MEMS数字麦克风基本知识课件

1、MEMS(数字)麦克风基本知识MEMS Microphone 产品简介 MEMS麦克风是由MEMS微电容传感器、微集成转换电路(放大器)、声腔及RF抗噪电路组成。MEMS微电容极头部分包含接收声音的硅振膜和硅背极,硅振膜可直接将接收到的音频信号经MEMS微电容传感器传输给微集成电路,微集成电路可将高阻的音频电信号转换并放大成低阻的音频电信号,同时经RF抗噪电路滤波,输出与手机前置电路相匹配的电信号.完成“声-电”转换. MEMS Microphone 工作原理MEMS Microphone 产品简介V outSilicon Back PlateSilicon diaphragmGNDRF Fi

2、lter MEMS Microphone Module StructureV supplyMEMS Acoustic SensorASICMEMS Microphone 产品简介MEMS WaferMEMS Die MEMS Microphone Wafer & MEMS DieMEMS Microphone 产品简介 MEMS Microphone ProfileAcoustic port hole LW H4213PIN# FUNCTION1.OUTPUT, 2.NO CONNECTION3.GROUND, 4.POWERMEMS Microphone 产品简介序号名称1Cover2Hou

3、sing3Wire bonding4PC Board5Capacitor 10pF6Capacitor 33pF7ASIC8MEMS Die MEMS Microphone Structure12367854MEMS Microphone 产品简介SpecificationMEMS MicrophoneFrequency range 100-10,000HzSensitivity (0dB=1V/Pa 1k Hz) -42dB+/-3dB Output impedance 58dBRF-filtering capacitance 10pF, 33pF, both or noneChange i

4、n sensitivity(电压特性) 1dB across voltage rangeStandard operating temperature -40 to + 100 Current consumption 0.25mASupply voltage ratings 1.5V to 3.6V Performance ComparisonMEMS Microphone 产品简介 Recommended Interface CircuitAAC MEMS MicrophoneTerm3.Term2.Term4Term1-+VrefExternal Gain=-R1/R2(Set by cus

5、tomer)+R2R1MEMS Microphone 产品简介 Solder Reflow ProfileMaximum solder profile: Do not exceed profile listed in this tableStageTemperature ProfileTime (Maximum)Pro-head170180 120sec.Solder MeltAbove 230 100sec.Peak260 Maximum30sec.Incoming InspectionWafer SawingWafer Expand SMT/glueingPackaging/Cutting

6、Testing / Marking / TapingShipping InspectionPacking Wafer Fabrication Packaging Wafer FoundryPick up and place MEMSWire BondingReliability TestWafer TestingWafer Inspection Production ProcessMEMS MicrophoneMEMS Microphone 产品简介Cellular Phone(CDMA, GSM, PCS), Camcorder Phone,MP3 Phone, PDA Phone etc.Camcorder, Digital Camera etc.Ear Phone MIC for Headsets, MP3, Bluetooth, etc.Notebook Computer,Desk-Top ComputerVideo Door Phone etc.Cordless Phone MEMS Wafe