一诺银合金丝产品介绍-XX1203

27五月2023一诺银合金丝产品介绍-XX1203烟台一诺电子材料有限公司YantaiYesNoElectronicMaterialsCo.,Ltd

您值得信赖的伙伴和朋友产品介绍IntroductionsofProducts2烟台一诺电子材料有限公司◆键合丝Bondingwire银键合丝Silverbondingwire铜键合丝Copperbondingwire铝键合丝Aluminumbondingwire◆靶材、蒸发材Evaporating/TargetMaterials主要内容

Content

3烟台一诺电子材料有限公司◆金/银/铜/铝等键合丝

Gold/Silver/Aluminum/Copperetc.Bondingwire

◆贵金属蒸发材、靶材、焊线，以及用于特殊用途的合金材料Evaporatingpreciousmetal,TargetMaterials,Solderwireandotheralloyformultipurposeapplications◆航空发动机/辐射保护等材料

Aeroengine/Radioprotectionetc.materials

主要产品和服务(1/2)

MainlyProducts&Services

4烟台一诺电子材料有限公司主要产品和服务(2/2)

MainlyProducts&Services

AltargetAg/Auforevaporation

银键合丝AgBondingWire

铜键合丝CuBondingWire

金键合丝AuBondingWire

铝键合丝AlBondingwire5烟台一诺电子材料有限公司6N高纯原料

棒材合金化丝材成品的丝材成品（一）键合丝BondingWire键合丝工艺流程Bondingwireprocessflow6烟台一诺电子材料有限公司良好的焊接化合性能，没有虚焊，最大程度减少对芯片的损害键合丝和键合过程BondingWireandBondingProcess线轴表面清洁、尺寸精确，好的放线性能成弧规则、均匀、稳定，足够的强度成球尺寸、硬度合适，表面圆滑，尽可能减少氧化和污染EFO表面清洁，间隙正确稳定，电流、时间合适，兼顾合适的成球和效率键合丝要求尺寸精确，清洁，无污染，无损伤Bondingwiremustbeinrightsize,clean,andnodamage.Thespoolmustbeclean,inright,andhavegooddespoolingpropertyCleansurface,stablegap,rightcurrentandtimetoFABTheloopmustbeequal,uniform,stableandhardenoughGoodbondingperformance,novirtualwelding,dolittleharmtochips.RightFABandhardness,smoothing,littleoxideandcontamination.尺寸合适，表面光滑，没有污染损伤，尽可能减少与线材的摩擦Capillary:inrightsize,clean,smoothing,nodamage,lowfrictionwithwire.7烟台一诺电子材料有限公司物理性能参数(金银铜铝)Physicalproperties(Au,Ag,Cu,Al)项目Item单位Unit金Au银Ag铜Cu铝Al铝硅Al-1%Si钯Pd熔点MeltingPoint℃106396210836606301555沸点BoilingPoint℃2860216325952767—3167密度Densityat20℃g/㎡19.3210.438.962.72.712.16电阻率ElectricalResistanceΩ·cm2.31.621.72.72.812.16热传导率(at20℃)Thermo-conductivityW/m.K29542039523619675线膨胀率Coefficientsofexpansion—14.218.917.524.624.511.5杨氏模量YoungModulusKN/mm2788312870.565126刚性模量RigiditymodulusKN/mm22731452626.2558烟台一诺电子材料有限公司熔断电流对比(1/2)Comparisonsoffusingcurrents熔断电流数值的获得根据实验条件的不同会有略微的差异。Slightlydifferencesmayexistduetodifferentexperimentconditions.AgWireFusingCurrent(Amp)

Dia.(um)1820232530WireLength(mm)

0.54.284.587.157.1510.2812.152.283.583.585.251.51.211.552.382.383.520.981.151.791.792.582.50.860.931.441.442.0530.750.761.21.21.72

CuWireFusingCurrent(Amp)

Dia.(um)1820232530WireLength(mm)

0.53.954.166.56.59.3611.962.083.253.254.681.51.11.392.172.173.1220.891.041.631.632.342.50.780.831.31.31.8730.670.691.081.081.56

AuWireFusingCurrent(Amp)

Dia.(um)1820232530WireLength(mm)

0.53.293.475.435.437.8111.671.742.712.713.911.50.961.161.811.812.620.730.871.361.361.952.50.60.691.091.091.5630.520.580.90.91.39烟台一诺电子材料有限公司熔断电流长度：1mmI=Kd3/2I：MaximumcurrentinAmpsd：WirediameterininchesK：Materialsconstant,熔断电流计算公式直径熔断电流对比(2/2)Comparisonsoffusingcurrents10烟台一诺电子材料有限公司金属间化合物增长对比ComparisonsofIMC

IMC增长对比Timeofdiffusionlayerformedto10nm(200℃)TestConditionBakingTemp.:175℃BakingTime:1000hr11烟台一诺电子材料有限公司键合丝使用成本比较（1/2）Costcomparisonsofdifferentbondingwires项目金丝铜丝镀钯铜丝银丝价格非常高很低较高较高设备成本正常需要改设备需要改设备正常保护气体无混合气混合气建议N2成品率高很底较高比较高储存期限1年3个月6个月1年风险无很高很高无ItemsAuCuPdCuAgPriceVeryhighlowRelativelyhighRelativelyhighEquipmentcostRegularNeedchangeNeedchangeRegularProtectivegasNoneGasmixtureGasmixtureSuggestN2YieldHighVerylowRelativelyhighRelativelyhighShelflife1year3months6months1yearRiskNoneVeryhighVeryhighNone12烟台一诺电子材料有限公司键合丝使用成本比较（2/2）Costcomparisonsofdifferentbondingwires价格比较Pricecomparisons:综合成本比较Comprehensivecostcomparisons:综合上述成本，银丝的价格略低于镀钯铜丝，高于铜丝大约2倍，远低于金丝。考虑到铜丝的控制风险，银丝为最佳选择。Aboveall,thepriceofAgwireisalittlelowerthanPdplatingofCuwire,2timeshigherthanCuwire,andfarlowerthanAuwire.InconsiderationofthecontrolriskofCu,Agwireischosentobethebest.13烟台一诺电子材料有限公司

SilverBondingWire-------theworld’sfirst键合银丝——世界首创广泛应用于发光管和部分分立器件及IC。WidelyusedinLEDandsomeTR、IC.

（1）键合银丝AgBondingWire

高纯原材料：主要原材料（6N铜，5N银，及合金）由美国一诺自制，现与山东国大捷克萨菲纳、招金精炼合作，运用电解区熔等高纯提纯工艺，保证6N的高纯银原料的生产：性能和质量的稳定性较高的抗腐蚀和抗氧化性杂质元素ImpurityCuBiNiFeCaMgSeZnTe含量Content≤0.1≤0.05≤0.05≤0.01≤0.05≤0.01≤0.01≤0.05≤0.05HighPurityAgRawMaterial：MainMaterials(6NCu,5NAg,andAlloy)comefromYesNoAmerica.Agrawmaterialisguaranteedbyusingelectrolyticzonemeltingpurificationmethod,andcooperatedwithShandongGuodasafinaGroupandZhaojinGroup.Stabilityofperformanceandquality.Goodcorrosionresistanceandoxidationresistance.14烟台一诺电子材料有限公司优点Advantages◆较好的导电和导热性能Goodelectricandthermalconductivity◆较好的抗腐蚀和抗氧化性能（与铜比较）Goodcorrosionandoxidativeresistance(ComparedwithCu)◆仅需氮气保护，比较安全（与铜比较）N2asprotectivegasonly(ComparedwithCu)◆硬度较低（铜比较）Lowerhardness(ComparedwithCu)◆成本较低-金的1/5-6Lowerprice-1/5-6toAu缺点Disadvantages◆加工性能较差，制造成本较高Poorprocessperformanceandhighmanufacturingcost◆成本是铜的的2-3倍cost2-3timeshigherthanCu银丝的特点FeaturesofAgBondingWire挑战Challenges◆IMC控制（Ag的电子迁移问题目前已经基本解决）ThecontrolofIMC(TheproblemofelectrontransferofAgisbasicallyresolved)15烟台一诺电子材料有限公司银丝机械性能参数MechanicalpropertiesofAgbondingwire更多参数请登录我公司网站或咨询我公司服务人员。Pleaseloginthewebsiteofourcompanyorconsultustogetmoreinformation.DiameterAg(㎛)(mil)YA99YA95YA88YA80YAB/L(gf)E/L(%)150.6＞1.5＞2＞3＞42～8180.7＞4＞5＞6＞72～10200.8＞5＞6＞7＞82～10230.9＞7＞8＞10＞112～15251.0＞9＞10＞12＞132～15301.2＞13＞15＞16＞175～20331.3＞17＞18＞19＞205～20381.5＞21＞22＞24＞255～20502.0＞36＞38＞40＞425～2516烟台一诺电子材料有限公司银丝和真球硬度AgWire&FABHardness标题17烟台一诺电子材料有限公司银丝的热影响区HAZofAgbondingwires弧高Loopheight热影响区小于弧高，可以最大程度保证线弧的强度和稳定性。BallNeckHeataffectedzoneThestrengthandstabilityofloopcouldbeguaranteedwhentheheightofHAZislessthantheloop.18烟台一诺电子材料有限公司银丝焊接性能WeldingperformanceofAgbondingwire实验条件Experimentconditions0.8mil；高温200℃储存，0-300小时；检测速度：100um/sec；检测数量：50。0.8mil,storagedunder200℃for0-300hours,detectionspeed:100um/sec,detectionquality:50.BallShearTestBondPullTest19烟台一诺电子材料有限公司银丝抗腐蚀性能CorrosionresistanceofAgbondingwire银会与氧缓慢反应生成氧化银（AgO和Ag2O），是对光敏感的灰白色固体，导电，100℃时分解为银和氧气，对键合基本没有影响。银在有氧的环境下易硫化（Ag+H2S+O2=Ag2S+H2O），硫化银呈灰黑色，导电性较差，会影响焊接性能。故银丝的键合时建议加氮气保护，隔离氧气，除此以外，银很稳定，一般不会被其他离子腐蚀。AgOAg2OSilverAg2S试验条件：0.1mol/L硫化钠水溶液，0-200小时。Experimentcondition:0.1mol/LNa2Ssolutiondippingfor0-200hours.AgoxidestobeAgOandAg2O,whichiselectricalconductionandwilldecomposeintoAgandO2.Thisreactiondolittleharmtobonding.AgalsocanreactintoAg2S（Ag+H2S+O2=Ag2S+H2O）,whichhaspoorelectricalconductionandaffectbondingseriously.Aboveall,thebondingprocessofAgshouldbeprotectedbyN2.20烟台一诺电子材料有限公司银丝应用范围ApplicationsofAgbondingwiresYA99YA95YA88YA80低端LED低端TRLEDTRICCARDQFNTSOPFlashMemo中高端封装LEDQFPTSSOPQFNDFNICCARDMQFPPBGATQFPBGAFlashMemo中高端封装TQFPTSSOPPBGABGA高端封装键合银丝的发展将逐步走向以一种型号适应不同的封装形式。Agbondingwirewithsingletypewillgraduallyadapttodifferentpackagingforms.21烟台一诺电子材料有限公司银丝的应用趋势AgBondingWireApplicationTrend2011201420162018封装形式随着键合银丝研究的深入，键合银丝将越来越适应小型化、薄型化封装形式发展，是未来取代昂贵金丝的最佳产品。WiththedeepeningresearchonAgbondingwire,itwillmoreandmoreadapttotheminiaturizationandthinpackagingforms.ItwillreplaceAuwhichisexpensiveinthefuture.Packagingforms22烟台一诺电子材料有限公司银丝专利及RoHS证书OurpatentandRoHScertificateofAgbondingwire23烟台一诺电子材料有限公司

为什么选择铜丝(1/3)

WhyCuwire

由上可见，铜原料的价格相对金来说基本上可以忽略不记，但由于加工的成本较大，实际从线材价格来对比的话铜丝仅为金丝的10%左右。It’sclearthatthepriceofCucanbeignoredcomparedwithAu.Butduetoit’shighprocessingcost,theactualpriceofCuwireisonlyabout10%oftheAuwire.

PriceofCuin5yearsPriceofAuin5years（2）键合铜丝CuBondingWire24烟台一诺电子材料有限公司

为什么选择铜丝(2/3)

WhyCuwire

项目Item单位Unit金Au银Ag铜Cu铝Al铝硅Al-1%Si钯Pd熔点MeltingPoint℃106396210836606301555沸点BoilingPoint℃28602163259527673167密度Densityat20℃g/㎡19.3210.438.962.72.712.16电阻率ElectricalResistanceΩ·cm2.31.621.72.72.812.16热传导率(at20℃)Thermo-conductivityW/m.K29542039523619675线膨胀率Coefficientsofexpansion14.218.917.524.624.511.5杨氏模量YoungModulusKN/mm2788312870.565126刚性模量RigiditymodulusKN/mm22731452626.25525烟台一诺电子材料有限公司

为什么选择铜丝(3/3)

WhyCuwire

熔断电流(Fusingcurrent)1mm26烟台一诺电子材料有限公司

铜丝的特性–优点（1/2)

FeaturesofCubondingwire-advantage

更高的机械性能保证了线弧的稳定，不易形成塌丝或者歪丝。Highermechanicalguaranteesthestabilityoftheloop.Saggingandsweepingarenoteasilyformed.27烟台一诺电子材料有限公司金属间化合物（IMC）生长缓慢，提高可靠性。ThereliabilityareenhancedbecauseoftheslowgrowthofIMC.

铜丝的特性–优点（2/2)

FeaturesofCubondingwire-advantage

28烟台一诺电子材料有限公司1.易氧化，储存及键合期间需采用专门设备及气体进行保护。TheoxidationofCu,specialequipmentsandgasesareneededtoprotectitduringbondingandstorage.2.硬度比较大，容易对芯片造成伤害。ThepadislikelytobedamagedbecauseofthehighhardnessofCu.3.焊接球下面的铝层厚度的不规则减少,可能会导致铜铝金属间渗透的可靠性失效。

AlextrusionhappenswhenCuisbondingtosofterAlbysupersonic,whichleadtoshortcircuitandirregularreduceofAlthickness.4.硅弹坑和焊接垫下开裂。Twofailuremodes:SicrateringandPadcracking.

铜丝的特性–缺点

FeaturesofCubondingwire-disadvantage

29烟台一诺电子材料有限公司柔性铜丝专利及RoHS证书

OurpatentsandRoHScertificateofsoftCubondingwire针对上述铜丝的缺陷，我公司专门研发一款柔性铜丝来解决上述问题，并且取得了国家发明专利。AimedatthedisadvantagesofCu,asoftCuwirewasdevelopedtoresolvetheproblemsandgotinventionpatentbyourcompany.30烟台一诺电子材料有限公司YesNo铜丝的机械性能(1/2)

MechanicalpropertiesofCubondingwireDiameterCu(㎛)(mil)YC1,YC3YC2,YC4YCB/L(gf)E/L(%)180.7＞3＞45～10200.8＞5＞65～10230.9＞8＞98～16251.0＞10＞128～16301.2＞15＞1810～20331.3＞18＞2010～20351.4＞20＞2210～20381.5＞23＞2510～20502.0＞38＞4215～25YC15N高纯铜丝，硬度低，较好的成球性能Highpurity(5N)，lowhardness，goodFABYC23N通用铜丝，有一定的抗疲劳性GoodfatigueresistanceYC34N柔性铜丝，硬度较低FlexibleCuwire,lowhardnessYC42N抗氧化铜丝，同时楔形焊接性能较好Anti-oxidationCuwire,goodwedgeweldingperformance31烟台一诺电子材料有限公司上图：中心线上有明显压痕的焊球照片；下图：铜和金球焊随位置函数变化的硬度与FAB硬度的对比图。上图：FEM模拟显示了一个焊球内部的应力；下图：Cu球焊的横截面（4hrsat250℃）说明了Al衬垫的变形和薄的Cu-Al相。YesNo铜丝的机械性能(2/2)

MechanicalpropertiesofCubondingwire32烟台一诺电子材料有限公司Hardness

TypeYC1YC2YC33NGoldBallpart65856858Wirepart751108070TestConditionWiredia.:1.0MilM/C:MitutoyoMVK-H3TestLoad:3grLoadingTime:10sec

键合铜丝的硬度

HardnessofCubondingwire

33烟台一诺电子材料有限公司HAZTypeHAZLength(㎛)BallNeckGrain(㎛)WireGrain(㎛)YC1135~1807.0~10.03.5~5.0YC2100~1303.0~4.01.5~2.0YC3110~1506.0~8.03.0~4.0EtchingCondition-.Etchant:10㎖HNO3+10㎖D.I.Water)-.EtchingMethod:FumingMethod-EtchingTime:1~10sec.HAZLength（μm）YC1

YC2

YC3

100110120130140150160170180BallNeckGrain(μm)YC1

YC2

YC3

3.04.05.06.07.08.09.010.0WireGrain(μm)YC1

YC2

YC3

1.52.02.53.03.54.04.55.0

键合铜丝的热影响区

HAZofCubondingwire

34烟台一诺电子材料有限公司ElectricalPropertyWiredia.Fusingcurrent(A)

YC3

3Ngold(Mil)L=5㎜L=10㎜L=10㎜0.80.500.500.500.90.600.600.601.00.700.650.651.20.900.700.681.51.200.950.902.01.801.301.003.03.102.451.204.04.803.801.705.06.605.301.90

YC1YC2YC34NgoldAuResistivity(uΩ·㎝)1.671.981.872.322.655

键合铜丝的电气性能

ElectricalpropertyofCubondingwire

35烟台一诺电子材料有限公司注：所有键合丝的挑断力和剪切力测试数据见规格书。Remark:Allofwirepull&ballsheardataismeetSpec.

键合铜丝的焊接性能

WeldingpropertyofCubondingwire

36烟台一诺电子材料有限公司铜丝目前最大的问题是氧化，尤其是储存及键合期间的保护非常重要。ThelargestproblemistheoxidationofCu,sotheprotectduringstorageandbondingareespeciallyimportant.CopperCu2OCuOCu4O(SO4)(OH)6Cu5O(SO4)(OH)3CuCl2CuNO3铜丝与金丝和银丝最大的不同在于铜丝易氧化，焊线过程中因放电即基板加热，会形成氧化铜，造成FAB球型不圆，易形成虚焊，且氧化铜很容易与其他酸根离子反应。CuwilloxideintoCuOduringbonding,whichcanmadebadFABandleadtoNSOPorNSOL.CuOalsocanreactwithotheracidradicalionseasily.<1000℃:2Cu+O2→2CuO>1000℃:4CuO→2Cu2O+O2

键合铜丝的抗腐蚀性能

CorrosionresistanceofCubondingwire

37烟台一诺电子材料有限公司2009201120142018封装形式键合铜丝的应用

ApplicationsofCubondingwirePackageTypeYear38烟台一诺电子材料有限公司

为什么选择铝丝

WhyAlwire

适用于楔形焊接封装，主要应用于汽车电子，大功率传感器，大功率器件等。Alwireissuitabletowedgewelding,whichincludingautomotiveelectronics,high-powersensorandsomehigh-power-device.☆高可靠性Highreliability☆单一金属间键合，无IMC问题WithoutproblemsofIMC☆很好的热稳定性Goodthermalstability☆良好的抗腐蚀性能GoodcorrosionresistancepropertyAlwireAlpad（3）键合铝丝AlBondingWire39烟台一诺电子材料有限公司

铝丝的特点(1/2)

FeaturesofAlbondingwire

YL1高纯型铝丝(5N)YL1highpurityAl(5N)良好的成弧性能和稳定性，并有一定的抗腐蚀性能。Goodloopshape,stabilityandcorrosionresistanceproperty.适用于大部分要求较高的功率器件，适用范围广，价格