IPC标准文件一览表0514

1、IPC标准、文件一览表颜色一：老江买的,有纸制件（总25本,23个标准,有部分同以前重复） 颜色二：蔡卫东搜集的，电子件黑色:暂缺Updated May 24, 2000IPC DOC #（IPC文件号）TITLE名称PUBLICATION/REVISION DATES出版/修订日期Roadmap（指南）Nati onal Tech no logy Roadmap for Electro nic In terc onn ecti ons（美国国家电子互联技术指南）6/95 （orig. pub.）SMC-TR-001SMT An In troducti on to Tape Automated

2、 Bonding & Fi ne Pitch Tech no logy（TAB 和细 间距SMT介绍）1/89 （orig. pub.）J-STD-001代替 IPC-S-815Requireme nts for Soldered Electrical andElectro nic Assemblies（电气、电子组件焊接技术要求）4/92 （orig. pub.） Revisio n: A 1/95 Ame ndme nt 1: 3/96 Revision B: 10/96 Revisi on C: 3/00IPC-HDBK-001Handbook and Guide to the

3、Requirements for Soldered Electrical and Electro nic Assemblies to Suppleme nt J-STD-001B（J-STD-001B学习辅导书）3/98 （orig. pub.）J-STD-002代替 IPC-S-805Solderability Tests for Comp onent Leads,Term in ati ons. Lugs, Termin als and Wires （元件引线,焊端,接线端和导线的可焊 性测试）4/92 （orig. pub.）A 10/98J-STD-003代替 IPC-S-804Sol

4、derability Tests for Prin ted Boards印 制板 可焊性测试）4/92 （orig. pub.） Revisio n A: In processJ-STD-004代替 IPC-SF-818Requirements for Soldering Fluxes助焊剂技 术要求）1/95 （orig. pub.） Ame ndme nt 1 - 4/96 Revisio n A: In processJ-STD-005代替 IPC-SF-819Requireme nts for Solderi ng Pastes焊膏技术 要求）1/95 （orig. pub.） Ame

5、 ndme nt 1 - 1/95J-STD-006Requireme nts for Electro nic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications（电子级固态焊料技术要求）1/95 （orig. pub.） Ame ndme nt 1 - 6/96 Revisio n A: In processJ-STD-012Impleme ntati on of Flip Chip and Chip ScaleTech no logy（FC和CSP

6、器件的安装）1/96 （orig. pub.）J-STD-013Implementation of Ball Grid Array and Other High Density Technology（BGA 和 HDI 器件 的安装）7/96 （orig. pub.）IPC-DRM-18Comp onent Ide ntificati on Desk Refere nee Man ual（元器件封装辨认手册）9/95 （orig. pub.） Revisio n A: 4/96 Revision B: 2/97 Revisi on C: 7/98J-STD-020Moisture/Reflow

7、 Sen sitivity Classificati on of Plastic Surface Mou nt Devices塑 圭寸表面器件 对潮湿和再流焊的敏感度要求）October 1996 （orig. pub.）Revisio n A: 3/99IPC-DRM-40Through-Hole Solder Joint Evaluati on Desk Refere nee Manual（通孔引线焊点评估参考手册）IPC-DRM-SMTSurface Mount Solder Joint Evaluati on DeskRefere nee Manual（表面组装焊点评估参考手册）8/9

8、8IPC-T-50Terms and Definitions Interconnecting and Packagi ng Electro nic Circuits（电子电路互连 及封装术语和定义）8/75 （orig. pub.）A - 8/76B - 6/80C - 3/85D - 11/88E - 7/92F - 6/96IPC-SC-60Post Solder Solve nt Clea ning Han dbook 焊 后溶剂清洗手册)4/87 (orig. pub.) Revisio n A: In processIPC-SA-61Post-Solder Semi-Aqueous

9、Clea ning Handbook(焊后半水清洗手册)7/95 (orig. pub.)IPC-AC-62Post Solder Aqueous Clea ning Han dbook 焊 后水清洗手册)12/86 (orig. pub.)IPC-CH-65Guideli nes for Clea ning of Prin ted Boards and Assemblies(印制板及其组件清洗导则)12/90 (orig. pub.) Revisio n A: In processIPC-CS-70Guidelines for Chemical Handling Safety in Prin

10、 ted Board Man ufacturi ng(印制板制造化 学处理安全准则)8/88 (orig. pub.)IPC-MP-83IPC Policy on Metrication(IPC 公制化导则)8/85 (orig. pub.)IPC-PC-90General Requirements for Implementation of Statistical Process Control实施 SPC 的总技 术规范)10/90 (orig. pub.)IPC-QS-95General Requirements for Implementation ofISO 9000 Quality

11、 Systems实施 ISO 9000质量体系的总技术规范)4/93 (orig. pub.)IPC-L-125Specifications for Plastic Substrates Clad or Un clad for High Speed/High Freque ncy In terc onn ecti ons(高速/高频塑性基板特性规范)8/83 (orig. pub.)A 7/92IPC-EG-140Specificati on for Fini shed Fabric Wove n from "E" Glass for Prin ted Boards(&qu

12、ot;E"纤维织物印 制板特性规范)3/88 (orig. pub.)A 6/97*IPC-SG-141Specificati on for Fini shed Fabric Wove n from "S" Glass for Prin ted Boards ("S'纤维织物印 制板特性规范)2/92 (orig. pub.)IPC-A-142Specificati on for Fini shed Fabric Wove n from Aramid for Printed Boards(Aramid 纤维织物 印制板特性规范)6/90 (ori

13、g. pub.)IPC-QF-143General Specification for Finished Fabric Wove n from Quartz (Pure Fused Silica) for Prin ted Boards(石英纤维织物印制板特性规范)2/92 (orig. pub.)IPC-CF-148Resin Coated Metal for Printed Boards 印制 板涂树脂金属箔)6/90 (orig. pub.)A 9/98IPC-MF-150Metal Foil for Prin ted Wiring Applicati ons(印制线路金属箔)8/66

14、(orig.pub.)A 9/67B 2/71C 8/74D 3/76E 5/81F 10/91 , 8/92G 5/99IPC-CF-152Composite Metallic Material Specification for Prin ted Wiring Boards (印制板复合金属材料 特性规范)6/90 (orig. pub.)A 1/94B 3/98IPC-FC-231Flexible Base Dielectrics for Use in FlexiblePrin ted Wiring(柔性印制线路的绝缘基材)orig. pub. 7/74A 5/83B 2/86C 4/9

15、2Ame ndme nt 10/95IPC-FC-241Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring(柔性印 制电路镶嵌金属夹层的绝缘基材)7/74 (orig. pub.)A 5/83B 2/86C 4/92Ame ndme nt 10/95IPC-FA-251Guidelines for Single and Double Sided Flex Circuits(单、双面柔性电路指南)2/92 (orig. pub.)IPC-D-279Design Guidelines f

16、or Reliable Surface Mount Tech no logy Prin ted Board Assemblies(可靠的印制板SMT设计指南)7/96 (orig. pub.)IPC-D-300Prin ted Board Dime nsions and Tolera nces(印制板的尺寸和容差)8/60 (orig. pub.)A 7/61B 1/64C 10/65D 1/70E 10/70F 11/74 Editorial revisio nG 1/84IPC-D-310Guidelines for Phototool Generation and Measureme n

17、t Techni ques照相底板生成和 测量技术指南）9/69 （orig. pub.）A 12/77B 12/85C 06/91IPC-A-311Process Con trol Guideli nes for PhototoolGen eratio n and Use（照相底板生成和使用过程的控制指南）3/96 （orig. pub.）IPC-D-316Desig n Guide for Microwave Circuit Boards Utiliz ing Soft Substrates （软质基材的微波电 路设计指南）5/95 （orig. pub.）IPC-D-317Design

18、Guidelines for Electronic Packaging Utilizi ng High-Speed Tech niques（电子圭寸装 用于咼速技术的设计指南）4/90 （orig. pub）A 1/95IPC-D-322Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Size拼板中印制 板迭用尺寸指南）8/84 orig. pub. Reaffirmed 9/91IPC-MC-324Performa nee Specificati ons for Metal Core Board

19、s（金属芯电路板性能规范）10/88 （orig. pub.）IPC-D-325Docume ntati on Requireme nts for Prin ted Boards, Assemblies and Support Draw ings （印制板、组件和支撑件图纸文件要求）1/87 （orig. pub.）A 5/95IPC-D-326In formatio n Requireme nts for Manu facturi ng Prin ted Board Assemblies印 制板组装制造 的文件资料要求）4/91 （orig. pub.）IPC-D-330Design Gui

20、de Manual（设计指导手册）IPC-NC-349Computer Numerical Con trol Formatt ing for Drillers and Routers（钻孔和布线器的计算机控制数据格式）8/85 （orig. pub.）IPC-D-350Printed Board Description in Digital Form(印制板的数字化表述)8/72 (orig. pub.)A 2/75B 8/77C 10/85 ReaffirmedD7/92 Techni cal Content Identical to IEC-1182-1IPC-D-351Printed B

21、oard Drawings in Digital Form(印制板图形的数字化表述)8/85 (orig. pub.)IPC-D-352Electronic Design Data Description forPrin ted Boards in Digital Form (印制板电子 设计数椐的数字化表述)8/85 (orig. pub.)IPC-D-354Library Format Description for Printed Boards in Digital Form(印制板文件格式的数字化表述)2/87 (orig. pub.)IPC-D-355Prin ted Board A

22、ssembly Descripti on inDigital Form(印制板组件的数字化表述)1/95 (orig. pub.)IPC-D-356Bare Board Electrical Test In formatio n inDigital Form(印制裸板电测信息的数字化表述)3/92 (orig. pub.)A 1/98IPC-MB-380Guideli nes for Molded In terc onn ectio n Devices(模制器件互连指南)10/90 (orig. pub.)IPC-D-390Automated Desig n Guideli nes 自动设计指

23、 南)7/74 (orig. pub.)A 2/88IPC-C-406Desig n and Applicatio n Guideli nes for Surface Mou nt Conn ectors 表面组装连接器 设计和应用指南)1/90 (orig. pub.)IPC-CI-408Desig n and Applicatio n Guideli nes for the Use of Solderless Surface Mount Conn ectors(非焊接表面组装连接器设计和应用指南)1/94 orig. pub.IPC-BP-421General Specification

24、for Rigid Printed Board10/80 (orig. pub.)Backpla nes with Press-Fit Con tacts（带压接连接器的刚性印制背板通用技术规 范）Reaffirmed 4/90IPC-D-422Design Guide for Press Fit Rigid PrintedBoard Backpla nes（刚性压接印制背板设计指南）9/82 （orig. pub.）IPC-DW-424Gen eral Specificati on for En capsulated Discrete Wire In terc onn ecti on Boa

25、rds（印制板分立包皮导线互连通用技术规范）1/95 （orig. pub.）IPC-DW-425Desig n and End Product Requireme nts for Discrete Wiring Boards（分立线路板设计和 成品技术规范）9/82 （orig. pub.）A 5/90IPC-DW-426Specificati ons for Assembly of Discrete Wiring（分立线路组装技术规范）12/87 （orig. pub.）IPC-TR-460Trouble-Shooti ng Checklist for Wave Solderi ng Pr

26、in ted Wiring Boards （印制板波 峰焊故障检查表）1973 （orig. pub）A 2/84IPC-TR-461Solderability Evaluati on of Thick and ThinFused Coati ngs（厚、薄热涂层的可焊性评估）3/79 （orig. pub.）IPC-TR-462Solderability Evaluation of Printed Boards with Protective Coat ings Over Long Term Storage（具有持效保护涂层的印制板可焊性评估）10/87 （orig. pub.）IPC-TR

27、-464Accelerated Aging for Solderability Evaluatio ns（可焊性的加速老化评估）orig. pub.4/84A 12/87IPC-TR-465-1Round Robin Test on Steam Ager Temperature Con trol Stability（恒温蒸汽老化的联合测试报告）1993IPC-TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Results(蒸汔老化时间和温度对可焊性测试结果的 影响)1993IPC-TR-4

28、65-3Evaluatio n of Steam Agi ng on Alter nativeFi nishes. Phase IIA(对不同处理剂的蒸汽老化评估,Phase IIA)7/96IPC-TR-466Wett ing Bala nee Sta ndard WeightComparis on Test(润湿平衡标准称重比较测试)4/95 (orig. pub.)IPC-TR-467Supporting Data and Numerical Examples for ANSI/J-STD-001 Appe ndixD(ANSI/J-STD-001附件D的支持数据和数 字举例)10/96

29、 (orig. pub.)IPC-TR-468Factors Affect ing In sulati on Resista neePerforma nee of Prin ted Boards印 卩希 9板绝缘 电阻的影响因素)3/79 (orig. pub.)IPC-TR-470Thermal Characteristics of Multilayer In terc onn ecti on Boards(多层互连板的热特性)1/74 (orig. pub.)IPC-TR-474An Overview of Discrete Wiring Techniques分立线路综观)3/79 (or

30、ig. pub.) Repri nt 1984IPC-TR-476How to Avoid Metallic Growth Problems onElectro nic Hardware(如何避免电子硬件的合 金化生长)9/77 (orig. pub.)A 6/84IPC-TR-481Results of Multilayer Test Program Round Rob in V(多层V循环测试程序的结果)4/81 (orig. pub.)IPC-TR-483Dime nsional Stability Testi ng of Thi nLam in ates - Report on Pha

31、se I Intern ati onal Round Robin Test Program(薄层压板尺寸稳定性测试-)4/84 (orig. pub.) 10/87 Adde ndumsRevised 3/91IPC-TR-484Results of IPC Cooper Foil Ductility Rou nd4/86 (orig. pub.)Robi n Study（IPC Cooper箔延展性研究联合报告）IPC-TR-485Results of Cooper Foil Rupture Stren gth Test Rou nd Rob in Study (Cooper 箔断裂强度研

32、究联合报告)3/85 (orig. pub.)IPC-TR-549Measles in Prin ted Wiring Boards印制板内 的粉点)11/73 (orig. pub.)IPC-TR-551Quality Assessme nt of Prin ted Boards Used for Mounting and In terc onn ect ing Electr onic Comp onents(电子元件安装互连印制板的质量评定)7/93 (orig. pub.)IPC-DR-570General Specification for 1/8 Inch DiameterShank

33、 Carbide Drills for Printed Boards(1/8 英寸印制板硬质合金钻头总技术规范)1/79 (orig. pub.)A 4/84IPC-DR-572Drilling Guidelines for Printed Boards(印制板 钻孔指南)4/88 (orig. pub.)IPC-TR-578Leadi ng Edge Manu facturi ng Tech no logy Report - Result ing of a Round Robin Study on Minimum Con ductor Width andPlated-Through Hole

34、s in Rigid, Bare Copper, Double-Sided Prin ted Wiring Boards(前沿制 造技术报告-)9/84 (orig. pub.)IPC-TR-579Round Robi n Reliability Evaluati on of Small Diameter Plated Through Holes in Prin ted Wiring Boards(印制板小孔金属化可靠性评估联合报告)9/88 (orig. pub.)IPC-TR-580Clea ning and Clea nli ness Test Program Phas1 Test Re

35、sults(清洗和洁净度测试程序第1阶段测试结果)10/89 (orig. pub.)IPC-TR-581IPC Phase 3 Con trolled Atmosphere Solderi ng StudyIPC Phase 3可控气氛焊接研究)8/94 (orig. pub.)IPC-TR-582IPC Phase 3 No-Clea n Flux Study(IPC Phase 3免洗助焊剂研究)11/94 (orig pub.)IPC-A-600Acceptability of Prin ted Boards（印制板可接 收条件）orig pub. '64A '70B

36、'74C '78D '89E 8/95F 11/99IPC-QE-605APrinted Board Quality Evaluation Handbook（印制板质量评定手册）Revision A: 2/99IPC-SS-605Printed Board Quality Evaluation Slide Set（印制板质量评定，幻灯片）IPC-A-610Acceptability of Electro nic Assemblies（电子组装的可接收条件）8/83 （orig. pub.） 2nd printing 1/86 3rd prin ti ng 5/88 A

37、3/90B 12/94Ame ndme nt 1/96Revisi on C: 1/00IPC-QE-615Assembly Quality Evaluati on Han dbook（组装 质量评定手册）3/93 （orig. pub.）IPC-SS-615Assembly Quality Evaluation Slide Set组装 质量评定,幻灯片）3/93 （orig. pub.） Revision A: 2/99IPC-AI-641User's Guideli nes for Automated Solder JointIn specti on（自动焊点检查用户指南）1/87

38、 （orig. pub.）IPC-AI-642User's Guidelines for Automated Inspection of Artwork, I nterlayers, and Un populated PWB's（照相底图，内层和PCB裸板自动检查用户指 南）10/88 （orig. pub.）IPC-OI-645Stan dard for Visual Optical In specti on Aids（光学检查目测标准）10/93 （orig. pub.）IPC-TM-650Test Methods Manual测试方法手册）Updated per test

39、 methodIPC-ET-652Guidelines and Requirements for Electrical10/90 （orig. pub.）Testi ng of Un populated Prin ted Boards（PCB裸板电气测试要求和导则）IPC-QL-653Qualification of Facilities that Inspect/Test Prin ted Boards, Comp onen ts, and Material（检查/测试印制板，元件和材料的设备鉴定）8/88 （orig. pub.）A 11/97IPC-MI-660Incoming In s

40、pect ion of Raw Materials Man ual（原材料来料检查手册）2/84 （orig. pub.）IPC-TA-720Tech no logy Assessme nt Han dbook on Lam in ates（层压板技术评估手册）IPC-TA-721Tech no logy Assessme nt Han dbook on Multilayer Boards（多层板技术评估手册）IPC-TA-722Tech no logy Assessme nt of Solderi ng焊接技 术评估）IPC-TA-723Tech no logy Assessme nt Ha

41、n dbook on Surfac Mounting（表面组装技术评估手册）IPC-TA-724Tech no logy Assessme nt Series on Clea nrooms（净化间技术评估）4/98IPC-PE-740Troubleshoot ing Guide for Prin ted Board Manu facture and Assembly印 制板制造及组 装故障修理指南）1/85 （orig pub.）A 12/97IPC-CM-770Prin ted Board Comp onent Mounting（印制板 元件安装）9/68 （orig. pub.）A 3/7

42、6B 10/80C 1/87D 1/96IPC-SM-780Comp onent Packagi ng and In terc onnecting with Emphasis on Surface Moun ti ng片式兀 件SMC的封装和互连）3/88 （orig. pub.）IPC-SM-782Surface Mount Desig n and Land Patter n Sta ndard(表面组装设计和焊盘图形标准)3/87 (orig. pub.)9/89A 8/93Ame ndme nt 1 10/96IPC-EM-782Surface Mount Desig n and Lan

43、d Patter n Spreadsheet(表面组装设计和焊盘图形电子表格)9/94 (orig. pub.) Adde ndum 12/95IPC-SM-784Guideli nes for Chip-on-Board Tech no logy Impleme ntati on(COB技术应用指南)11/90 (orig. pub.)IPC-SM-785（有电子 件）Guideli nes for Accelerated Reliability Test of Surface Mou nt Solder Attachme nts 表面组装 焊接可靠性加速试验指南)11/92 (orig.

44、pub.)IPC-SM-786已被J-STD-020替代Procedures for Characteriz ing and Han dli ng of Moisture/ Reflow Sen sitive ICs12/90 (orig. pub.)A 1/95IPC-MC-790Guideli nes for Multichip Module Tech no logy Utilizati on(多芯片模块技术应用指南)8/92 (orig. pub.)IPC-MS-810Guideli nes for High Volume Microsection(显微切面指南)10/93 (orig.

45、 pub.)IPC-S-816SMT Process Guideline and Checklist( SMT 工艺指南和检查表)7/93 (orig. pub.)IPC-SM-817Gen eral Requireme nts for Dielectric SurfaceMou nting Adhesives (绝缘性表面组装胶粘 剂通用规范)11/89 (orig. pub.)IPC-AJ-820Assembly and Joi ning Man ual组装和连接手 册)8/96 (orig. pub.)IPC-CA-821Gen eral Requireme nts for Therma

46、lly Con ductive Adhesives(热导胶粘剂通用技术要求)1/95 (orig. pub.)IPC-CC-830Qualificati on and Performa nee of Electro nic In sulat ing Compo und for Prin ted Board Assemblies1/84 (orig. pub.) 4/90 Reaffirmed A 10/98（印制板组装电绝缘材料的鉴定和性能）IPC-SM-839Pre and Post Solder Mask Applicati onClea ning Guideli nes(焊接前，后阻焊膜

47、的清洗指南)4/90 (orig. pub.)IPC-SM-840Qualificati on and Performa nee of Perma nent Polymer Coati ng (Solder Mask) for Prin ted Boards(印制板阻焊膜的鉴定和性能)11/77 (orig. pub.)A 7/83B 5/88C 1/96IPC-D-859Design Standard for Thick Film Multilayer Hybrid Circuits(厚膜多层混合电路设计标准)12/89 (orig. pub.)IPC-HM-860Specification

48、 for Multilayer Hybrid Circuits(多层厚膜电路技术规范)1/87 (orig. pub.)IPC-TF-870Qualificati on and Performa nee of Polymer Thick Film Prin ted Boards(聚合物厚膜印制 板的鉴定和性能)11/89 (orig. pub.)IPC-ML-960Qualificati on and Performa nee Specificati on for Mass Lam in ated Pan els for Multilayer Prin ted Boards(多层印制板预制内层

49、敷箔板的鉴定和性能 规范)7/94 (orig. pub.)IPC-1402/IPC-H-855Hybrid Microcircuit Design Guide(混合微波 电路设计指南)10/82 (orig. pub.)IPC-1710OEM Standard for Printed BoardManu facturers' Qualificatio nProfile (MQP)(印制板OEM制造商资格鉴 疋览表)2/94 (orig. pub.)12/97 updatedIPC-1720Assembly Qualification Profile （AQP）（印制板组装制造商资格鉴

50、疋览表）7/96 (orig. pub.)IPC-1730Lami nator Qualificatio n Profile （LQP）（层压板制造商资格鉴疋览表）1/98IPC-2141Con trolled Impeda nee Circuit Boards and High Speed Logic Desig n阻抗调制电路板和 高速逻辑电路设计）4/96 （orig. pub.）IPC-2221 代替 IPC-D-275Gen eric Sta ndard on Prin ted Board Desig n（印制板设计通用标准）2/98（orig. pub.）IPC-2222 代替 I

51、PC-D-275Sectional Desig n Sta ndard for Rigid Orga nic Prin ted Boards（刚性有机印制板设计标准）2/98（orig. pub.）IPC-2223Sectional Desig n Sta ndard for Flexible Printed Boards（柔性印制板设计标准）11/98IPC-3406Guideli nes for Electrically Con ductive Surface Mount Adhesives（表面组装导电胶导则）7/96 （orig. pub.）IPC-3408Gen eral Requireme nts for Ani stropically Con ductive Adhesive Films（各 向异性导电胶 粘剂通用技术要求）11/96 （orig.pub.）IPC-4101代替 IPC-L-108IPC-L-109IPC-L-112IPC-L-115Specification for Base Materials for Rigid and Multilayer Boards（刚性及多层印制板基材特性规范）12/97 （orig. pub.）*IPC-4110Specification and Characterization