertoLayerSpacing層間距離Leaching焊散漂出,熔出.Lead引腳.LeadFrame腳架.LeadPitch腳距.LeakageCurrent漏電電流.Legend文字標記.Leveling整平.LiftedLand孔環(焊墊)浮起.Ligand錯離子附屬體.LightEmittingDiodes(LED)發光二極體.LightIntegrator光能累積器.LightIntensity光強度.LimitingCurrentDensity極限電流密度.LiquidCrystalDisplay(LCD)液晶顯示器.LiquidDielectrics液態介質.LiquidPhotoimagibleSolderMask,(LPSM)液態感光防焊綠漆.LocalAreaNetwork區域性網路.Logic邏輯.LogicCircuit邏輯電路.LossFactor損失因素.LossTangent(TanδDK)損失正切.LotSize批量.Luminance發光強度.Lyophilic親水性膠體.

*****M*****Macro-ThrowingPower巨觀分布力.MajorDefect主要(嚴重)缺點.MajorWeaveDirection主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.MassFinishing大量整面(拋光).MassLamination大型壓板.MassTransport質量輸送.MasterDrawing主圖.Mat蓆(用于CEM-3(CompositeEpoxyMaterial)的復合材料.)MatteSide毛面(電鍍銅皮(EDFoil)之粗糙面).Mealing泡點.MeanTimeToFailure(MTTF)故障前可用之平均時數.Measling白點.MechanicalStretcher機械式張網機.MechanicalWarp機械式纏繞.Mechanism機理.MembraneSwitch薄膜開關.MeniscographTest弧面狀沾錫試驗.Meniscus彎月面.MercuryVaperLamp汞氣燈.MeshCount綱目數.MetalHalideLamp金屬鹵素燈.Metallization金屬化.MetallizedFabric金屬化綱布.Micelle微胞.MicroWireBoard微封線板.Micro-electronios微電子.Microetching微蝕.Microsectioning微切片法.Microstrip微條.MicrostripLine微條線,微帶線.MicrothrowingPower微分布力.Microwave微波.Migration遷移.MigrationRate遷移率.Mil英絲.MinimumAnnularRing孔環下限.MinimumElectricalSpacing電性間距下限.MinorWeaveDirection次要織向.Misregistration對不准度.MixedComponmtMountingTechnology混合零件之組裝技術.Modem調變及解調器.Modification修改.Module模組.ModulusofElasticity彈性系數.MoistureandInsulationResistanceTest溼氣與絕緣電阻試驗.MoldRelease脫模劑,離型劑.Mole摩爾.Monofilament單絲.MotherBoard主機板,母板.MouldedCircuit模造立體電路機.MountingHole安裝孔.MountingHole組裝孔,機裝孔.MouseBite鼠齒(蝕刻后線路邊緣出現不規則缺口).Multi-Chip-Module(MCM)多晶片芯片模組.MultiwiringBoard(orDiscreteWiringBoard)復線板.

*****N*****N.C.數值控制.NailHead釘頭.NearIR近紅外線.Negative負片,鑽尖的第一面外緣變窄.NegativeEtch-back反回蝕.NegativeStencil負性感光膜.Negative-ActingResist負性作用之阻劑.Network綱狀元件.Newton牛頓.NewtonRing牛頓環.NewtonianLiquid牛頓流體.Nick缺口.N-MethylPyrrolidine(NMP)N-甲基四氫嗶咯.NobleMetalPaste貴金屬印膏.Node節點.Nodule節瘤.Nomencleature標示文字符號.NominalCuredThickness標示厚度.Non-CircularLand非圓形孔環焊墊.Non-flammable非燃性.Non-wetting不沾錫.NormalConcentration

(Strength)標準濃度,當量濃度.NormalDistribution常態分布.Novolac酯醛樹脂.Nucleation,Nucleating核化.NumericalControl數值控制.Nylon尼龍.

*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(OxyenFreeHighConductivity)無氧高導電銅.Ohm歐姆.Oilcanning蓋板彈動.OLB(OuterLeadBond)外引腳結合.Oligomer寡聚物.OmegaMeter離子污染檢測儀.OmegaWave振盪波.On-ContactPrinting密貼式印刷.Opaquer不透明劑,遮光劑.OpenCircuits斷線.OpticalComparater光學對比器(光學放大器.)OpticalDensity光密度.OpticalInspection光學檢驗.OpticalInstrument光學儀器.OrganicSolderabilityPreservatives(OSP)有機保焊劑.Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap鑽尖點分離.Overpotantial(Overvoltage)過電位,過電壓.Oxidation氧化.OxygenInhibitor氧化抑制劑.OzoneDepletion臭氧層耗損.

*****P*****Packaging封裝,搆裝.Pad焊墊,圓墊.PadMaster圓墊底片.PadsOnlyBoard唯墊板.Palladium鈀.Panel制程板.PanelPlating全板鍍銅.PanelProcess全板電鍍法.PaperPhenolic紙質酚醛樹脂(板材).PartingAgent脫膜劑.Passivation鈍化,鈍化外理.PassiveDevice(Component)被動元件(零件)Paste膏,糊.Pattern板面圖形.PatternPlating線路電鍍.PatternProcess線路電鍍法.PeakVoltage峰值電壓.PeelStrength抗撕強度.PeriodicReverse(PR)Current周期性反電流.Peripheral周邊附屬設備.Permeability透氣性,導磁率.Permittivity誘電率,透電率.pHValue酸堿值.Phase相.PhaseDiagram相圖.Phenolic酚醛樹脂.Photofugitive感光褪色.Photographicfilm感光成像之底片.Photoinitiator感光啟始劑.Photomask光罩.Photoplotter,Plotter光學繪圖機.Photoresist光阻.PhotoresistChemicalMachinning(Milling)光阻式化學(銑刻)加工.Phototool底片.Pickand

Place拾取與放置.Piezoelectric壓電性.Pin插腳,插梢,插針.PinGridArray(PGA)矩陣式針腳對裝.Pinhole針孔.PinkRing粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點.PlainWeave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.PlatedThroughHole鍍通孔.Platen熱盤.Plating鍍.Plotting標繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.PneumaticStretcher氣動拉伸器.PogoPin伸縮探針.Point鑽尖.PointAngle鑽尖面.PointSourceLight點狀光源.Poise泊."粘滯度"單位=1dyne*sec/cm2.PolarSolvent極性溶劑.Polarity電極性.Polarization分極,極化.PolarizingSlot偏槽.PolyesterFilms聚酯類薄片.PolymerThickFilm(PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.PopcornEffect爆米花效應.Porcelain瓷材,瓷面.PorosityTest疏孔度試驗.PositiveActingResist正性光阻劑.PostCure后續硬化,后烤.PostSeparation后期分離,事后公離.PotLife運用期,鍋中壽命.Potting鑄封,模封.PowerSupply電源供應器.Preform預制品.Preheat預熱.Prepreg膠片,樹脂片.PressPlate鋼板.Press-FitContact擠入式接觸.PressureFoot壓力腳.Pre-tinning預先沾錫.PrimaryImage線路成像.PrintThrough壓透,過度擠壓..Probe探針.ProcessCamera制程用照像機.ProcessWindow操作范圍.ProductionMaster生產底片.Profile輪廓,部面圖,升溫曲線圖稜線.Propagation傳播.PropagationDelay傳播延遲.PuddleEffect水坑效應.PullAway拉離.PulsePlating脈沖電鍍法.PumicePowder