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In-situobservationofBGAsolderingClassificationofBGAsolderingfailuremodeCasestudyforBGAsolderingOutlineIn-situobservationofBGAso11-1ObservationofBGAsolderinggapchangeIn-situobservationofBGAsolderingPeakTemp.Coolingdown1-1ObservationofBGAsolderi2PKGPCBSoldersphereSolderpasteFluxcleantinoxideSolderball&pastemeltatmeltingpointThickeroxideandweakerfluxactivitycausednon-meltingDuringpeak&coolingNon-meltingcausedheadinpillowReflowProfileofProcessPKGPCBSoldersphereSolderpast3ClassificationofBGAsolderingfailuremodeSMTBGA双球枕头效应原因分析及改善对策课件4a.
Voidb.Bridged.Cracke.Head-in-Pillowf.Non-wettingc.Missingballa.Voidb.Bridged.Cracke.Hea5g.de-wettingh.shifti.solderballg.de-wettingh.shifti.solder6Head-in-pillowheatingheatingcoolingPeakTempHead-in-pillowheatingheatingco7BGAassemblyproblemanalysisBGAproblemComponent(84.8%)PCB(6.1%)Solderpaste(3.0%)SMTprocess(6.1%)BGAballpollution(45%)Padpollution(18.2%)others(9.1%)warpage(12.1%)Profile(3.0%)Pick&place(3.0%)Weakactivity(3.0%)warpage(3.0%)PADpollution(3.0%)BGAassemblyproblemanalysisB8VoidReflowPCBsubstrateBGAballPasteFluxPowdersizealloycompositionActivatorViscosityOxidationcontaminationCleannessshelflifeSurfacefinishDesignofpadOxidationofpadDegausstimingBridgeProcessSubstrateSolderFluxBendingMissmountingSlumpVoidReflowPCBsubstrateBGAbal9DewettingPCBsubstrateBGAballPasteFluxAlloycompositionOxidationcontaminationCleanness&shelflifeSurfacefinishOxidationofpadActivatorCrackPCBsubstrateSolderReflowconditionAlloycompositionDesignBendingDewettingPCBsubstrateBGAball10PillowAssemblyDeviceSolderBallSubstrateSurfaceissueShapeIssueCompositiondesignSplitSurfaceoxidationResidueoffluxContamination
Co-planarityBallsizedesignBendingSubstrate(PCB)PasteReflowMountingBendingAlloycompositiondesignPrintingTackinessdecayHeightorvolumeinsufficientFluxactivatorefficiencyHeatinsufficientOver-preheatFluxactivatordecayOxidationofBGAballHalf-meltingornon-meltingPickingPrecisionBGAPillowAssemblyDeviceSolderBal11CaseStudyBGAHead-in-pillowdefectissueCaseStudy12
Head-in-pillowcross-sectionviewHead-in-pillowcross-section13Componentinspection
TherearesomeblackareasonthesolderballComponentinspectionThereare14SEM-EDSanalysisNormalsurface:C、O<10%TheblackareahasS、Brelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisNormalsurface15SEM-EDSanalysisNormalsurfacehashigherOxygencontentTheblackareahasSelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisTheblackarea16SEMinspectionSEMinspection17SEMinspectionSEMinspection18SEMinspectionSEMinspection19SMTreflow-Profile
Redsettingprofile
GreenrealprofileSMTreflow-ProfileRedsettin20SMTreflow-Shenmaosolderpaste
pre-heatHeatingto220℃Heatingto230℃Heatingto210℃SMTreflow-Shenmaosolderp21Coolingto235℃Coolingto225℃Heatingto244℃Heatingto
240℃SMTreflow-Shenmaosolderpaste
Coolingto235℃Coolingto225℃22Coolingto100℃Coolingto215℃Shenmaosolderpastedoesnothaveheadinpillowresultduetogoodfluxperformance.SMTreflow-Shenmaosolderpaste
Coolingto100℃Coolingto215℃23
Thanksforyourattention!Thanksforyourattention!24
In-situobservationofBGAsolderingClassificationofBGAsolderingfailuremodeCasestudyforBGAsolderingOutlineIn-situobservationofBGAso251-1ObservationofBGAsolderinggapchangeIn-situobservationofBGAsolderingPeakTemp.Coolingdown1-1ObservationofBGAsolderi26PKGPCBSoldersphereSolderpasteFluxcleantinoxideSolderball&pastemeltatmeltingpointThickeroxideandweakerfluxactivitycausednon-meltingDuringpeak&coolingNon-meltingcausedheadinpillowReflowProfileofProcessPKGPCBSoldersphereSolderpast27ClassificationofBGAsolderingfailuremodeSMTBGA双球枕头效应原因分析及改善对策课件28a.
Voidb.Bridged.Cracke.Head-in-Pillowf.Non-wettingc.Missingballa.Voidb.Bridged.Cracke.Hea29g.de-wettingh.shifti.solderballg.de-wettingh.shifti.solder30Head-in-pillowheatingheatingcoolingPeakTempHead-in-pillowheatingheatingco31BGAassemblyproblemanalysisBGAproblemComponent(84.8%)PCB(6.1%)Solderpaste(3.0%)SMTprocess(6.1%)BGAballpollution(45%)Padpollution(18.2%)others(9.1%)warpage(12.1%)Profile(3.0%)Pick&place(3.0%)Weakactivity(3.0%)warpage(3.0%)PADpollution(3.0%)BGAassemblyproblemanalysisB32VoidReflowPCBsubstrateBGAballPasteFluxPowdersizealloycompositionActivatorViscosityOxidationcontaminationCleannessshelflifeSurfacefinishDesignofpadOxidationofpadDegausstimingBridgeProcessSubstrateSolderFluxBendingMissmountingSlumpVoidReflowPCBsubstrateBGAbal33DewettingPCBsubstrateBGAballPasteFluxAlloycompositionOxidationcontaminationCleanness&shelflifeSurfacefinishOxidationofpadActivatorCrackPCBsubstrateSolderReflowconditionAlloycompositionDesignBendingDewettingPCBsubstrateBGAball34PillowAssemblyDeviceSolderBallSubstrateSurfaceissueShapeIssueCompositiondesignSplitSurfaceoxidationResidueoffluxContamination
Co-planarityBallsizedesignBendingSubstrate(PCB)PasteReflowMountingBendingAlloycompositiondesignPrintingTackinessdecayHeightorvolumeinsufficientFluxactivatorefficiencyHeatinsufficientOver-preheatFluxactivatordecayOxidationofBGAballHalf-meltingornon-meltingPickingPrecisionBGAPillowAssemblyDeviceSolderBal35CaseStudyBGAHead-in-pillowdefectissueCaseStudy36
Head-in-pillowcross-sectionviewHead-in-pillowcross-section37Componentinspection
TherearesomeblackareasonthesolderballComponentinspectionThereare38SEM-EDSanalysisNormalsurface:C、O<10%TheblackareahasS、Brelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisNormalsurface39SEM-EDSanalysisNormalsurfacehashigherOxygencontentTheblackareahasSelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisTheblackarea40SEMinspectionSEM
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