液晶面板LCM模组生产流程简介

1、1 Chi Mei Optoelectronics Page2制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei

2、 Optoelectronics Page31st -外观检查 (Appearance Inspection)作法 : 以目视检查 目的：筛检LCD后流外观不良的Panel, 如缺角、玻璃刮伤、残胶、CF玻璃突出等注意事项：取放面板时易造 成玻璃缺角需特别小心；取放 擦拭面板时需戴静电环并极力 避免碰触到X、Y侧端子部分， 以免产生静电不良 Chi Mei Optoelectronics Page4制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净

3、Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page52nd -涂导电胶 (Conductive Resin Dispense)作法 : 在面板X、Y侧端子部分涂 上导电胶目的：增强面板防止静电破坏的能力注意事项：取放面板时易造成玻 璃缺角需特别小心；取放 面板时需戴静

4、电环并极力 避免碰触到X、Y侧端子 部分，以免产生静电不良 Chi Mei Optoelectronics Page6制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPa

5、cking包装Ware House.入库 Chi Mei Optoelectronics Page73rd - 磨边 (Beveling)重点：将面板X、Y侧端子部玻璃边磨平目的：将面板X、Y侧端子部玻璃 边磨平避免玻璃棱角刮伤人 员、部 品，并藉以消除玻 璃边内在应力避免玻璃受应 力而产生裂痕、缺角，并将 short bar 磨除注意事项：X、Y侧端子部玻璃边 磨平是高温高摩擦的动作 ，需注意磨边时机器喷水是 否正常，避免产生静电不良 Chi Mei Optoelectronics Page8制程重点解说.Appearance Inspection外观检查Conductive Resin D

6、ispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page94th - 异物括除 (Cullet Remove)作法：用刮刀刮除玻璃面板上的异物目的：刮刀刮除玻璃面板上的异物，避

7、免偏光板贴付时异物留存于面板与偏光板间造成不良注意事项：刮刀作动在面板上必须与面板平行接触，作动范围需涵盖整个面板 Chi Mei Optoelectronics Page10制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整A

8、ging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page115th - 洗净 (Wet Clean)作法：用洗净液将面板洗净目的：用洗净液将面板上之异 物冲洗干净 Chi Mei Optoelectronics Page12制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压

9、着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page136th - 贴偏光板 (Polarizer)作法：将上下偏光板贴付于面板 上下两侧目的：为使产品光学(影像)显示正常，面板需与上下偏光板贴合注意事项：上下偏光板与面板搭 配的方式条件决定产品合 光学特性，故上下偏光板 贴付的方向精度需符合规 格要求 Chi Mei Optoelectroni

10、cs Page14制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page1

11、57th - 脱泡 (Auto Clave)作法：将偏光板贴付完成品置入高温加压炉内目的：利用压力及高温将偏光板 与面板贴合时产生的气泡 挤压出来或压小、并使面 板与偏光板两者接合更紧 密注意事项：抬放Cassette时须小心 ，避免摔破面板 Chi Mei Optoelectronics Page16制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试

12、PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page178th - 点灯测试 (LOT)作法：将高温加压脱泡后半成品在LOT机台点灯检查目的：筛检磨边至偏光板贴付工 程造成的的不良（如偏光 板异物、偏光板胶等）及 前工程（LCD厂）后流的 品位不良品注意事项：检查工程需花费较多 的眼力精神更需要仔细与 耐心，确保不良不后流及 避免筛检过严，才能避免 材料浪费，成本损

13、失 Chi Mei Optoelectronics Page18制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Me

14、i Optoelectronics Page199th - OLB (TAB压着)作法：将面板与TAB IC藉由ACF接合目的：使面板端子Lead与TAB Lead准确对位藉由ACF 异方向导电的特性（上 下导通，左右绝缘）接 合导通，使面板内的 TFT能接收到TAB IC输 出的正确讯号和资料注意事项：生产前的点检、确 认事项必须确实 Chi Mei Optoelectronics Page20制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净P

15、olarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page2110th - OLBI (OLB测试)作法：将OLB半成品在OLBI机台点灯检查目的：检查OLB工程造成的的不 良（如线欠陷、short等）注意事项：拿取半成品需小心避 免碰触到TAB Lead，造成 TAB Lea

16、d曲折。检查工程 需花费较多的眼力精神更 需要仔细与耐心，确保不 良不后流及避免筛检过严 ，才能避免材料浪费，成 本损失 Chi Mei Optoelectronics Page22制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁

17、调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page2311th - PCB (PCB压着)作法：将PCBA与TAB IC藉由ACF接合目的：使PCBA Lead与TAB Lead准确对位藉由ACF 异方向导电的特性（上 下导通，左右绝缘）接 合导通，使PCBA输出 的逻辑控制讯号与资料 能正确传送到TAB IC输 入端注意事项：生产前的点检、确 认事项必须确实 Chi Mei Optoelectronics Page24制程重点解说.Appearance Inspection外观检查

18、Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page2512th - PCBI (PCB测试)作法：将PCB半成品在PCBI机台点灯检查

19、目的：检查PCB工程造成的的不 良（如线欠陷、阶调不良 等）注意事项：拿取半成品需小心， 避免碰撞PCBA，造成 TAB拉扯而撕开、脱落。 需花费较多的眼力精神 更需要仔细与耐心，确 保不良不后流及避免筛 检过严，才能避免材料 浪费，成本损失 Chi Mei Optoelectronics Page26制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试

20、PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page2713th - Silicone Dispense (涂防水胶)作法：将硅胶涂在面板X/Y侧端子部份上目的：防潮防腐蚀增加密合强度增加IC强度注意事项：胶量的多寡，多则容易溢出玻璃边或溢到玻璃上；少则防潮、防腐蚀、增加密合强度等需求特性会不足 Chi Mei Optoelectronics Page28制程重点解

21、说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page2914th - 组装 (As

22、sy.)作法：将背光板外框导电泡棉PCB COVERX/Y保护膜SCREW等物料与Panel组合目的：将PANEL与B/L组装成模组注意事项：确认物料的机种规格 B/L表面异物彻底清除 组装方式/流程PANEL 拿取方式 Chi Mei Optoelectronics Page30制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCB

23、IPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page3115th - 闪烁调整 ( Flicker Adjust)作法：利用螺丝起子调整可变电阻（Vcom)目的：将Vcom值调整至Flicker最佳状态（Flicker均匀、跳动最小）注意事项：依照规格值（ spec.）调整 Chi Mei Optoelectronics Page32制程重点解说.Appearance Inspectio

24、n外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page3316th - 高温烘烤 (Aging)作法：将模块放进Aging炉目的

25、：针对液晶在高温长期动作之测试及模块机构测试注意事项：温度确认、排线接合确认、程序确认 Chi Mei Optoelectronics Page34制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C Test

26、C检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page3517th - C检 (C Test)作法：将模块接上信号源目的：依品味检查注意事项：依照规格（spec. ）检查 Chi Mei Optoelectronics Page36制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测

27、试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page3718th - D检 (D Test)作法：将模块拿起来用眼睛左右前后检查看看目的：模块外观检查注意事项：组装是否完全崁合、外观是否有刮伤、部材是否错误或欠缺 Chi Mei Optoelectronics Page38制程重点解说.Appearance Inspection外观检查Conductive Res

28、in Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试Silicone Dispense涂防水胶Assy.组装Flicker Adjust闪烁调整Aging高温烘烤C TestC检D TestD检OQCPacking包装Ware House.入库 Chi Mei Optoelectronics Page3919th - OQC作法：将模块接上信号源、进行一连串的测试目的：确保产品品质是否符合顾客要求注意事项：依照顾客品质要求检查QC Chi Mei Optoelectronics Page40制程重点解说.Appearance Inspection外观检查Conductive Resin Dispense涂导电胶Beveling磨边Cullet Remove异物括除Wet Clean洗净Polarizer贴偏光板Auto Clave脱泡LOT点灯测试OLBTAB压