西门子可靠性培训资料ppt课件

1、6,000,008,00M. Chbat, S. Eberlin, M. Tochtermann, T. JuhnkehiT 7500 Multi-Haul DWDM system Product Reliability Update Processes, Status, and MeasuresSept 15, 2004Information and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components: EDFA VOA GTC PassivesNegotiation

2、s with suppliers: Modeling Field experience Supplier comparisonElectrical Components: Resistors Capacitors Transistors ICs etc.Standards: SN 29500 IEC 61709Mechanical Components: Connectors Boards etc.Standards: SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communica

3、tion Networks6,000,008,00Product Reliability Assurance ProcessReference : Siemens standard; in agreement with international standards IEC 61709product definitionproduct developmentproduct deliveredrequirements aligned with technology basis failure rate allocation to individual cards involvement of c

4、omponent engineering & QAcard failure rates on basis of parts listscomponent rating by designnew & critical components specificationnew components & supplier auditsin production failure controlfield return analysis & threshold monitoringconservative data based on predicted valuesregu

5、lar component supplier auditsInformation and Communication Networks6,000,008,00Reliability Control and ImprovementCross-functional team established to install focused program Close interaction with the supplier for design, technology and processEarly failure monitoring and feedback in development ph

6、ase Extended testing including temperature cycling in productionDetailed failure monitoring in production for early corrective actionInformation and Communication Networks6,000,008,00Predicted FIT rates vs. field return FIT ratesnField return FIT rate inherently is (!) lower than predicted FIT rate

7、nspare parts dont contribute to FMAnnon-installed equipment at certain carriersnlow channel count for many yearsntemperature for FIT estimation probably higher than in realitynmargin (e.g., due to low channel count, low PMD, BOL) can mask performance degradationInformation and Communication Networks

8、6,000,008,00Functional Partition of OLIOptical amplification via EDFA gain blockPump diodesMonitor diodesEDF-HeaterInternal Gain SwitchOSC splitting functions asAdd / Drop of the OSC channel using wavelength selective couplersSplitting of monitor signals at the input and output port and at intermedi

9、ate measurement pointsSpectral shaping of the signal using aVOA for setting the EDFA to an optimized operating pointGTC for tilt compensationOptical monitor ports at input and output for signal supervisionAPSD circuitryGain Control and Supervision (DSP, on-board processor)Electrical components for c

10、ontrol and power supplyMechanics including PCBInformation and Communication Networks6,000,008,000 1 2 3 4 5 6 7 8 9 10 11 12 13 Operating time T in yearsFailure rate l Early failuresl totall totalWear-out failureThe bathtub curve: Failure rates l via time TRandom failureFor the field replaceable HW-

11、units and their componentsthe failure rate l could be only predicted by random failures!The unit of the failure rate l is a FIT(Failure in Time; 1 FIT = 1 Failure per 109h)!Bathtub CurveInformation and Communication Networks6,000,008,00IEC 61709: Electronic components ReliabilityReference conditions

12、 for failure rates and stress models for conversion (no basic failure rates)Relationship between StandardsSIEMENS standard SN29500 / IEC 61709 compared to SR-332SR-332: Reliability Prediction Procedure forElectronic EquipmentSN29500: Failure rates of componentsExpected values(This is in addition to

13、IEC 61709)a) Climatic and mechanical stresses per IEC 721-3-3 (see next slide)multiplying factors for environmentalconditionsb) Quality factortested components SN725004 quality levels knownc) Temperature and electrical stressby reference conditions IEC 61709given reference conditions and conversion

14、(SR-332)Information and Communication Networks6,000,008,00IEC 61709: Electronic components Reliability Reference conditions for failure rates and stress models for conversionThe failure rate under operating conditions is calculated as follows:TIUfRe l l l lWherelref is the failure rate under referen

15、ce conditions;pU is the voltage dependence factor;pI is the current dependence factor;pT is the temperature dependence factor.These Parameter are listed e.g in the SN29000 library!Reference conditions for climatic and mechanical stressesType of stressReference condition 1)qamb, ref 40 qamb, ref 40 C

16、 CClimatic conditionsClass 3K3 as per IEC 721-3-3Mechanical stressClass 3M3 as per IEC 721-3-3Special stresses 3)NoneFor details of notes (-1, -2,-3) please refer to IEC 61709Ambient temperature 2)The definitions, reference conditions and conversion models used in the IEC 61709 fullycorrespond with

17、the already existing SIEMENS standard SN 29500 method.Details: SIEMENS Standard SN29500 and IEC 61709Information and Communication Networks6,000,008,00FIT Rates of Individual Electrical Components (1)Voltage dependence and Current dependence UC UUeCrefC()122 UCUUUUeCrefC()() )maxmax322(1)(2)UOperati

18、ng voltage in VUrefReference voltage in VUmaxRated voltage in VC1Constant in (1/V)C2C2,C3Constants(1).Digital CMOS Families, Contactors (2).Others ICIIIIeCrefC()()maxmax455IOperating current in AIrefReference current in AImaxRated current in AC4,C5ConstantsInformation and Communication Networks6,000

19、,008,00FIT Rates of Individual Electrical Components (2)AConstantEa1,Ea2Activation energies in eVTU,refReference ambient temperature in KT1Reference junction*)- (comp.*)-) temperature in KT2Actual junction*)- (comp.*)-) temperature in K*) Depends on type of component, see also SN 29500, Part 1, Capt

20、. 4.3 TEa zEazEa zEazA e+ (1- A) eA e+ (1- A) e121ref2refwithinin z11605 (1T1T)1eVz11605 (1T1T)1eVU2refU1refrefandTemperature dependenceInformation and Communication Networks6,000,008,00The expected failure rate of a HW-unit can be calculatedby adding the expected failure rates of the components : l

21、 l l ljjComponentUnitEPROMCapa. Resi.FanTrans.DiodeDC/DCOptic. ModuleICPINsLEDSolder jointsASICfield-replaceable HW-unit (Example)EPROMOptic. ModulePINsLEDICICICTrans.DiodeDiodeTrans.Trans.FanCapa. Capa. Capa. Capa. Capa. Resi.Resi.Resi.Resi.Resi.Resi.Resi.ASICResistors1 FIT8168 FITCapacitors2 FIT61

22、212 FITDiodes8 FIT3624 FITTransistors15 FIT41260 FITICs25 FIT464100 FITEPROM100 FIT264200 FITDC/DC40 FIT22880 FITASIC250 FIT21016500 FITFAN150 FIT210300 FITOptical Module800 FIT2321.600 FITSolder joints0,1 FIT1260126 FIT3.010 FITFailure rates ofl ComponentsSum offailure ratesName ofComponentsNo.ofPi

23、nsNo.ofComp.Example: tot. failure rate of the HW-unit l unit =Component 1R1, l1Component 2R2, l2Total functional reliability (survivor) Rtot of two components : tttt21tottot2121eeee(t)R(t)R(t)R l l l l l l l l l l Details: Total Reliability and Total Failure Rate of UnitInformation and Communication

24、 Networks6,000,008,00Siemens Reliability Process OverviewOptical Components: EDFA VOA GTC PassivesNegotiations with suppliers: Modelling Field experience Supplier comparisonElectrical Components: Resistors Capacitors Transistors ICs etc.Standards: SN 29500 IEC 61709Mechanical Components: Connectors

25、Boards etc.Standards: SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communication Networks6,000,008,00Estimation of FIT Rates for Optical ComponentsIn parallel to the qualification cross-check detailed discussions take place with the vendorWhat is the estimate of the

26、 vendor? How did he reach his estimate ? What is the FIT rate of sub-components and PCBAs of the module ?Results of the cross-qualification are taken into account (failures, corrective actions, changes)The estimation of the vendor and the expertise of qualification team lead to the Siemens estimate

27、(not necessarily the same as the vendors estimate)Field returns are taken into account when available and compared to the estimateFIT rates are adapted accordingly (repetitive process)Information and Communication Networks6,000,008,00Example of FIT Rate Adaption: EDFA w/ 5 pumpsFirst estimate in 200

28、1: 6000 FIT (complete new design incl. new Pumps, no experience at SIEMENS side)New vendors (new spec.) were qualified by CoC Optics and the CoC process took placeEstimates by two vendors: 3500 - 4800 FITReduction to 5000 FIT beginning of 2004Quality improvement discussions with the vendors ongoingC

29、heck with field returns: 1600 FITReduction to 4000 FIT(Siemens estimate) in April of 2004Continuously monitoredSimilar process with EDFAs (2 pumps) lead to an estimate of 2400 FITInformation and Communication Networks6,000,008,00Example of FIT Rate Calculation for an Optical Amplifier Provided by th

30、e EDFA Supplier (1)optical components (40C)VendorSub fit rate quantity Fit rate980nm Laser diodeSupplier A 3201320,0980nm Laser diodeSupplier A 377,61377,6980nm Laser diodeSupplier A 129,61129,61480nm Laser diodeSupplier A 70,4170,41480nm Laser diodeSupplier A 70,4170,4Photo diodeSupplier B12896,0Co

31、upler (#)Supplier A2918,0980nm/1550nm WDM coupler(#)Supplier A236,0Isolator(#)Supplier C8,2649,2Hybrid moduleSupplier D633189,0WDMSupplier A 12,3224,6Optical switchSupplier E30130,0Gain equalizing filterSupplier A 12,3336,9EDFSupplier F166,0total fit rate1423,7Information and Communication Networks6

32、,000,008,00Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier (2)Overall FIT rate: 3457.73236992183627260212015011501222460530012022401,576114752150482965784564552252034,0total fit rateelectrical components (40C)quantitySub fit ratefit rateFET SILICON LINEARCAPACI

33、TOR DISCRETE FIXED CERAMICDIODE SILICON GENERAL PLASTIC 1ACONNECTOR Multi 6PinCONNECTOR Multi 40PinINTEGRATED CIRCUITS DIGITAL 21-50TRRESISTOR FIXED FILM =1MEGRESISTOR VARIABLE FILM =200KRESISTOR FIXED WIRE ACCURA =1MEGINTEGRATED CIRCUITS ANALOG 1-32TRCONNECTOR Multi 100PinTRANSISTOR SILICON NPN PLA

34、STIC =0.6WFET SILICON SWITCHInformation and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components: EDFA VOA GTC PassivesNegotiations with suppliers: Modelling Field experience Supplier comparisonElectrical Components: Resistors Capacitors Transistors ICs etc.Standa

35、rds: SN 29500 IEC 61709Mechanical Components: Connectors Boards etc.Standards: SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communication Networks6,000,008,00Reference FIT Rate for electrical and mechanical componentsSN 29500 developed by ZT SR Corporate Function St

36、andardization and Regulation,Cross-functional expert team SN 29500, Committee QualityUsed by all Siemens divisionsUpdated by expert team with data from: field experience, component qualifying teams and component manufacturersHistory and acceptanceDeveloped as companys internal standardFirst edition

37、in 1978Worldwide used by the most Siemens groupsWidely used outside the companyGenerally used calculating the Siemens telecommunications systemsApproved worldwide by the customersFully in accordance with EN/IEC 61709 actually parts Part1:GeneralPart2:integrated circuitsPart3:discrete semiconductorsP

38、art4:passive componentsPart5:electrical connectionsPart6:connectors and socketsPart7:relaysPart9:switchesPart10:signal and pilote lampsPart11:contactorsPart12:optical semiconductors, signal receiversPart13:light-emitting and infrared diodesPart14:optocouplerInformation and Communication Networks6,00

39、0,008,00FIT Rates of Individual Electrical ComponentsExamble: OLI Mainboard (FR total summary)Total Results:FR meanMTBF mean MTBF meanfithoursyearstotal3.563280.69832,0Tu: 40C mean component ambient temperatureZf: Continuous operation 8760 h per year1 fit equals one failure per 109 component hoursFa

40、ilure rates for positions of the Quality-list:JunctionSN29500Mean Junction FR singleFR totalQuant.Component TypeComplexityTemp. refStress refFR refTScurcuitTemp.or Pin countCfit1 = refstressCfitfit6IC logic1/10g45T=140,851413,40720,46IC analog1/30t55T=1;Vuv=0,730,77148,62,32213,96IC Telecom100/1Kg55

41、200,67Tei=54513,480,41EEPROM16Kb55T=1300,55Tei=54516,63816,61EPLD5Kg80600,29Tei=105017,68117,7278Resistor Metal film55T=10,2550,255,62NTC Termistor40T=134036,0214Capacitor Ceramic X7R40T=1;Vuv=0,520,45Vue=.3400,899192,48HF Inductor55555540,010Inductor for EMC601,5601,515,012Universal Diode55155112,0

42、10Universal Transistor55T=1;Vuv=0,5555550,05PNP Transistor Array2 v55T=1;Vuv=0,5150,820,99Tei=10,Ub=155012,21161,15N-Channel MOSFET55T=1;Vuv=0,552,780,99 Nmw=1000,Ub=58013,81269,11LED45Viv=0,5214522,05Dual Optocoupler2 v55T=1150,76Tei=105022,813114,1|2Connector multible cont. Pin72 v400,05403,67,23C

43、onnector single cont. pin50 v400,5Vfi=40402060,02 Connector high electr. loaded1 v4014012,06426 *)Soldering point machine400,03400,03192,8*) all the pin of quantity of components pin count are addedSum3.563Vuv = Voltage ratio ref. ; Vue = Voltage ratio act. ; Ubv = Supply Voltage ref. Ub = Supply Vo

44、ltage ; Viv = Current ratio; Tei = self heating Junction; Nmw = Power consumption; Vfi = Used Elements of deviceComponentReferences from SN29500 / IEC 61709Typical stress per component dataor circuit dependantResultsInformation and Communication Networks6,000,008,00Reliability of Basic Booster (OLIS

45、TBNC):Contribution of Component GroupQuantityComponent GroupPercent.17Optoelectronics43%41Other Components11%550Capacitors8%64IC analogue6%7IC Memories5%45Connectors Sockets4%6IC ASIC4%26Transistors4%1087Resistors3%0Electr. Connections3%2Micro-Processors and -Controllers2%4IC Telecom2%15IC Standard1

46、%68Diodes1%6Semiconductors Power1%1938Sum100%Information and Communication Networks6,000,008,00Reliability of Standard Booster (OLITBNC):Contribution of Component GroupQuantityComponent GroupPercent.34Optoelectronics52%46Other Components9%828Capacitors7%104IC analogue6%63Transistors5%1791Resistors3%

47、7IC Memories3%0Electrical Connections3%67Connectors Sockets3%6IC ASIC3%8IC Telecom2%126Diodes2%2Micro-Processors and -Controllers1%19IC Standard1%9Semiconductors Power1%3110Sum100%Information and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components: EDFA VOA GTC P

48、assivesNegotiations with suppliers: Modelling Field experience Supplier comparisonElectrical Components: Resistors Capacitors Transistors ICs etc.Standards: SN 29500 IEC 61709Mechanical Components: Connectors Boards etc.Standards: SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInform

49、ation and Communication Networks6,000,008,00FIT Rates of Individual Mechanical ComponentsExamble: OLI Mainboard (FR total summary)Total Results:FR meanMTBF mean MTBF meanfithoursyearstotal3.563280.69832,0Tu: 40C mean component ambient temperatureZf: Continuous operation 8760 h per year1 fit equals o

50、ne failure per 109 component hoursFailure rates for positions of the Quality-list:JunctionSN29500Mean Junction FR singleFR totalQuant.Component TypeComplexityTemp. refStress refFR refTScurcuitTemp.or Pin countCfit1 = refstressCfitfit6IC logic1/10g45T=140,851413,40720,46IC analog1/30t55T=1;Vuv=0,730,

51、77148,62,32213,96IC Telecom100/1Kg55200,67Tei=54513,480,41EEPROM16Kb55T=1300,55Tei=54516,63816,61EPLD5Kg80600,29Tei=105017,68117,7278Resistor Metal film55T=10,2550,255,62NTC Termistor40T=134036,0214Capacitor Ceramic X7R40T=1;Vuv=0,520,45Vue=.3400,899192,48HF Inductor55555540,010Inductor for EMC601,5

52、601,515,012Universal Diode55155112,010Universal Transistor55T=1;Vuv=0,5555550,05PNP Transistor Array2 v55T=1;Vuv=0,5150,820,99Tei=10,Ub=155012,21161,15N-Channel MOSFET55T=1;Vuv=0,552,780,99 Nmw=1000,Ub=58013,81269,11LED45Viv=0,5214522,05Dual Optocoupler2 v55T=1150,76Tei=105022,813114,1|2Connector multible cont. Pin72 v400,05403,67,23Connector single cont. pin50 v400,5Vfi=40402060,02 Connector high electr. loaded1 v4014012,06426 *)Soldering point machine400,03400,03192,8*)