CF制程原理介绍yao解析课件

1、RedGreenBlueWhiteGray Scale0816243240485663Color Number of LCDFor color depth 6 bits, There are 26 x 26 x 26 = 262,144 colorsFor color depth 8 bitsThere are 28 x 28 x 28 = 16,777,216 colors第1页，共25页。Scan LineData LineTFTPolarizerCFPolarizerPCBLight GuideLampLC cellTFT-LCD Structure第2页，共25页。TFT-LCD St

2、ructure第3页，共25页。TFT-LCD Structure第4页，共25页。The Operation Principles of LCDTake the 90o TN as the exampleData from：SHARPs website第5页，共25页。The Operation Principles of LCDTake the 90o TN as the exampleData from：SHARPs website第6页，共25页。Color Filter反面正面dotdotdot1個 Pixel第7页，共25页。裝可愛!第8页，共25页。CR glassAEI gla

3、ss(BM glass)ADI glass第9页，共25页。RR+GR+G+B第10页，共25页。R+G+B+ITOMVAPS第11页，共25页。Unpacker & Initial cleaner鉻膜濺鍍鉻玻璃清洗正光阻塗佈(1)素玻璃投入1.Cr sputtering鉻玻璃正光阻塗佈(2)Cr sputterCr glassPre-cleanerSlit coaterSpin coater2.CNVR05 line ( BM )黑色矩陣製程(BM patterning process)第12页，共25页。蝕刻去光阻紫外線曝光顯影去掉邊緣光阻EBR(Edge Bead Rinse)Align

4、erDeveloperDFIN073. PREC01 ( Etching )EtchingStrippingBM pattern glass真空乾燥Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateTitleDefect insp第13页，共25页。RGB製程(RGB process)紅色光阻塗佈(1)紅色光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterBM pattern glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Remove)AlignerDeveloper烘烤Oven1.CNVR06 Line真空乾燥

5、Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateDefect insp.第14页，共25页。RGB製程(RGB process)綠色光阻塗佈(1)綠色光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterR glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Remove)AlignerDeveloper烘烤Oven2.CNVR04 Line真空乾燥Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateDefect insp.第15页，共25页。RGB製程(RGB process)藍色光阻塗佈(1

6、)藍色光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterR,G glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Remove)AlignerDeveloper3.CNVR03 Line真空乾燥Vacuum Dryer預烘烤與冷卻Pre-bake & Cool plateDefect Inspection缺陷檢查機Defect insp.第16页，共25页。ITO製程(ITO sputtering process)ITO pre-cleaner氧化銦錫膜濺鍍ITO玻璃ITO sputterITO glassR,G,B璃投入UV asher紫外線

7、灰化烘烤Oven第17页，共25页。MVA製程(Multi-domain Vertical Alignment)正光阻塗佈(1)正光阻塗佈(2)Pre-cleanerSlit coaterSpin coaterITO glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Rinse)AlignerDeveloper烘烤Oven4.CNVR01 Line真空乾燥Vacuum DryerPre-bake & Cool plate預烘烤與冷卻Defect insp.第18页，共25页。PS製程(Photo Spacer)負光阻塗佈(1)負光阻塗佈(2)Pre-cleanerSlit

8、coaterSpin coaterITO/MVA glass清洗紫外線曝光顯影去掉邊緣光阻EBR (Edge Bead Rinse)AlignerDeveloper烘烤Oven4.CNVR02 Line真空乾燥Vacuum DryerPre-bake & Cool plate預烘烤與冷卻Defect insp.第19页，共25页。最終檢查(Final inspection)AOI Pre-cleaner光學檢查前清洗Macro inspection巨觀檢查Judgement判定Sorting&ShippingAOI (Auto -Opto Inspection)光學檢查Micro review

9、微觀檢查Repair修補第20页，共25页。CF 製程檢查項目1.黑色矩陣製程(BM patterning process)1.1.BM PHOTO & Etching LINE顯影後缺陷檢查ADI (After Developer Inspection)巨觀檢查( Macro review )1231.Total Pitch ( 長寸法)2.CD (Critical Dimension )3.Mark to Edge ( 端寸法 )蝕刻後缺陷檢查AEI (After Etcher Inspection)1724BAD4CEdcbaRGB第21页，共25页。2.RGB製程(RGB process)CF 製程檢查項目121.Pixel CD2.Overlay3.厚度(B之後)4.色度量測34.色度量測巨觀檢查5.巨觀檢查第22页，共25页。3.ITO製程(ITO Sputtering process)CF 製程檢查項目1.色度量測 2.阻值 3.Total pitch 4.巨觀檢查第23页，共25页。4.MVA製程(Multi-doma