SMD专业术语中英文对照电子类知识宝典

1、SMD专业术语中英文对照电子类知识宝典Revised by BLUE on the afternoon of December 12,2020.SMD 常用术语微组装技术：MPT/MicroelectronicPackagingechnology混装技术：MixedComponentMountingTechnology封装：Package贴片：PickandPlace拆焊:Desoldering再流：Reflow浸焊:DipSoldering拖焊：Dragsoldering印制电路：PrintedCircuitE 卩制线路:PrintedWiring印制电路板:printedcircuitbo

2、ard卬制线路板：printedwiringboard层压板：laminate覆铜薄层压板：copper-cladlaminate基材.:basematerial成品 板：product ionboard印刷:printing导电图形：conductivepattern印制组件:printedcomponent 单而印制板：single-sidedprintedboard双而印制板：double-sidedprintedboard 多层印制板：multilayerprintedboard 电烙铁：Iron热风嘴：hotairreflowingnoozle吸锡带：solderingwick 吸锡

3、器：tinextractor 焊后检验:post-solderinginspection 目焊料爬越:solderwicking视检验:visual inspection 机器检验:machine inspect ion 焊点质量：soldering jointquality 焊电缺陷：solderingjontdefect 错焊：solderwrong 漏焊:solderskips 虚焊：pseudosoldering 冷焊:coldsoldering 桥焊：solderbridge 脱焊：opensoldering 焊点剥离：solderoff 不润湿焊点：solderingnonwett

4、ing 锡珠:solderball拉尖 :icicle； solderprojection 孔洞:void过热焊点：overheatedsolderconnection不饱和焊点：insufficientsolderconnection过量焊点：excesssolderconnection微组装技术：NIPT/MicroelectronicPackagingechnology混装技术：MixedComponentMountingTechnology封装：Package贴片：PickandPlace拆焊:Desoldering再流：Reflow浸焊:DipSoldering拖焊：Dragsold

5、ering卬制电路：PrintedCircuit印制线路：PrintedWiringE 卩制电路板:printedcircuitboard卬制线路板：printedwiringboard层压板：laminate覆铜薄层压板：copper-cladlaminate基材： basematerial成品板：productionboard卬刷:printing导电图形：conductivepattern卬制组件：printedcomponent 单而印制板：single-sidedprintedboard焊料爬越:solderwicking双而印制板：double-sidedprintedboard

6、多层印制板：multilayerprintedboard 电烙铁：Iron热风嘴：hotairreflowingnoozle吸锡带：solderingwick 吸锡器：tinextractor 焊后检验:post-solderinginspection 目视检验:visual inspection 机器检验:machine inspect ion 焊点质量：soldering jointquality 焊电缺陷：solderingjontdefect 错焊：solderwrong 漏焊:solderskips 虚焊：pseudosoldering 冷焊:coldsoldering 桥焊：sol

7、derbridge 脱焊：opensoldering 焊点剥离：solderoff 不润湿焊点：solderingnonwetting 锡珠:solderball拉尖 :icicle； solderprojection 孔洞:void过热焊点：overheatedsolderconnection不饱和焊点：insuf fici ent sol der c onne c t i on过量焊点：excesssolderconnection助焊剂剩余：fluxresidue焊料裂纹：soldercrazeing焊角翘起:fillet-lifting： lift-offAl:Auto-Insertio

8、n 自动插件AQL: acceptablequalitylevel 允收水平ATE: automatictestequipment 自动测试ATM:atmosphere 气压BG;: ba 11 gridarray 球形矩阵CCD:chargecoupleddevice 监视连接组件（摄彫机）CLCC:Ceramicleadlesschipcarrier 陶瓷引脚载具COB: chip-on-board 芯片直接贴附在电路板上cps: centipoises （黏度单位）百分之一CSB:chipscaleballgridarray 芯片尺寸 BGACSP:chipscalepackage 芯片

9、尺寸构装CTE: coef f ic i ent of thermal expans i on 热膨胀系数DIP: dualin-1 inepackage 双内线包装（泛指乎插组件）FPT: f inepitchtechnology 微间距技术FR-4: flame-retardantsubstrate 玻璃纤维胶片（用来制作 PCB 材质）IC： integratecircuit 集成电路IR: infra-red 红外线Kpa: kilopascals （压力单位）LCC: leadlesschipcarrier 引脚式芯片承载器MCH:multi-chipmodule 多层芯片模块MEL

10、F:metalelectrodeface 二极管MQFP:metalizedQFP 金属四方扁平封装NEPC0N:NationalElectronicPackageandProductionConference 国际电子包装及生产会议ppm:partspermiIlion 指每百万 PAD（点）有多少个不良 PAD（点）psi :pounds/inch2 磅/英寸 2PWB:printedwiringboard 电路板QFP: quadflatpackage 四边平坦封装SIP:singlein-linepackageSIR:surfaceinsulationresistance 绝缘阻抗SM

11、C:SurfaceMountComponent 表而黏着组件SMD: SurfaceMountDevice 表而黏着组件SMEMA:SurfaceMountEquipmentManufacturersAssociation 表而黏着设备制适协会SMT: surfacemounttechnology 表而黏着技术SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP: smallout-1 inepackage 小外型封装SOT:smalloutlinetransistor 晶体管SPC:statisticalp

12、rocesscontrol 统汁过程控制SSOP:shrinksmalloutlinepackage 收缩型小外形封装TAB: tapeautomaticedbonding 带状自动结合TCE: thermalcoefficientofexpansion 膨胀(因热)系数Tg:glasstransitiontemperature 玻璃转换温度THD:Throughholedevice 须穿过洞 Z 组件(贯穿孔)TQFP: tapequadflatpackage 带状四方平坦封装UVT:ultraviolet 紫外线uBGAmicroBGA 微小球型矩阵cBGA:ceramicBGA 陶瓷球型

13、矩阵PTHlatedThruHole 导通孔IAInformat ionAppliance 信息家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (LandGri dArry)封装技术 LGA 封装不需植球，适合轻薄短小产品 应用。TCP (TapeCarrierPackage)ACFAnisotropicConductiveF 订 m 异方性导电胶膜制程Soldermask 防焊漆Solderinglron 烙铁Solderballs 锡球SolderSplash 锡渣SolderSkips 漏焊Throughhole 贯穿孔Touchup 补焊Briding 穡接（短路）So

14、lderWires 焊锡线SolderBars 锡棒GreenStrength 未固化强度（红胶）TransterPressure 转印压力（E 卩刷）ScreenPrinting 刮刀式印刷SolderPowder 锡颗粒Wettengability 润湿能力Viscosity 黏度Solderability 焊锡性Applicability 使用性Flipchip 覆晶DepanelingMachine 组装电路板切割机So 1 derRecover ySy s t em 锡料回收再使用系统WireWelder 主机板补线机X-RayMulti-layerlnspectionSystemX-Ray 孔偏检査机BGxAOpen/ShortX-RaylnspectionMachineBGAX-Ray 检测机PrepregCopperFoilSheeterP. P.铜箔裁切机FlexCircuitConnections 软性排线焊接机LCDReworkStat ion 液晶就示器修护机 BatteryElectroWelder 电池电极焊接机PCMCIACardWelderPCMCIA 卡连接器焊接 LaserDiode 半导体雷射IonLasers 离子雷射Nd:YAGLaser 石溜石