FPC专业词汇中英文对照

1、FPC 名词中英对照1. 目的通过对行业标准的 FPC工程名词引用及我司标准的整合，旨在为我司 FPC名词的中英用语实现使用上的统一化2. 适用范围规范 FPC相关工程上出现之不良项目，生产使用之材料、 设备、治具以及可靠性试验等中英文名词3. 定义无类别一： FPC不良项目名词工程类别导线VisualInspection ofConductors基底薄膜VisualInspection ofBase Film覆盖层和覆盖涂层VisualInspection ofCoverlay andCovercoat外来物不良名称中文英文导线Conductors开路Open短路Short缺口Nicks针孔

2、Pinholes额外铜刺Extraneous Copper Between Conductors毛刺Spurs结瘤Nodules蚀刻凹痕Etched Concave导线分层Conductor Delamination裂纹Cracks导线划痕Scratches on Conductor凹坑Dents变色Discoloration凹坑Dents划痕Scratches on Base Film凹坑Dents on Coverlay and Covercoat划痕Scratches on Coverlay and Covercoat空洞Void偏位Coverlay Misalign毛刺Coverlay

3、 Burrs导电性异物Conductive Foreign MattersForeign Matters电镀金属或焊锡的表面条件SurfaceCondition of Plated Mentaland Solder外形和孔边缘VisualInspection ofEdges of Outlineand Holes增强板VisualImperfectionsRelated toStiffenerBonding表面附着物AffixedSubstances on非电性异物Non-conductive Foreign Matters起泡和分层Blistering and Delamination覆盖层

4、粘结剂挤出Squeeze-out of Adhesive of Coverlay覆盖涂层渗出Ooze-out of Covercoat覆盖涂层跳漏Skipping of Convercoat镀金Gold Plating镀金层缺陷Gold Plating Defects镀锡Tin Plating电镀金属或焊料的Penetration of Plated Metal or Solder渗透变暗（变黑）Darkened Appearance (BlackeningDiscoloration)镀铜孔内镀层空洞Plating Voids in Plated-though Hole镀金粗糙Rough Go

5、ld镀金白雾Gold Discoloration镀金变色Gold Discoloration镀金层龟裂Gold Crack镀金针孔Gold Pinhole电镀露铜Plated Expose Wetting剥离Plated Peeled Off电镀渗入Plated Wicking漏镀No Plating表面伤痕Plating Scratch电镀粗糙Rough Plated药水渗入Wicking撕裂和缺口Tears and Nicks毛刺Burrs丝状毛刺Thready Burrs弯曲、变形Warpage微连筋不良Poor Micro-joint外形偏移Outline Misalign外形漏冲No

6、 Outline反折偏位Bending Line MisalignFPC与增强板之间Foreign Matter Between Flexible Printed Board的外来物and StiffenerFPC与增强板之间Voids Between Flexible Printed Board and的空洞Stiffener裂纹Cracks缺角Chip-off划痕Scratches变形Deformation增强板贴偏移Stiffener Misalign热固胶Thermosetting Adhesive焊剂残渣Flux Residues金属粉末残渣Residue of Metal Powd

7、ersthe Surface标记 Marking定位精度PositionalAccuracy增强板与 FPC的重合性Registration of Stiffener to FPC其它 Other粘结剂残渣Residue of Adhesive突起Protrusions凹坑Dents弓曲Bow扭曲Twist尺寸检验Dimensional Inspections尺寸测量Measurement of Dimensions外部尺寸External Dimensions厚度Thickness孔Holes元件孔Component Holes导通孔Via Holes导通孔偏移Via Hole Misali

8、gn安装孔Mounting Holes导线宽度Conductor Widths导线之间的间距Clearances Between Conductors孔中心间距Distance Between Hole Centers板边和导线之间的Minimum Distance Between Board Edges and最小距离Conductors标记错误Wrong Marking字符不清晰Unclear Letter孔的定位精度Positional Accuracy of Holes孔与焊盘的重合性Registration of Hole to Land覆盖层与焊盘的重Registration of

9、 Coverlay (or Covercoat) to合性Land孔的重合性Registration of Holes外形的重合性Registration of Outlines冲外形与导线图形Registration of Punched Outline to Conductor的重合性Patterns压敏胶或热固胶与Registration of Pressure Sensitive or HeatFPC和增强板的重Activated Adhesives to FPC and Stiffener合性镀通孔的镀铜层厚Plating Thickness of Copper Panted-thr

10、ough度Holes短装Shortage混装Mixed Stowage/Packing离型纸脱落Released Paper Peeled off材料错误Wrong Material类别二： PFC工程用语工程类别中文英文板单面板Single Sided Flex CircuitsBoard Type单面双接触Double Access or Back-bared Flex Circuits双面板Double Sided Flex Circuits软硬结合板Rigid-flex Circuits模具图纸Die Drawing量产模具Mass Production Die样品模具Prototyp

11、e Die钢模Steel Die刀模Die上模Top Die下模Bottom Die模具线切割Wire Cut外形模具Outline CutDie保护膜模具Coverlay Die胶纸模具Pressure Sensitive Adhesive Die补强模具Stiffener Die银浆模具Silver Die导柱Post冲头Punch分割刀模Cutting Steel Rule Die销钉Pin贴合治具Lamination Jig治具电测治具Electrical Check Jig假贴治具Tacking JigJig( Fixture)曝光治具Exposure Jig丝印网框Screen P

12、rinting Frame曝光定位孔Guide Hole for Exposure模具定位孔Guide Hole for Die假贴定位孔Guide Hole for Tacking孔贴合定位孔Guide Hole for AdhesiveHole电测定位孔Guide Hole for Electrical Test丝印定位孔Guide Hole for Screen Printing孔环Lifted Land渗锡孔Stannize Hole装配孔Fitting Hole下料Material Preparation钻孔Drilling镀铜Copper Plating化学铜le Eletcrol

13、ess Plating Copper贴干膜Sensitive Dry Film丝印阻焊油墨Liquid Photosensitive Soldermask制程曝光ExposureManufacture显影DevelopingProcedure蚀刻Etching脱膜Stripping贴保护膜Tacking Coverlay粗化Abrade层压Lamination固化 ( 烘烤）Curing黑孔Black Hole表面处理Surface Treatment循环水洗Cascade Rinse微蚀Micro-etch酸洗Acid Cleaning水洗Water Cleaning防锈处理Anti-cor

14、rosion Treatment前处理Pre-treatment刷板Brushing干燥Dry up电镀（金、锡、(Gold 、Solder 、Nickel) Plating镍）闪镀(Gold ) Flash Plating/Strike Plating局部电镀Pattern Plate化学镍金Immersion Gold有机保焊膜Organic Solderability Preservatives (OSP)丝印字符Printing of Legend贴补强板Back Board Lamination电性能测试Electrical Inspection贴胶纸Double Faced Adh

15、esive Tape打孔Punching雷射切割Laser Cut自动光学检验Automatic Optical Inspection（ AOI）表面贴装Surface Mounting Technology（SMT）外形冲切Punching冲孔Punching外观检查Final Inspection目视检查Visual Inspection （ Final Inspection)线路显微镜检Conductor Microscope Inspection验（镜检）性能测试Reliability Test包装Packing铜箔Copper Foil (CU)电解铜Electro-deposite

16、d Copper Foil (ED)压延铜Rolled Annealed Copper Foil (RA)保护膜Coverlay (CVL)基材Base Material挠性覆铜板Flexible Copper Clad Laminate (FCCL)无胶基材Adhesiveless FCCL粘接剂（胶）Adhesives (Ad)原材料 MaterialAcrylic压克力顶层补强Top Stiffener底层补强Bottom Stiffener顶层银浆膜Top Silver Paste底层银浆膜Bottom Silver Paste银浆油墨Sliver Ink顶层线路Top Circuit

17、s/Conductors底层线路Bottom Circuits/Conductors半固化片Bonding Film (BOD)聚酰亚胺Polyimide(PI)聚酯Polyester Film (PET)钢片Sheet Steel玻璃纤维布Woven Glass ClothFR4补强板Fiberboard液态感光油墨Liquid Photoimageable Resist Ink压敏胶Pressure Sensitive Adhesive（PSA）离型膜Release Paper导电胶Conducting Resin导电布Electric Fabric泡棉Foam导向导电胶Anisotrop

18、ic Conductive Film（ACF）导电泡棉Conductive/Electric Foam屏蔽膜Shield Film(金属)薄膜开Metal Dome （ DOME）关连接器Connector电容Capacitance( C )电阻Resistance( R )集成电路Integrated Circuit（IC）二极管Diode (D)静电Electro-Static Discharge（ESD）机械方向Machine Direction（MD）垂直方向Transverse Direction（TD）进刀Feed进刀量Chip Load转速Speed焊接Soldering手工焊接

19、Hand Soldering波焊Wave Soldering品质允收标准Acceptable Quality Level（ AQL）其菲林Film它Legend字符OthersOven烘箱温度Temperature湿度Humidity速度Speed压力Pressure喷淋压力Spouting Pressure浓度Concentration原理图纸Schematic Diagram线宽Line Space线距Line Width线路间距Pitch类别三：FPC可靠性测试项目中文英文电气性能Testing of Electrical Performance导线电阻Conductor Resistance表面层绝缘电阻Surface Insulation Resistance (SIR)表面介质层耐电压强度Dielectric Withstanding Voltage of Surface Layers机械性能测试Testing of Mechanical Property剥离强度Peel Strength孔和焊垫的拉脱强度Pull-out Strength