PCB元件封装库规范

1、 深圳市XXXX科技有限公司企业标准 （设计标准） 印制电路板设计规范 元器件封装库尺寸要求 1 范围 本标准规定了印制电路板（以下简称PCB）设计所使用的元器件封装库中的焊盘图形及SMD焊盘图形尺寸要求。 本标准适用于深圳市国新动力科技有限公司。 2 引用标准 印制电路板设计规范工艺性要求。 印制电路板设计规范元器件封装库基本要求。 3 术语 SMD: Surface Mount Devices/表面贴装元件。 RA：Resistor Arrays/排阻。 MELF：Metal electrode face components/金属电极无引线端面元件. SOT：Small outline

2、transistor/小外形晶体管。 SOD：Small outline diode/小外形二极管。 SOIC：Small outline Integrated Circuits/小外形集成电路. SSOIC: Shrink Small Outline Integrated Circuits/缩小外形集成电路. SOP: Small Outline Package Integrated Circuits/小外形封装集成电路. SSOP: Shrink Small Outline Package /缩小外形封装集成电路. TSOP: Thin Small Outline Package/薄小外形

3、封装. TSSOP: Thin Shrink Small Outline Package/收缩薄小外形封装. CFP: Ceramic Flat Packs/陶瓷扁平封装. SOJ:Small outline Integrated Circuits with J Leads/ “J” 形引脚小外形集成电路. PQFP：Plastic Quad Flat Pack/塑料方形扁平封装。 SQFP：Shrink Quad Flat Pack/缩小方形扁平封装。 CQFP：Ceramic Quad Flat Pack/陶瓷方形扁平封装。 PLCC：Plastic leaded chip carrier

4、s/塑料封装有引线芯片载体。 LCC ：Leadless ceramic chip carriers/无引线陶瓷芯片载体。 DIP：Dual-In-Line components/双列引脚元件。 PBGA：Plastic Ball Grid Array /塑封球栅阵列器件。 4 使用说明 4.1 表格中的“min”表示最小尺寸； “max”最大尺寸； “ref”表示参考尺寸； “basic” 表示基本尺寸；封装名称中的 “mm”表示公制型号； in表示英制型号。 4.2 区域网格表示图形占用的网格数，表中给出为网格的数量，换算成mm时，应乘以0.5 mm。 5 焊盘图形 5.1 SMD：表面贴

5、装方焊盘图形尺寸 表面贴装方焊盘图形尺寸应符合图1的要求。焊盘名称X（mm）Y（mm）焊盘名称X（mm）Y（mm）焊盘名称X（mm）Y（mm）SMD0r17X1r600.171.60SMD0r80X3r400.803.40SMD2r20X2r002.202.00SMD0r25X1r600.251.60SMD1r00X0r901.000.90SMD2r20X2r602.202.60SMD0r30X1r600.281.80SMD1r00X1r001.001.00SMD2r40X2r002.402.00SMD0r35X1r600.351.80SMD1r00X1r401.001.40SMD2r40X2

6、r402.402.40SMD0r35X2r600.352.60SMD1r00X1r601.001.60SMD2r40X2r602.402.60SMD0r40X1r600.401.60SMD1r00X3r401.003.40SMD2r60X1r452.601.45SMD0r40X1r800.401.80SMD1r20X1r401.201.40SMD2r60X1r502.601.50SMD0r40X2r200.402.20SMD1r20X2r001.202.00SMD2r70X1r602.701.60SMD0r50X1r800.501.80SMD1r20X2r201.202.20SMD2r70X1

7、r802.701.80SMD0r50X2r000.502.00SMD1r30X1r001.301.00SMD2r80X1r402.801.40SMD0r50X2r200.502.20SMD1r40X2r201.402.20SMD3r20X1r803.201.80SMD0r60X2r000.602.00SMD1r40X2r401.402.40SMD3r40X1r903.401.90SMD0r60X2r200.602.20SMD1r40X3r401.403.40SMD3r60X1r803.601.80SMD0r65X2r200.652.20SMD1r50X1r301.501.30SMD3r60X2

8、r203.602.20SMD0r65X2r400.652.40SMD1r60X1r201.601.20SMD4r00X1r804.001.80SMD0r65X2r600.652.60SMD1r60X1r301.601.30SMD5r40X6r205.406.20SMD0r70X0r600.700.60SMD1r80X1r401.801.40SMD4r00X1r804.001.80SMD0r80X1r400.801.40SMD1r80X1r601.801.60SMD6r80X1r906.801.90SMD0r80X1r600.801.60SMD2r00X1r602.001.60SMD6r80X9

9、r606.809.60SMD0r80X2r600.802.60SMD2r00X1r802.001.80SMD13r60X13r4013.6013.40图1 表面贴装方焊盘图形尺寸5.2 SMDC：表面贴装圆焊盘图形尺寸表面贴装圆焊盘图形尺寸应符合图2要求。见图2： 焊盘名称C（mm） 焊盘名称 C（mm）SMDC0r350.35 SMDC0r90 0.90SMDC0r400.40 SMDC1r00 1.00SMDC0r500.50 SMDC2r60 2.60SMDC0r600.60图 2 表面贴装圆焊盘图形尺寸5.3 SMDF表面贴装手指焊盘图形尺寸表面贴装手指焊盘图形尺寸应符合图3要求。见图

10、3： 焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)SMDF1r00X2r501.002.50SMDF1r80X2r501.802.50SMDF1r00X2r801.002.80SMDF1r80X2r301.802.30图3 表面贴装手指焊盘图形尺寸5.4 THC通孔圆焊盘图形尺寸通孔圆焊盘图形尺寸应符合图4要求。见图4：焊盘名称C（mm/mil）D(mm/mil)焊盘名称C（mm/mil）D(mm/mil)THC0r50D0r200.45/180.20/8THC1r30D0r801.30/510.80/32THC0r60D0r300.60/240.30/12THC1r40D0r90

11、1.40/550.90/36THC0r70D0r400.70/280.40/16THC1r50D1r001.50/601.00/40THC0r90D0r500.80/360.50/20THC2r60D1r302.60/1021.30/51THC1r10D0r601.10/440.60/24THC3r20D1r603.20/1261.60/63THC1r20D0r701.20/480.70/28THC4r00D2r004.00/1582.00/79THC1r20D0r701.23/490.73/29THC0r00D3r000/03.00/118图4 通孔圆焊盘图形尺寸5.5 THS通孔方焊盘图形

12、尺寸通孔方焊盘图形尺寸应符合图5要求。见图5：焊盘名称S（mm/mil）D(mm/mil)焊盘名称S（mm/mil）D(mm/mil)THS1R10D0R601.10/440.60/24THS1r50D1r001.50/601.00/40THS1r20D0r701.20/480.70/28THS2r60D1r302.60/1021.30/51THS1r30D0r801.30/510.80/32THS3r20D1r603.20/1261.60/63THS1r40D0r901.40/550.90/36THS4r00D2r004.00/1582.00/79图5 通孔方焊盘图形尺 5.6 THR通孔矩

13、形焊盘图形尺寸通孔矩形焊盘图形尺寸应符合图6要求。见图6： 焊盘名称X（mm/mil）Y（mm/mil）D(mm/mil)THR1r20X1r40D0r701.20/481.40/550.70/28图6 通孔矩形焊盘图形尺寸6 SMD 元器件及焊盘图形尺寸6.1 SMD分立元件6.1.1 SMD电阻6.1.1.1 SMD电阻元件尺寸SMD电阻元件尺寸应符合图7的规定。见图7：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)minmaxminmaxminmaxminmaxmax0402R1.001.100.400.700.480.600.100.300.400603R1.501.700

14、.701.110.700.950.150.400.600805R1.852.150.551.321.101.400.150.650.651206R3.053.351.552.321.451.750.250.750.711210R3.053.351.552.322.342.640.250.750.712010R4.855.153.153.922.352.650.350.850.712512R6.156.454.455.223.053.350.350.850.71图7 SMD电阻元件尺寸6.1.1.2 SMD电阻的焊盘尺寸 SMD电阻的焊盘尺寸应符合图8的规定。见图8：封装名称Z(mm)G(mm)

15、X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref0402R2.200.400.700.901.302×40603R2.800.601.001.101.704×60603R-W3.200.800.701.202.004×60805R3.200.601.501.301.904×80805R-W3.600.801.001.402.204×81206R4.401.201.801.602.804×101206R-W4.801.201.201.803.004×101210R4.401.202.701.602.806&#

16、215;102010R6.202.602.701.804.406×142512R7.403.803.201.805.608×16 注：大于 0603R的元件在波峰焊时， Y-尺寸向外侧增加 0.2mm， X-尺寸减小 30% 。封装名称加后缀“ -W”。图8 SMD电阻的焊盘尺寸6.1.2 SMD电容6.1.2.1 SMD电容元件尺寸SMD电容元件尺寸应符合图9的规定。见图9：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)minmaxminmaxminmaxminmaxmax0402C0.901.100.300.650.400.600.100.300.60050

17、4C1.021.320.260.720.771.270.130.381.020603C1.451.750.450.970.650.950.200.500.850805C1.802.200.301.111.051.450.250.751.101206C3.003.401.502.311.401.800.250.751.351210C3.003.401.502.312.302.700.250.751.351812C4.204.802.303.463.003.400.250.951.351825C4.204.802.303.466.006.800.250.951.10图9 SMD电容元件尺寸6.1.

18、2.2 SMD电容焊盘尺寸SMD电容焊盘尺寸应符合图10的规定。见图 10：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref0402C1.600.400.700.601.002×40504C2.000.401.300.801.204×60603C2.800.601.001.101.704×60603C-W3.200.800.701.202.004×60805C3.200.601.501.301.904×80805C-W3.600.801.001.402.204×81206C4.401.20

19、1.801.602.804×101206C-W4.801.201.201.803.004×101210C4.401.202.701.602.806×101812C5.802.003.401.903.908×121825C5.802.006.801.903.9014×12 注：大于 0603C的元件在波峰焊时， Y-尺寸向外侧增加 0.2mm， X-尺寸减小 30% 。封装名称加后缀“ -W”。图10 SMD电容焊盘尺寸6.1.3 SMD电感6.1.3.1 SMD电感元件尺寸SMD电感元件尺寸应符合图11的规定。见图 11：封装名称L(mm)S(

20、mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax2012L-C1.702.301.101.760.601.200.100.301.203216L-C2.903.501.902.631.301.900.200.501.904516L-C4.204.802.603.530.601.200.300.801.90-2825L-P2.202.800.901.621.952.112.102.540.370.652.290.073225L-P2.903.500.901.831.401.80-0.501.002.000.5

21、04532L-P4.204.802.203.133.003.40-0.501.002.800.505038L-P4.354.952.813.512.462.623.413.810.510.773.800.763225-3230L-M3.003.401.602.181.802.002.302.700.400.702.400.514035L-M3.814.320.811.601.201.502.923.181.201.502.671.274532L-M4.204.802.303.152.002.203.003.400.650.953.400.505650L-M5.305.503.304.323.8

22、04.204.705.300.501.005.801.008530L-M8.258.765.256.041.201.502.923.181.201.502.671.27 注：C 为Chip的简写,P为 Prec.w/w ( Precision wire wound ) 的简写,M为 Molded的简写。图11 SMD电感元件尺寸6.1.3.2 SMD电感焊盘尺寸SMD电感焊盘尺寸应符合图12的规定。见图 12：封装名称Z(mm)G(mm)X(mm)C(mm)Y(mm)区域网格（网格单元号码）refref2012L-C3.001.001.002.001.004×83216L-C4.20

23、1.801.603.001.206×104516L-C5.802.601.004.201.604×122825L-P3.801.002.402.401.406×103225L-P4.601.002.002.801.806×104532L-P5.802.203.604.001.808×145038L-P5.803.002.804.401.408×143225-3230L-M4.401.202.202.801.606×104035L-M5.401.001.403.202.208×124532L-M5.801.802.4

24、03.802.008×145650L-M6.803.204.005.001.8012×168530L-M9.805.001.407.402.408×2注 1后缀“ -C”的元件在波峰焊时，Y-尺寸向外侧增加 0.2mm，X-尺寸减小 30%。封装名称加后缀“ -W”。 2 后缀“ -P”和“ -M”的元件在波峰焊时，Y-尺寸向外侧增加0.2mm，X-尺寸不变，封装名称加后缀“ -W”。图 12 SMD电感焊盘尺寸6.1.4 SMD钽电容6.1.4.1 SMD钽电容元件尺寸 SMD钽电容元件尺寸应符合图13的规定。见图13：封装名称L(mm)S(mm)W1(mm)W

25、2(mm)T(mm)H1(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax3216T3.003.400.801.741.171.211.401.800.501.100.701.803528T3.303.701.102.042.192.212.603.000.501.100.702.106032T5.706.302.503.542.192.212.903.501.001.601.002.807343T7.007.603.804.842.392.914.004.601.001.601.003.1图 13 SMD钽电容元件尺寸6.1.4.2 SMD钽电容焊盘

26、尺寸SMD钽电容的焊盘尺寸应符合图14的规定。见图 14：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refref3216T4.800.801.202.002.806×123528T5.001.002.202.003.008×126032T7.602.402.202.605.008×187343T9.003.803.002.606.4010×20注：元件在波峰焊时， Y尺寸向外侧增加0.2mm， X 尺寸不变，封装名称加后缀“ -W”。图14 SMD钽电容焊盘尺寸6.1.5 MELF（金属电极无引线端面元件）6.1.

27、5.1 MELF元件尺寸MELF元件尺寸应符合图15的规定。见图15：mm in封装名称L(mm)S(mm)W(mm)T(mm)元件类型MinMaxminmaxminmaxminmaxSOD80MLL343.303.702.202.651.601.700.410.55二极管SOD87MLL414.805.203.804.252.442.540.360.50二极管2012M0805M1.902.101.161.441.351.450.230.370.10mW电阻3216M1206M3.003.401.862.311.751.850.430.570.25mW电阻3516M1406M3.303.70

28、2.162.611.551.650.430.570.12W电阻5923M2309M5.706.104.364.812.402.500.530.670.25W电阻图15 MELF元件尺寸6.1.5.2 MELF的焊盘尺寸MELF的焊盘尺寸应符合图16的规定。见图16：mm in封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)AB区域网格（网格单元号码）refrefSOD80MLL344.802.001.801.403.400.500.506×12SOD87MLL416.303.402.601.454.850.500.506×142012M0805M3.200.601

29、.601.301.900.500.354×83216M1206M4.401.202.001.602.800.500.556×103516M1406M4.802.001.801.403.400.500.556×125923M2309M7.204.202.601.505.700.500.656×18注：元件在波峰焊时， Y尺寸向外侧增加0.2mm， X 尺寸不变，封装名称加后缀“ -W”。图 16 MELF焊盘尺寸6.1.6 SMD排阻6.1.6.1 SMD排阻元件尺寸 SMD排阻元件尺寸应符合图 17的规定。见图17： 封装名称L(mm)W(mm)T(mm

30、)A(mm)B(mm)P(mm)C(mm)06033.2±0.101.6±0.150.5±0.100.5±0.150.3±0.150.8±0.10.3±0.1512065.08±0.303.2±0.200.6±0.100.9±0.150.5±0.201.27±0.10.3±0.15图17 SMD排阻元件尺寸6.1.6.2 SMD排阻焊盘尺寸SMD排阻焊盘尺寸应符合图18的规定。见图 18： 封装名称区域网格（网格单元号码）1206RA8x6图 18 SMD

31、排阻焊盘尺寸6.1.7 SOT 236.1.7.1 元件尺寸SOT 23的尺寸应符合图19的规定。见图19：封装名称L(mm)S(mm)W(mm)T(mm)H(mm)P(mm)MinmaxminmaxminmaxminmaxmaxnomSOT 232.302.601.101.470.360.460.450.601.100.95图19 SOT 23的元件尺寸 6.1.7.2 SOT 23的焊盘尺寸SOT 23的焊盘尺寸应符合图20的规定。见图20 封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)E(mm)区域网格（网格单元号码）refRefrefSOT 23(回流焊)3.600.801

32、.001.402.200.958×8注:如果采用波峰焊工艺，“ Y” 尺寸外延0.2 mm。图 20 SOT 23 焊盘尺寸6.1.8 SOT 896.1.8.1 元件尺寸SOT 89的尺寸应符合图21的规定。见图21：封装名称L(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minmaxminmaxminmaxminmaxminmaxminmaxmaxbasicSOT 893.944.250.891.200.360.480.440.561.621.832.602.851.601.50图21 SOT 89的元件尺寸6.1.8.2 SOT 89的焊盘

33、尺寸SOT 89的焊盘尺寸应符合图22的规定。见图22：封装名称Z(mm)Y1(mm)X1(mm)X2(mm)X3(mm)Y2(mm)Y3(mm)E(mm)区域网格（网格单元号码）MinmaxminmaxrefRefbasicSOT 895.401.400.800.801.001.802.002.404.901.5012×10图 22 SOT 89 焊盘尺寸6.1.9 SOD 1236.1.9.1 元件尺寸SOD 123的尺寸应符合图23的规定。见图23：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)minMaxMinmaxminmaxminmaxMinma

34、xmaxSOD 1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173.311.962.213.303.940.761.522.41图23 SOD 123的元件尺寸6.1.9.2 SOD 123的焊盘尺寸SOD 123的焊盘尺寸应符合图24的规定。见图24：封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）refrefSOD 1235.001.800.801.603.404×12SMB6.802.002.402.404.408×16图24 SOD 123 焊盘尺寸6.1.

35、10 SOT 1436.1.10.1 元件尺寸SOT 143的尺寸应符合图25的规定。见图25：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)P1(mm)P2(mm)H(mm)MinMaxminmaxMinmaxminmaxMinmaxbasicbasicMaxSOT 1432.102.641.001.690.370.460.760.890.250.551.921.721.20图25 SOT 143的元件尺寸6.1.10.2 SOT 143的焊盘尺寸SOT 143的焊盘尺寸应符合图26的规定。见图26： 封装名称Z(mm)G(mm)X1(mm)X2(mm)C(mm)E1(mm)

36、E2(mm)Y(mm)区域网格（网格单元号码）MinmaxrefbasicBasicrefSOT 1433.600.801.001.001.202.201.901.701.408×8图 26 SOT 143 焊盘尺寸6.1.11 SOT 2236.1.11.1 元件尺寸SOT 223的尺寸应符合图27的规定。见图27：封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P2(mm)P1(mm)MinMaxminmaxMinmaxminmaxMinmaxMaxbasicbasicSOT 2236.707.304.104.920.600.882.903.180.901

37、.301.802.304.60图27 SOT 223的元件尺寸6.1.11.2 SOT 223的焊盘尺寸SOT 223的焊盘尺寸应符合图28的规定。见图28： 封装名称Z(mm)G(mm)X1(mm)X2(mm)C(mm)E1(mm)E2(mm)Y(mm)区域网格（网格单元号码）MinmaxrefbasicBasicrefSOT 1438.404.001.203.403.606.202.304.602.2018×14图 28 SOT 223 焊盘尺寸6.1.12 TO 252/TO 2686.1.12.1 元件尺寸TO 252的尺寸应符合图29的规定。见图29：封装名称L(mm)W1

38、(mm)W2(mm)T1(mm)T2(mm)P1(mm)P2(mm)H(mm)MinMaxminmaxMinmaxminmaxMinmaxbasicbasicmaxTS-003a9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005b14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO 26818.7019.101.151.4513.3013.602.402.7012.4012.705.4510.905.1注a : 以前为TO 252。注b ：以前为 TO 263。图29

39、 TO 252的元件尺寸6.1.12.2 TO 252的焊盘尺寸TO 252的焊盘尺寸应符合图30的规定。见图30：封装名称Z(mm)Y1(mm)Y2(mm)X1(mm)X2(mm)C(mm)区域网格（网格单元号码）refS-003*11.201.606.201.005.407.3024×16TS-005*16.603.409.601.006.8010.1036×24TO 26819.803.4013.401.4013.6011.4042×34图 30 TO 252 焊盘尺寸6.1.13 SMD220元件6.1.13.1 SMD220元件尺寸元件尺寸应符合图31的

40、规定。见图31：封装名称D2PaK(SMD-220)图31 SMD-220元件尺寸 6.1.13.2 SMD-220 焊盘尺寸焊盘尺寸应符合图32的规定。见图32：封装名称区域网格（网格单元号码）SMD-22024x36图 32 SMD-220焊盘尺寸6.1.14 SMA元件(对应物料代码为15100016a)6.1.14.1 SMA元件尺寸SMA元件尺寸应符合图 33的规定。见图33：封装名称SMAPLASTIC PACKAGECASE 403B-01ISSUE O图33 SMA元件尺寸6.1.14.2 SMA焊盘尺寸焊盘尺寸应符合图34的规定。见图34： 封装名称区域网格（网格单元号码）S

41、MA6x14图 34 SMA焊盘尺寸6.1.15 SOT-323元件(对应物料代码为15100001)6.1.15.1 SOT-323元件尺寸SOT-323元件尺寸应符合图35的规定。见图 35：封装名称SOT-323(SC-70 3 Lead)图35 SOT-323元件尺寸6.1.15.2 SOT-323焊盘尺寸SOT-323焊盘尺寸应符合图36的规定。见图 36： 封装名称区域网格（网格单元号码）SOT-3234x6图 37 SOT-323焊盘尺寸6.1.16 SOT-363 元件6.1.16.1 SOT-363 元件尺寸SOT-363元件尺寸应符合图38的规定。见图38：封装名称SOT-

42、363(SC-70 6 Lead)图38 SOT-363元件尺寸6.1.16.2 SOT-363焊盘尺寸SOT-363焊盘尺寸应符合图39的规定。见图 39：封装名称区域网格（网格单元号码）SOT-3634x6图 39 SOT-363焊盘尺寸6.2 两侧翼形引脚元件6.2.1 SOICSmall Outline Integrated Circuits:小外形集成电路6.2.1.1 元件尺寸SOIC 的尺寸应符合图40的规定。见图40： 封装名称L(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mmminmaxminMaxminmaxminmaxminmaxminmaxm

43、inmaxbasicSO8-1505.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27SO8-30010.0010.657.468.850.330.510.401.277.407.605.055.452.352.651.27SO14-1505.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14-30010.0010.657.468.850.330.510.401.277.407.608.809.202.352.651.27SO16-1505.806.20

44、3.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16-30010.0010.657.468.850.330.510.401.277.407.6010.1010.502.352.651.27SO20-30010.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24-30010.2910.648.219.010.360.510.531.047.407.6015.5415.852.342.641.27SO24-35011.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28-30010.2910.648.219.010.360.510.531.047.407.6018.0818.392.342.641.27SO28-35011.8112.179.7310.540.360.510.531.048.769.0218.0818.392.342.641.27SO32-30010.2910.648.219