SMT中英文专业术语教程学习教案

1、会计学1SMT中英文专业术语教程中英文专业术语教程(jiochng)第一页，共35页。1.印刷工艺(gngy)专业英语2.贴片工艺(gngy)专业英语3.回流工艺(gngy)专业英语针对新入职或有一定基础(jch)的职员2小时(xiosh)罗卫龙使大家对SMT专业英语有所了解，能够看懂一些专业素材培训目的培训目的培训对象培训对象培训讲师培训讲师学习重点学习重点培训课时培训课时第1页/共35页第二页，共35页。Printing Process English/印刷(ynshu)工艺英语第2页/共35页第三页，共35页。测试测试(csh)OK后后转转DIP插件插件印刷印刷(ynshu)（Print

2、ing）：）：目的：借助于钢网把目的：借助于钢网把锡膏印刷锡膏印刷(ynshu)在在PCB之焊盘（之焊盘（PAD）上）上 贴片（贴片（Mount）：）：目的：将贴片元件目的：将贴片元件(yunjin)准确的贴准确的贴装到装到PCB焊盘上焊盘上回流焊（回流焊（Reflow）：）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序SMT：Surface Mount Technology/表面贴装技术第3页/共35页第四页，共35页。Board

3、 loader/上板机：上板机： PCBs to be transported to the screen printer using conveyorsPrinter/印刷机：印刷机： deposits solder paste onto pads on the circuit board第4页/共35页第五页，共35页。PCBPCB（Printed circuit boardPrinted circuit board）/ /印制印制(yn zh)(yn zh)线路板线路板Solder pasteSolder paste/锡膏： Mixture of solder powders and f

4、lux deposited onto pads of circuit board on a controlled volume. After reflow provides electrical, mechanical and thermal connection between component and board第5页/共35页第六页，共35页。Squeegee/Squeegee/刮刀刮刀(u do): Critical tool used (u do): Critical tool used toto “push” paste through the designated openin

5、gs“push” paste through the designated openingsStencilStencil/钢网：Vehicle by which the volume and placement location of solder paste deposition is controlledFoil/钢片Frame/外框Flex Mask/绷网Aperture/开孔第6页/共35页第七页，共35页。Input Conveyor/输入(shr)导轨Solvent tank/容剂曹Monitor/监控器Output Conveyor/输出(shch)导轨Light tower/指

6、示灯Emergency stop buttons/紧急制动开关第7页/共35页第八页，共35页。Vision system/视觉(shju)系统Clamps/夹子(ji zi)Board support/支撑(zh chng)块Or support Pins/支撑(zh chng)顶针stencil/钢网Squeegee/刮刀第8页/共35页第九页，共35页。Angle of Attack (45Angle of Attack (45 or 60 or 60 with stencil)/ with stencil)/角度角度：The angle made by the front of squ

7、eegee blade in relation The angle made by the front of squeegee blade in relation toto the stencil the stencilSnap-Off (Contact or Non-Contact)/Snap-Off (Contact or Non-Contact)/印刷间隙印刷间隙：The distance from the top surface of the PCB The distance from the top surface of the PCB toto the the bottom sur

8、face of the stencilbottom surface of the stencilSqueegee Pressure/Squeegee Pressure/刮刀刮刀(u do)(u do)压力压力：Controls the shear stressControls the shear stress，The total force with which the The total force with which the squeegee is pushing onto the boardsqueegee is pushing onto the boardSqueegee Speed

9、/Squeegee Speed/刮刀刮刀(u do)(u do)速度速度：Controls the shear rateControls the shear rate，The velocity at which the The velocity at which the squeegee traverses across the stencilsqueegee traverses across the stencilSeparation Speed/Separation Speed/分离速度分离速度：The velocity at which the PCB release from the

10、stencilThe velocity at which the PCB release from the stencil第9页/共35页第十页，共35页。Separation Distance/分离距离分离距离:The distance when the PCB release from the stencil which keep the separation speedStencil Alignment/钢网对位钢网对位:Vision Based:Fully automatic with fiducials or Semi-automatic ManualCleaning Frequen

11、cy/清洗清洗(qngx)频率频率Cleaning mode/清洗清洗(qngx)模式模式:Dry/wet/vacuum第10页/共35页第十一页，共35页。Misalignment/偏位Bridge or Short/短路(dunl)Icicle/拉尖Scooping第11页/共35页第十二页，共35页。Incomplete print/少锡Excessive print/多锡Paste residue/锡膏脏污(zn w)Slump/坍塌(tnt)第12页/共35页第十三页，共35页。Component placement process english/元件贴装工艺(gngy)英语第13

12、页/共35页第十四页，共35页。测试测试(csh)OK后后转转DIP插件插件印刷印刷(ynshu)（Printing）：）：目的：借助于钢网把锡膏目的：借助于钢网把锡膏印刷印刷(ynshu)在在PCB之焊之焊盘（盘（PAD）上）上 贴片（贴片（Mount）：）：目的目的(md)：将贴片元：将贴片元件准确的贴装到件准确的贴装到PCB焊焊盘上盘上回流焊（回流焊（Reflow）：）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序第14页/共

13、35页第十五页，共35页。Generic SMD Placement Machine/Generic SMD Placement Machine/常用常用(chn yn)(chn yn)表面贴装设备表面贴装设备BoardBoardAlignmentAlignment板对位板对位Robot/Robot/机械臂机械臂ComponentComponentFeeding/Feeding/供料器供料器 ComponentAlignment/器件(qjin)对位Frame/Frame/外框外框PlacementPlacementHead/Head/贴装头贴装头PCB Transport/PCBPCB Tr

14、ansport/PCB传输传输第15页/共35页第十六页，共35页。User interface/用户界面(yn h ji min)Placement robotComponent feeding/供料器(lioq)料车feeder/飞达Toolbit or nozzle吸嘴第16页/共35页第十七页，共35页。第17页/共35页第十八页，共35页。第18页/共35页第十九页，共35页。第19页/共35页第二十页，共35页。The other professional english used in placement process贴装工艺贴装工艺(gngy)其他专业英语其他专业英语Load

15、ing list/站位表Offset/偏差Pick/吸取(xq)Place/贴装Placement Accuracy/贴装精度Linear Motor/线性马达Ball Screw/丝杆Image/影像第20页/共35页第二十一页，共35页。Reflow process english/回流工艺(gngy)英语第21页/共35页第二十二页，共35页。测试测试(csh)OK后后转转DIP插件插件印刷印刷(ynshu)（Printing）：）：目的：借助于钢网把目的：借助于钢网把锡膏印刷锡膏印刷(ynshu)在在PCB之焊盘（之焊盘（PAD）上）上 贴片（贴片（Mount）：）：目的：将贴片元件目

16、的：将贴片元件(yunjin)准确的贴准确的贴装到装到PCB焊盘上焊盘上回流焊（回流焊（Reflow）：）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序第22页/共35页第二十三页，共35页。Soldering/焊接焊接(hnji)1.Process of joining metallic surfaces(金属表面连接) through the mass heating(加热(ji r) of solder or solder p

17、aste2.Creates a mechanical(机械的) and electrical(电的) connection between the components and PCB3.Solder alloy metal(焊料合金) is melted(熔化) to form the connection4.Liquid solder attaches to the base metals by forming intermetallic compounds(IMC:内部合金), through the process of wetting(润湿)第23页/共35页第二十四页，共35页。S

18、urface Tension/表面张力表面张力: Surface tension is a molecular force(分子作用分子作用(zuyng)力力) existing in the surface film of all liquidsWetting/润湿润湿: The ability of the molten solder alloy (熔融焊锡合金熔融焊锡合金) to adhere to the surfaces being solderedCapillary Action/毛细作用毛细作用(zuyng)：Interaction between a liquid (solde

19、r or flux) and a small opening or surface in a solid ( Pad, component Lead )Wetting Angle/润湿角润湿角IMC（Intermetallic compounds）/内部合金层内部合金层：When the molten solder alloy makes contact with the PCB finish or component lead finish, a small amount of Sn in the solder combines with the finish metal or the ba

20、se copper to form a metallurgical compound第24页/共35页第二十五页，共35页。Typical Convection Reflow Oven/典型典型(dinxng)的热风回流炉的热风回流炉(a)PCBAConveyor/链条链条Heating Blowers/热风器热风器CoolingFan/冷却风冷却风扇扇Reflow oven/回流炉回流炉Lower/下温区Upper/上温区第25页/共35页第二十六页，共35页。Typical reflow profile/典型回流典型回流(hu li)曲线曲线The reflow of solder is achieved in a furnace with predetermined thermal profiles. The different stages are: 炉子里的回流(hu li)焊接用预先设定的温度曲线来达到.温度曲线的阶段分为:1.