湿度敏感元件控制

1、工序操作所用设备及工具:WT:TO:PE(SMT)(A)主管;IE(A) MGR;操作图示：操作说明：注意事项：REVISION/AMENDMENT HISTORYDATEREV NO.PAGEDESCRIPTION工序操作所用设备及工具:WT:TO: PE(SMT)(A)主管;IE(A) MGR;(SMT);(IPQC<SMT>);1 描述 DESCRIPTION1.1 作为一般要求，物料不允许在以下条件下存储：As a general requirements, materials are not allowed to be stored:阳光直接照射，即使通过窗户也不行。In

2、 direct sunshine, not even through windows.靠近加热器，冷却器，湿度调节器和光源。Close to heater, cooler, humidifier and light source.靠近室外以致一再超过温度和湿度范围。Close to outdoors so that temperature/humidity limits are repeatedly exceeded.1.2 通过元件包装或湿度防护袋(MBB)内的如下标志可以识别是湿度敏感元件。参考(FP-R-016)静电防护/湿度敏感元件清单。Moisture sensitive devic

3、es can be identified through the following logo attached on the component packaging or inside Moisture Barrier Bag (MBB). Refer for the ESD/Moisture Sensitive Component List. Moisture-Sensitive Devices50%40%60%30%20%10%Humidity IndicatorWarning if Pink Change DesiccantRead at Lavender between Pink a

4、nd Blue箭头所指变粉红则须烘烤1.3 元件湿度敏感度表Table for Moisture Sensitive Device等级Level储存环境要求EnvironmentConditions装配时间AssemblyTime备注Remarks1温度£30°C,湿度 85%RHTemperature£30°C,humidity 85%RH无限制Unlimited非湿度敏感元件Moisture-insensitivecomp.2温度£30°C,湿度 60%RHTemperature£30°C,humidity 6

5、0%RH1年1 year2a温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH4周4 weeks3温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH168小时168 hours4温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH72小时72 hours5温度£30°C,湿度 60%RHTemperature£30&#

6、176;C,humidity 60%RH48小时48 hours5a温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH24小时24 hours6T温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH标贴上注明时间Time on Label (TOL)需使用前烘烤Need to bake before useOSP PWBT温度£30°C, 湿度640%RH Temperature£30°C,

7、humidity 40%RH24小时24 hours最大保存期限为6个月Max. shelf life of 6 months1.4 拆封包装前看包装是否有破损，检查湿度显示卡(HIC)，看是否超出上面1.3所规定的外界条件。Check that MBB is not broken, and Humidity Indicator Card (HIC) reading is not greater than the Environment Conditions stated in 1.3 above.1.5 PWB的库存最多为5个等级。板要平放在架子上以避免损坏。Only 5 levels, o

8、n the top of PWB stock. And panels must be stored on flat shelf to prevent warpage.1.6 如果MBB损坏或HIC读数超过上面元件湿度敏感度表显示的外界条件，物料/元件要退回给供应商或烘烤，参考下面的湿度敏感元件烘烤设定表。否则填写粘在物料盘上或元件袋上的湿度敏感元件记录表。在上面元件湿度敏感度表所显示的贴装时间内使用物料。If the MBB is broken or HIC reading is greater than Environment Conditions indicated in Table fo

9、r Moisture Sensitive Device above, material/device must be returned to vendor or bake, refer to Table for Baking Moisture Sensitive Devices below. Otherwise, fill up Humidity sensitive parts label, stick on the component reel or MBB and use the materials before the time indicated under “Assembly Tim

10、e” in Table for Moisture Sensitive Device above.1.7 湿度敏感元件烘烤设定表Table for Baking Moisture Sensitive Devices条件Condition湿度敏感元件在无保护的环境中暴露的时间MoistureSensitiveComponentUnprotectedexposuretimeinambient烘烤条件Bakingcondition1超过48小时但是小于168小时暴露时间如果是JEDEC等级5a或者6,超过24小时暴露时间时间More than 48 hour but less than 168 hou

11、r exposure from the requirementIn case of JEDEC class 5a or 6, more than24 hours exposure.12 hours(+10,-2 hrs) 60oC +/-5°CRH £5%2超过168小时暴露时间More than 168 hours exposure168 hours 60oC +/-5°CRH £5%OSP PWB超过24小时暴露时间More than 24 hours exposure5 hours 60oC +/-5°CRH £5%1.8 打开

12、湿度防护袋，填写湿度敏感元件记录表(见3.2)，并贴在物料盘上。Upon opening the MBB, fill up Humidity Sensitive Parts label (see 3.2 below) and stick it on the component reel or tray.1.9 如果停产很长时间，湿度敏感元件超出了元件湿度敏感度表所显示的贴装时间，湿度敏感元件或物料要放进电热炉或密封包装。If production will stop for a long time, and/or moisture sensitive components exceeds “A

13、ssembly Time” indicated in Table for Moisture Sensitive Device, moisture sensitive components/materials should either be stored at humidity control cabinet, or vacuum seal the components.当需要烘烤时，参考上面1.7电热炉设定表格。参考 DI-43-0011电热炉操作指引。When baking is needed, refer to the table above (1.7) for the setting

14、of oven. Refer to DI-43-0011 for the Heating Oven Operation and instructions.1.10 静电防护/湿度敏感元件清单(FP-R-016)应由SMT制程工程师更新填写，并由主管或经理确认。ESD/Moisture Sensitive Component List (FP-R-016) should be updated by SMT Process Engineer and to be verified by Supervisor/Manager.参考文件REFERENCEDOCUMENTS记录RECORDS静电防护/湿度

15、敏感元件清单(由PRT保管11年)ESD/Moisture Sensitive Component List Form.湿度敏感元件记录表。Humidity Sensitive Parts label湿度敏感元件记录表Humidity sensitive parts label开封时间使用期限开始使用时间Open-timeDurationStart Ssage使用结束时间开始储存时间 开始烘烤时间Stop UsageStart StoringStart BakingREVISION/AMENDMENT HISTORYDATEREV NO.PAGEDESCRIPTION2004-8-30A04F

16、irst Issue工序操作所用设备及工具:WT:TO:PE(SMT)(A)主管;IE(A) MGR;操作图示：操作说明：注意事项：REVISION/AMENDMENT HISTORYDATEREV NO.PAGEDESCRIPTION工序操作所用设备及工具:WT:TO: PE(SMT)(A)主管;IE(A) MGR;(SMT);(IPQC<SMT>);1. 目的: 建立NAMTAI SMT车间湿度敏感元件管理程序Build the Moisture sensitive devices manage process forNamtai SMT workshop.2 描述 DESCR

17、IPTION2.1 作为一般要求，物料不允许在以下条件下存储：As a general requirements, materials are not allowed to be stored:阳光直接照射，即使通过窗户也不行。In direct sunshine, not even through windows.靠近加热器，冷却器，湿度调节器和光源。Close to heater, cooler, humidifier and light source.靠近室外以致一再超过温度和湿度范围。Close to outdoors so that temperature/humidity limi

18、ts are repeatedly exceeded.2.2 湿度敏感元件可以通过下列附在元件包装上或在湿度袋子内侧的标语来鉴别。特别是IC，检查其外部的标语和以下的湿度敏感度控制程序。Moisture sensitive devices can be identified through the following logo attached on the component packaging or inside Moisture Barrier Bag (MBB). Especially IC, check for this logo outside and follow moistur

19、e sensitivity control procedure.Moisture-Sensitive Devices 湿度敏感元件2.3 元件湿度敏感度表Table for Moisture Sensitive Device等级Level储存环境要求EnvironmentConditions装配暴露时间AssemblyOpen Time备注Remarks1温度£30°C,湿度 85%RHTemperature£30°C,humidity 85%RH无限制Unlimited非湿度敏感元件Moisture-insensitivecomp.2温度£3

20、0°C,湿度 60%RHTemperature£30°C,humidity 60%RH1年1 year2a温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH4周4 weeks3温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH168小时168 hours4温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH72小时72

21、 hours5温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH48小时48 hours5a温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH24小时24 hours6T温度£30°C,湿度 60%RHTemperature£30°C,humidity 60%RH标贴上注明时间TimeonLabel (TOL)需使用前烘烤Need to bake before useOSP PWBT温度&

22、#163;30°C, 湿度640%RH Temperature£30°C,humidity 40%RH24小时24 hours最大保存期限为6个月Max. shelf life of 6 months2.4 拆封包装前看包装是否有破损，检查湿度显示卡(HIC)，看是否超出上面2.3所规定的外界条件。Check that MBB is not broken, and Humidity Indicator Card (HIC) reading is not greater than the Environment Conditions stated in 1.3 ab

23、ove.Warning if Pink Change DesiccantRead at Lavender between Pink and Blue箭头所指变粉红则须烘烤60%50%40%30%10%20%Humidity Indicator2.5 如果湿度包装袋子破损或湿度显示卡的读数大于以上环境指示表上的指示数据，物料/元件必须退还给卖主或参照以下湿度敏感元件烘烤设定表去烘烤。If the MBB is broken or HIC reading is greater than Environment Conditions indicated in Table for Moisture S

24、ensitive Device above, material/device must be returned to vendor or bake, refer to Table for Baking Moisture Sensitive Devices below. 2.6 湿度敏感元件烘烤设定表Table for Baking Moisture Sensitive Devices湿度敏感元件在无保护的环境中暴露的时间MoistureSensitiveComponentUnprotectedexposuretimeinambient烘烤条件Bakingcondition如果元件超过2.32.

25、4所规定的条件Ifcomponentexceedtherequirementon12.3 12.41.一般要求烘烤(Norma baking condition):A324hrs 120oC +/-5°C2.元件供应商有标明按照要求按照其要求烘烤.If component supplier provide baking condition please baking by supplier request.3.下表为参考条件: Below sheet is only reference condition.24hrs 120oC +/-5°C3.储存与管理(Storage

26、and manage MSC)3.1 PE工程师根据如元件湿度敏感级别情况制作”湿度敏感级别清单”Refer to moisture sensitivity level of the component PE engineer make on list “MSD level list”3.2 IC在使用前需要在料盘上或包装带上贴上“湿度敏感元件管理标签”并写上开口时间和日期在包装袋上来监控其开放时间。Upon using it, put on the “MSC manage lable”and write the open time and date on the package to mon

27、itor the opening timeP/N可用的装配时间开封时间及日期序号开始时间及日期截止时间及日期备注12345678910再次储存时间剩余装配时间A3如:一IC的湿度等级为:3,刚拆开湿度包装的可用的装配时间为:168H;For example:One moisture sensitive component level is 5,upon opening the MBB,Can be use asssembly time:168H;可用的装配时间为:168HCan be use asssembly time:168H;开封时间及日期为:2005.10.18 AM9:00;Open

28、 time and date: 2005.10.18 AM9:00;如果是盘装IC将每盘IC拿出的“开始时间及日期”, “截止时间及日期”分别记录在对应的序号位置.If the ic package is tray please Note note the “Start use time”, “End use time” of every tray on the serial number. 再次保存在湿度控制柜里或真空封装的时间为:2005.10.19 AM9:00;Stored at humidity control cabinet, or vacuum seal the components again time: 2005.10.19 AM9:00 剩余装配时间为:144H;Remain assembly time:144h下次再使用时的可用的装配时间:144HNext time use the component again the can be use asssembly time:144h3.3 如果生产将停止很长一段时间，或湿度敏感元件会超过在湿度敏感元件表上所示的“装配时间”，湿度敏感元件/物料应该保存在湿度控制柜里，或真空封装元件。If prod