PCB板专业知识

1、精品资料推荐PCB 板专业词汇 B b Backplane 背板 Back-up 垫板 Baking 烘板 Ball Grid Array (BGA) 球栅阵列 Bare board 裸板 Base Copper 底铜 Base material 基材 Bevelling 斜边 Black Oxide 黑氧化 Blind via hole 盲孔 Blistering 起泡 /水泡 Board Cutting 开料 Board Thickness 板厚 Bottom side 底层 Breakaway tab 打断点 Brushing 磨刷 Build-up 积层 Bullet pad 子弹盘

2、Buried hole 埋孔 C c C/M(Component Marking) 元件字符 Carbon ink 碳油 Carrier 带板 Ceramic substrate 陶瓷 Certificate of Compliance 合格证书 Chamfer 倒角 Chemical cleaning 化学清洗 Chemical corrosion 化学腐蚀 Chip Scale Package (CSP) 晶片比例包装 Circuit 线路 Clearance 间距 /间隙 Color 颜色 Component Side(C/S) 元件面 Composite layers 复合层 Comp

3、uter Aided Design (CAD) 电脑辅助设计 Computer Aided Manufacturing (CAM) 电脑辅助制作 Computer Numerial Control (CNC) 数控 Conductor 导体Conductor width/space 导体线宽 / 线隙 Contact 接点 Copper area 铜面积 Copper clad 铜箔Copper foil 铜箔Copper plating 电镀铜Corner 角线Corner mark 板角记号Corner REG.Hole 角位对位孔Cracking 裂缝Creasing 皱折Criteri

4、a 规格 ,标准Crossection area 切面Cu/Sn Plating 镀铜锡Current efficiency 电流效率Customer 客户Customer Drilling File 客户钻孔资料Customer P/N 客户产品编号D dD/F Registration Hole 干菲林对位孔D/F(Dry Film) 干膜Date Code 日期代号Datum hole 基准参考孔Daughter board 子板Deburring 去毛刺Defect 缺陷Definition 定义Delamination 分层Delay 耽搁Delivery 交货Densitomete

5、r 透光度计Density 密度Department 部门Description 说明Design origin 设计原点Desmear 去钻污 , 除胶Dessicant 防潮珠Developer 显影液 ,显影机Diamond 钻石Diazo film 重氮片Dielectric breakdown 介电击穿Dielectric constant 介电常数Dielectric Thickness 介电层厚度Dielectric Voltage Test 绝缘测试Dimension 尺寸Dimensional stability 尺寸稳定性 Direct/indirect 直接 /间接 Di

6、stribution 发放Document type 文件种类Documentation Control 文件控制Double sided board 双面板Drill bit 钻咀Drilling 钻孔Drilling Roughness 钻孔粗糙度Dry Film 干菲林Dry Film-Pattern 干膜线路Dynamic 动态E eECN(Engineering Change Notification) 工程更改通知Effective date 有效期Electrical Test Fixture 电测试 针床Electro migration 漏电Electroconductive

7、 paste 导电胶Electroless 无电沉Electroless copper 无电沉铜Electroless Ni 无电沉镍Electroless Gold/Au 无电沉金Engineering drawing 工程图纸Entek 有机涂覆Epoxy glass substrate 环氧玻璃基板Epoxy resin 环氧基树脂Etch 蚀刻Etchback 凹蚀Etching 蚀刻E-Test Marking 电测试标记E-Test(Electrical Test) 电测试Exposure 曝光External layer 外层F fFiducial mark 基准点Filling

8、 填充Film Fabrication 菲林制作Final QC 最终检查Finish Overall Board Thickness 成品总板厚度Fixture 夹具Flammability 可燃性Flash Gold 薄金Flexible 易曲的 ,能变形的Flux 助焊剂G gGeneral information 一般资料Ghost image 重影Glass transition temperature 玻璃化湿度Gold Finger(G/F) 金手指Golden board 金板Grid 网格Ground plane 地线层H hHAL(Hot Air Leveling) 热风整

9、平Hand Rout 手锣Hardness 硬度Heat Sealed 热密封Heat Shrink-warp 热收缩Holding time 停留时间Hole 孔Hole breakout 破环Hole density 孔的密度Hole Diameter 孔径Hole location 孔位Hole Location Chart 孔位座标表Hole Position Tolerance 孔位误差Hole size 孔尺寸Hot Air Leveling(HAL) 热风整平 Humidity 湿度I iIdentification 标识 ,指标Image 影像Imaging transfer

10、图形转移Impedance 阻抗Impedance Test 阻抗测试Inner copper foil 内层铜箔Inspection 检验Insulation resistance Test 绝缘测试Inter Plane Separation 内层分离Interleave Paper 隔纸Internal layer 内层Internal stress 内应力Ionic cleanliness 离子清洁度Isolation 孤立Isolation Resistance 绝缘电阻Item 项目K kKEY board 按键盘Key slot 槽孔Kraft paper 牛皮纸L lLamin

11、ate 板材Laminate Thickness 材料厚度Lamination void 层间空洞Landless hole 破孔Laser plotter 激光绘图机Laser plotting 激光绘图Laser via hole 激光穿孔Layup 层压配本Lay-up Instruction 压板指示Legend 字符Legend Width 字符宽度Length 长度Lifted Lands 残铜Line Width 线宽Liquid 液体Location 位置Logic diagram 逻辑图形Logo 唛头 ,标记Lot size 批卡M mMark 标记Master drawi

12、ng 菲林图形Material Thickness 材料厚度Material Type 材料类型Max. X-out 坏板上限Max.Board Thickness After Plating 电镀后总板厚度之上限Measling 白斑Mech Drawing No. 图纸编号Mechanical cleaning 机械清洗Metal 金属Method 方法MI(Manufacturing Instruction) 生产制作指示Microstrip 微条线Min Conductor Copper Thickness 最小线路铜厚Min Hole Wall Copper Thickness 最小

13、孔壁铜厚Min. Gold Plating Thickness 最小金厚Min. Nickel Thickness 最小镍厚Min. Tin-Lead Thickness (After HAL) (喷锡后)最小锡厚 Min.Annular Ring 最小环宽Min.Spacing between Line to Line 线与线之间的最小距离 Min.Spacing between Line to Pad 线与焊盘之间的最小距离 Min.Spacing between Pad to Pad 焊盘与焊盘之间的最小距离 Minimum 最小Mirroring 镜像Missing 缺少Model N

14、o. 产品名称Molded 模塑Mother board 主板Moulding 模房Mounting hole 安装孔Multilayer 多层板Multi-layer Laminate 多层板材料N nNegative 反面的Net list 网络表Network 网络Nick 缺口No. of holes 孔数No.of Array/Panel 每个拼板套板数No.of Panel per Stack 每叠板数No.of Panel/Sheet 每张大料拼板数No.of Pcs Per Bag 每包数量No.of Unit/Array 每套单元数 Normal value 标准值O oOb

15、long 椭圆形的Offset 偏移Open/short 开路 /短路 Optimization(design) 最佳化 (设计 )Organic Solerability Peservatives(OSP) 有机保护剂 Originator 原作者Outer copper foil 外层铜箔Outline 外形P pPacking 包装Packing 包装Pad 焊盘Panel Area 拼板面积Panel Plated Crack 板镀缺口Panel plating 整板电镀Panel Size 拼板尺寸Panel Size After Outerlayer Cutting 外层切板后拼板

16、尺寸Panel Utilization 拼板利用率 Pass rate 通过率 Passivation 钝化Pattern 线路Pattern Inspection 线路检查Pattern plating 图形电镀PCB(Printed Circuit Board) 印制线路板 Peck drilling 啄钻Peel strength 剥离强度Peelable 可剥性Peelable 剥离强度Peelable Mask 可脱油Peeling 剥离 Permanent 永久性 PH value PH 值Photo plotting 图形输出Photo via hole 菲林过孔 Photogr

17、aphers 照片靶标Photoplotler 光绘机Physical 物理的Pin hole 销定孔 Pink ring 粉红环Pinning hole 钻孔管位 Pitch 间距Placement 放置 Plated Though Hole(PTH) 沉铜Plating 电镀Plating Crack 电镀裂缝Plating line 电镀线Plating rack 电镀架Plating Void 电镀针孔Plug Hole 塞孔Polymer 聚合体 Porosity 孔隙率 Positive 绝对的Power plane 电源层Prepreg 半固化片Primary side 首面Pr

18、int 印刷Probe point 针床测点Process 工序Process flow 工序流程Product Planning Dept. 生产计划部 Production 生产板Profile 外形Profiling 外形加工Profiling Process 外形加工 Project No. 产品编号PTH Thermal Seress Test PTH 热冲击测试PTH(Plating Through Hole) 沉铜Pull away 拉离Punch 啤模Punching 冲切Punching Mould Drawing 啤模图形Q qQA Audit 品质审计QA(Quanlit

19、y Assurance) 品质部Quad Palt Pack (QFP) 四边扁平林整器件Quality 质量Quantity 数量R rRaw Material Utilization 原材料利用率Recall 回收Rectifier 整流器Register mark 对位点Registration 重合点Remark 备注Resin 树脂Resin Recession 流胶Resist 抗蚀剂Resolution 分辨率Rigid 精密的Roller coating 涂覆Roughening 粗化Round pad 圆盘Routing 外形加工 ,铣板S sS/M Material 绿油物

20、料S/M(Solder Mask) 阻焊Sales 销售Sample 样板Sampling inspection 抽样检验Scaling factor 缩放比例因素Scope 范围Scoring 刻槽Scratch 划痕Secondary side 第二面Section Code 组别代号Section Code Change 组别代号更改Segment 部分 ,片段Separated 分离Sequence 顺序Sets 套Sheet Size 大料尺寸 Shematic diagram 原理图 Shiny 有光泽的 ,发光的 Silk screen 丝印Silver film 银盐片Sing

21、le/double 单层 /双面 Slot 槽 ,坑Smear 污点Solder Mask 阻焊Solder mask on bare copper (smobc) 裸铜覆盖阻焊膜 Solder side 焊接面Solder Side C/M 阻焊面字符Solder Side Cir. 焊接面线路Solder Side Circuit 焊接面Solder Side S/M 焊接面阻焊 Solderability 可焊性 Solvent Test 可溶性测试Spacing 线距Special requirement 特殊要求 Specification 详细说明，规范 Spindle 主轴 Split 裂片Square pad 方块 Standard 标准值 Static 静态 Stencial 网版 Step drilling 分布钻 Step scale 光梯尺 Store 货仓 Supplier 供应商 Supported hole 支撑点 Surface 表面Surface mount