SMD专业术语中英文对照电子类知识宝典

SMD常用术语微组装技术:MPT/MicroelectronicPackagingechnology混装技术:MixedComponentMountingTechnology封装：Package贝占片：PickandPlace拆焊：Desoldering再流：Reflow浸焊：DipSoldering拖焊:Dragsoldering印制电路：PrintedCircuit印制线路：PrintedWiringER制电路板：printedcircuitboardER制线路板：printedwiringboard层压板:laminate覆铜薄层压板：copper-cladlaminate基材:basematerial成品板:productionboardER刷：printing导电图形:conductivepatternprintedcomponent单面印制板:single-sidedprintedboard双面印制板：double-sidedprintedboard多层印制板：multilayerprintedboard电烙铁：Iron热风嘴:hotairreflowingnoozle吸锡带：solderingwick吸锡器：tinextractor焊后检验:post-solderinginspection目视检验：visualinspection机器检验：machineinspection焊点质量:solderingjointquality焊电缺陷：solderingjontdefect错焊:solderwrong漏焊:solderskips虚焊：pseudosoldering冷焊：coldsoldering桥焊：solderbridge脱焊:opensoldering焊点剥离：solderoff不润湿焊点:solderingnonwetting锡珠：solderball拉尖：icicle;solderprojection孔洞：void焊料爬越：solderwicking过热焊点:overheatedsolderconnection不饱和焊点:insufficientsolderconnection过量焊点:excesssolderconnection微组装技术:MPT/MicroelectronicPackagingechnology混装技术:MixedComponentMountingTechnology封装：Package贝占片：PickandPlace拆焊：Desoldering再流：Reflow浸焊：DipSoldering拖焊:Dragsoldering印制电路：PrintedCircuit印制线路：PrintedWiringER制电路板：printedcircuitboardER制线路板：printedwiringboard层压板:laminate覆铜薄层压板：copper-cladlaminate基材：basematerial成品板：productionboardER刷：printing导电图形:conductivepatternER制组件:printedcomponent单面印制板：single-sidedprintedboard双面印制板：double-sidedprintedboard多层印制板：multilayerprintedboard电烙铁：Iron热风嘴:hotairreflowingnoozle吸锡带：solderingwick吸锡器：tinextractor焊后检验:post-solderinginspection目视检验：visualinspection机器检验：machineinspection焊点质量:solderingjointquality焊电缺陷：solderingjontdefect错焊:solderwrong漏焊:solderskips虚焊：pseudosoldering冷焊：coldsoldering桥焊：solderbridge脱焊:opensoldering焊点剥离：solderoff不润湿焊点:solderingnonwetting锡珠：solderball拉尖：icicle;solderprojection孔洞：void焊料爬越：solderwicking过热焊点:overheatedsolderconnection不饱和焊点:insufficientsolderconnection过量焊点:excesssolderconnection助焊剂剩余：fluxresidue焊料裂纹：soldercrazeing焊角翘起：fillet-lifting；lift-offAI:Auto-Insertion自动插件AQL:acceptablequalitylevel允收水平ATE:automatictestequipment自动测试ATM:atmosphere气压BGA:ballgridarray球形矩阵CCD:chargecoupleddevice监视连接组件（摄影机）CLCC:Ceramicleadlesschipcarrier陶瓷引脚载具COB:chip-on-board芯片直接贴附在电路板上cps:centipoises（黏度单位）百分之——CSB:chipscaleballgridarray芯片尺寸BGACSP:chipscalepackage芯片尺寸构装CTE:coefficientofthermalexpansion热膨胀系数DIP:dualin-linepackage双内线包装（泛指手插组件）FPT:finepitchtechnology微间距技术FR-4:flame-retardantsubstrate玻璃纤维胶片（用来制作PCB材质）IC:integratecircuit集成电路IR:infra-red红外线Kpa:kilopascals（压力单位）LCC:leadlesschipcarrier弓I脚式芯片承载器MCM:multi-chipmodule多层芯片模块MELF:metalelectrodeface二极管MQFP:metalizedQFP金属四方扁平封装NEPCON:NationalElectronicPackageandProductionConference国际电子包装及生产会议ppm:partspermillion指每百万PAD（点）有多少个不良PAD（点）psi:pounds/inch2磅/英寸2PWB:printedwiringboard电路板QFP:quadflatpackage四边平坦封装SIP:singlein-linepackageSIR:surfaceinsulationresistance绝缘阻抗SMC:SurfaceMountComponent表面黏着组件SMD:SurfaceMountDevice表面黏着组件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏着设备制造协会SMT:surfacemounttechnology表面黏着技术SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小夕卜型封装SOT:smalloutlinetransistor晶体管SPC:statisticalprocesscontrol统计过程控制SSOP:shrinksmalloutlinepackage收缩型小外形封装TAB:tapeautomaticedbonding带状自动结合TCE:thermalcoefficientofexpansion膨胀（因热）系数Tg:glasstransitiontemperature玻璃转换温度THD:Throughholedevice须穿过洞之组件（贯穿孔）TQFP:tapequadflatpackage带状四方平坦封装UV:ultraviolet紫外线uBGA:microBGA微小球型矩阵cBGA:ceramicBGA陶瓷球型矩阵PTHlatedThruHole导通孔lAInformationAppliance信息家电产品MESH网目OXIDE氧化物FLUX助焊剂LGA（LandGridArry）封装技术LGA封装不需植球，适合轻薄短小产品应用。TCP（TapeCarrierPackage）ACFAnisotropicConductiveFilm异方性导电胶膜制程Soldermask防焊漆SolderingIron烙铁Solderballs锡球SolderSplash锡渣SolderSkips漏焊Throughhole贯穿孔Touchup补焊Briding襦接（短路）SolderWires焊锡线SolderBars锡棒GreenStrength未固化强度（红胶）TransterPressure转印压力（印刷）ScreenPrinting刮刀式印刷SolderPowder锡颗粒Wettengability润湿能力Viscosity黏度Solderability焊锡性Applicability使用性Flipchip覆晶DepanelingMachine组装电路板切割机SolderRecoverySystem锡料回收再使用系统WireWelder主机板补线机X-RayMulti-layerInspectionSystemX-Ray孔偏检查机BGAOpen/ShortX-RayInspectionMachineBGAX-Ray检测机PrepregCopperFoilSheeterP.P.铜箔裁切机FlexCircuitConnections软性排线焊接机LCDReworkStation液晶显示器修护机BatteryElectroWelder电池电极焊接机PCMCIACardWelderPCMCIA卡连接器焊接LaserDiode半导体雷射IonLasers离子雷射Nd:YAGLaser石榴石雷