认识光罩以及简要的工艺流程

1、TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.认识认识Mask以及简要以及简要的制作流程的制作流程TMTMThis document is strictly confidential and proprietary of SMIC. It

2、must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.The Role of Mask in IC Industry DESIGNMASKWAFERTESTINGASSEMBLYTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anyp

3、urpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.How Does Mask Work in Wafer FAB -StepperTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not

4、be liable or responsible for any reliance.How Does Mask Work in Wafer FAB -ScannerTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Raw Material of

5、 Mask BlankBIM (binary mask)PSM (phase shift mask) A. KRF-PSM B. ARF-PSMTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Size of Blank 5inch 90mil

6、(5009) 5inch 180mil(5018)6inch 120mil(6012) 6inch 250mil(6025)7inch 250mil(7015)What kind of mask SMIC FABs use?TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible fo

7、r any reliance.Blank Component Binary BlankPSM BlankPhoto Resist(3K,4K,4650A)CrO&Chrome(1050A,700A)QuartzPhoto Resist(2K,3K,4KA)CrO&Chrome(1000,550A)QuartzMoSi FilmPhoto Resist Opaque Metal FilmSubstratePhoto ResistOpaque Metal Film Phase Shift Layer SubstrateTMThis document is strictly conf

8、idential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Blank Qz Characteristic RigidityHeat Expansion(ppm/oC)MaterialSodaliteSilicon-BorideQuartzRigidity540657615MaterialSoda limeSilic

9、on-BorideQuartzCoefficient9.43.70.5TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Blank Qz Characteristic Optics CharacterTransmission ( % ) 200

10、300400020406080100QuartzSilicon-BorideSoda LimeWave Length(nm)Thats why we choose Quartz as the substrate of blankTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible

11、for any reliance.How to Transfer Design to Mask? WriterProcessMetrologyVis-InspectClean/MountAIMSRepair1st InspectThr-InspectSTARlightShippingDevelopStripEtchTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only,

12、and SMIC shall not be liable or responsible for any reliance.Front-end Process Blank configurationPhoto-resistCr filmQuartzExposurePhoto-resist developWet etchPhoto-resist stripAEIASIRe-Etch ?AEI: After Etch CD measureASI: After Strip CD measureStep1Step2Step3Step4Step6Step5Step7TMThis document is s

13、trictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Front-end Process Dry process ResistCrQzH+H+H+H+H+H+H+EBEBEBH+H+H+H+H+H+H+Exposure(EB1,EB2,EB3DUV,LB5,LB6)PEB(Post Ex

14、posure Bake)SFB2500,APB5500PAGAcid generationAcid diffusionDeprotection reactionDevelopment(SFD2500,ASP5500)S(CF2)3CF3O3SS(CF2)3CF3O3SH+OHORDry Etch(Gen3,Gen4)AEI, Re-etchStrip, ASITMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other th

15、an for reference only, and SMIC shall not be liable or responsible for any reliance.Pellicle Component Pellicle MembraneMaterialWave LengthN.C.365nm (I-line)C.E.365, 248nm (I-line, DUV)F.C.193nm (ArF)Frame(Aluminum Alloy)Adhesive TapePellicle Membrane (25 um)Pellicle FrameDouble SideAdhesive TapeCrG

16、lassTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.What Pellicle Do? Top ContaminantObject PlanePellicle FilmBottom ContaminantContaminant on Pa

17、ttern PlaneLen SystemUnfocused Top Contaminant ImageUnfocused Bottom Contaminant ImageImage PlaneFocused Contaminant Image on WaferMask PatternWafer SurfaceLightTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference onl

18、y, and SMIC shall not be liable or responsible for any reliance.Particle Immunity Control Particle size (D) V.S. Minimum Stand-off (T)T = (4M/N.A.)DT = (4M/N.A.)DM - MagnificationN.A.- Numerical Aperture of the LensFor glass side particle, T = 2.3mmD1T1T2D2TMThis document is strictly confidential an

19、d proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Mask Quality Control C.D.DefectRegistrationTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used f

20、or anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.CD (critical dimension) measurementTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall no

21、t be liable or responsible for any reliance.Defect TypeOpaque spotParticleProtrusionIntrusionContaminationPinholeMissing ARGlass fractureBreakGlass seedBridgeSolvent spotHard DefectSoft DefectMiss SizeTMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for

22、 anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.How to Do Mask Defect Inspect TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be li

23、able or responsible for any reliance.Mask Layout Exemplification Normal S S +FiducialTest KeyTest LineMain PatternScribe LineGlobal MarkQA CellBarcodeMulti-Chip +FiducialTest KeyTest LineScribe LineGlobal MarkQA Cell+A ChipB ChipC ChipD Chip+TMThis document is strictly confidential and proprietary o

24、f SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.The Principle of STARlight InspectThe Model in SMIC Mask Shop(SL3UV) can only detect pattern sideSTAR: Synchronous Trans. And ReflectedTMThis document is s

25、trictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.What is Registration TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used

26、for anypurpose other than for reference only, and SMIC shall not be liable or responsible for any reliance.Registration Result Exemplification Mask:6”, t=0.25”QuartzMeasurement Area:67.2*92.2mmArray:8*10Variation Quantity: nmMaxminX7.20.0Y22.00.2TMThis document is strictly confidential and proprietary of SMIC. It must not be copied or used for anypurpose other