TR7500程序制作参考

1、-针对ASUS 6厂PSSMTTR7500在asus fs测试半年有余，由于是TRI较新的机种，再加上asus fs生产的为短PAD的PCBA，FAE也一直是在摸索中前进，不论是灯光、参数还是检测框都经历了数次使用上的修正，由原来的top view配置多个灯光过度到现在的单一灯光、由原来的单一missing检测缺件过度到现在的blob配合检测等等；现对此段时间的使用作一次总结，希望能够为今后其他FAE 使用TR7500提供参考！一、光源设定目前在制作程式时光源使用9组：top camera 1组；angle camera各对应2组，共8组。1、Top cameraToplightA说明：第1圈

2、 B = 194第2圈 0 （由于此区有镜头开孔，灯光不对称，固不打光）第3圈G=255第4圈R=128, G=64第5圈R=2552、Anglecamera：AnglelightAAnglelightBR G B=255 R G B=70说明：在后面的介绍中零件在angle camera测试使用的光源统称为anglelightA，anglelightB。二、零件制作参考标准1、CHIP类11 R类型 TOP CAMERA 灯光：ToplightA检测框：missing(缺件,偏移)×1void(两测焊点bright+翻面bright)×3solder(零件间短路)

3、5;1color window(裸铜)×2类型missingVoid(两侧void）Void（反面) solderSimiarityShift XShift YRotationB/WBriqht ratioMethodB/WBriqht ratioMethodB/WBriqht ratio04027018018060013030Bright13070Bright1507006036024024065013030Bright13070Bright1507008055530030070014040Bright13070Bright150701206及以上5540040080014040B

4、right13070Bright15070Phase1:100+phase2:100Phase1:100+phase2:100Phase1:200无Color window:ANGLECAMERA灯光：检测框：参数AnglelightAExtrablob（缺件）×160,200-500，012 C类型TOP CAMERA灯光：ToplightA检测框：missing(缺件,偏移)×1void(两测焊点bright+缺件dark)×3solder(零件间短路)×1color window(裸铜)×2类型missingVoid(两侧void）Voi

5、d（缺件) solderSimiarityShift XShift YRotationB/WBriqht ratioMethodB/WBriqht ratioMethodB/WBriqht ratio04027018018060013030Bright13050Dark1507006036024024065013030Bright13050Dark1507008055530030070014040Bright13050Dark150701206及以上5540040080014040Bright13050Dark15070Phase1:100+phase2:100Phase1:100+phase

6、2:100Phase1:300无Color window:另外：针对较大电容的立埤问题，在TOP面零件本体中检区域加做1void(150,50,bright)来检测。13 特殊CHIP类说明：主要是胆质电容及一些有极性的CHIP零件 TOP CAMERA灯光：ToplightA检测框：missing&Pol (缺件,极性)×1void(两测焊点bright+极性)×3missingVoid(两侧void）Void（极性) SimiarityShift XShift YRotationB/WBriqht ratioMethodB/WBriqht ratioMethod

7、60800800800140-15040-50Bright实际状况定Phase1:300Phase1:100+phase2:100 ANGLECAMERA灯光：AnglelightB检测框：Void（偏移 dark + Bright）×8 测试参数：以实际获得灰阶设定2、排阻类型 TOPCAMERA灯光：ToplightA检测框：missing(缺件,偏移)×1void(N焊点+反面)×（N+1）color window(裸铜)×NmissingVoid(两侧void）Void（反面) SimiarityShift XShift YRotationB/W

8、Briqht ratioMethodB/WBriqht ratioMethod6020020070012020Bright11070BrightPhase1:200+phase2:100Phase1:100+phase2:100Phase1:300Color window的设置与CHIP类相同 ANGLE CAMERA灯光：AnglelightB检测框：lead(定位)×1solder(短路)×Nsolder(偏移)×2leadNsolder2solderSimiarityShift XShift YRotationB/WBriqht ratioB/WBriqht

9、 ratio408008008001301001301003、SOT(三极管) TOPCAMERA灯光：ToplightA检测框：Void(空焊)×3VoidB/WBriqht ratioMethod14040BrightPhase3:120 ANGLE CAMERA灯光：AnglelightA检测框：Missing(缺件)×1Void(位移、缺件)×3Void(少锡)×3missingVoid（位移、缺件）Void（少锡) SimiarityShift XShift YRotationB/WBriqht ratioMethodB/WBriqht rat

10、ioMethod5030030080060-8010bright130-14040-50dark4、IC类型 TOPCAMERA灯光：ToplightA检测框：Missing&Pol (缺件、极性)×1Lead×NMissing&PolleadSimiarityShift XShift YRotationSimiarityShift XShift YRotation5550050080045260260800Phase1:300Phase3:110 注：若missing不清晰时，极性标识明显，可使用void来加测极性； ANGLE CAMERA A：灯光：A

11、nglelightA检测框：Solder(短路)×NVoid(少锡)×NVoid(位移)×2/侧solderVoid(少锡）Void（位移) B/WBriqht ratioB/WBriqht ratioMethodB/WBriqht ratioMethoark10020Dark针对5PIN的IC,在3pin的那面中间的脚上加测1void(极性)参数可参考(100, 20, dark) B：灯光：AnglelightA检测框：Void(翘脚)×NVoidB/WBriqht ratioMethod120-13020-30Bright

12、注：1、脚翘检测框最好是做在相对应的两个camera下.2、IC脚较多时，使用1 lead+void方法，再加warp共同补偿，降低板弯对测试的影响；5、二极管 TOPCAMERA灯光：ToplightA检测框：Missing&Pol (缺件、极性)×1Missing&PolSimiarityShift XShift YRotation55180180650Phase1:300 or Phase3:200 ANGLE CAMERA灯光：AnglelightA检测框：Missing&Pol(缺件,极性)×1Void(极性)×1Void(少锡)

13、×2Missing&Pol(缺件,极性)Void（极性）Void（少锡) SimiarityShift XShift YRotationB/WBriqht ratioMethodB/WBriqht ratioMethod5518018065035-4040dark12020dark6、电解电容 TOPCAMERA灯光：ToplightA检测框：Void(焊点)×2Void(偏移 dark)×4Void（焊点）Void（偏移) B/WBriqht ratioMethodB/WBriqht ratioMethod140-15040-50bright120-14

14、050darkPhase3:120Phase1:100+phase3:120 ANGLE CAMERA灯光：AnglelightA检测框：Missing&Pol(缺件,极性)×1Void(极性)×1Missing&Pol(缺件,极性)Void（极性）SimiarityShift XShift YRotationB/WBriqht ratioMethod5515001500130017050Bright7、BGA 由于零件的特殊性，重点检测极性和偏移.检测框：Missing&Pol(缺件,极性)×1Void(极性)×1Void(偏移)×4注：Camera、灯光、参数的配置要根据实际情况来制定；8、CONPIN脚的制作方法与IC