最新PCBA外观检验标准

1、PCBA外观 检验标准11 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度 (組件X方向) SMD Assembly workmanship criteria-Chip component alignment( X Axis) 1. 晶片狀零件恰能座落在焊 墊的中央且未發生偏出， 所有各金屬封頭都能完全 與焊墊接觸。 1.Component is centered on both sides of the land . All the solder terminations shall comp

2、letely touch pad. 1.零件橫向超出焊墊以外，但 尚未大於其零件寬度的50% 。(X1/2W) 1.The component shifted off the pad and shift length shall less 1/2 chip width 1.零件已橫向超出焊墊，大 於零件寬度的50%(MI)。 (X1/2W) 1.The component shifted off the pad and shift length over 1/2 chip with 允收狀況(Accept Condition) X1/2W X1/2W 330 X1/2W X1/2W 註:此標準

3、適用於三面或五面 之晶片狀零件 This standard only be used for 3 or 5 face terminations chip component ww 330 330 PCBA外观 检验标准12 理想狀況(Target Condition) 拒收狀況(Reject Condition) 1.晶片狀零件恰能座落在焊墊 的中央且未發生偏出，所有 各金屬封頭都能完全與焊墊 接觸。 1.Component is centered on both sides of the land . All the solder terminations shall completely

4、touch pad. 1.零件縱向偏移，但焊墊尚保 有其零件寬度的25%以上。 (Y1 1/4W) 2.零件縱向偏移，但零件端電 極仍蓋住焊墊為其零件寬度 的25%以上。 (Y2 1/4W) Component is shifted towards longest part of the chip , but the termiuad end of chip still on the land 1.The Pad length not be cover by chip (Y1) shall over 1/4 chip width (W) 2.1/4 width of the land for

5、solder fillet to form. 1.零件縱向偏移，但焊墊未 保有其零件寬度的25%(MI) 。(Y11/4W) 2.零件縱向偏移，但零件端 電極蓋住焊墊小於其零件 寬度的25%。 (Y21/4W) 3.Whichever is rejected . 允收狀況(Accept Condition) W W 330 330 Y2 1/4W 330 Y1 1/4W Y2 1/4W Y1 1/4W SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度 (組件Y方向) SMD Assembly workmanship criteria-Chip component alignment( Y

6、 Axis) PCBA外观 检验标准13 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度 SMD Assembly workmanship criteria-Cylinder component alignment 1.組件的接觸點在焊墊中心 1.The point of contact is centered on the lands 1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以下。 (X 1/3D) 2.零件縱向偏移，但金屬封頭仍 在焊墊上。 (Y10 mil),(Y20

7、 mil) 1.The length of component shifted off the pad(X) shall less the 1/3 Diameter of component 2.Shifted toward the longest part of the component , the solder terminations still on the land 1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以上 (MI)。(X1/3D) 2.零件縱向偏移，但金屬封頭未 在焊墊上。 (Y10 mil),(Y20 mil) 3.Whichever is rejected

8、. 允收狀況(Accept Condition) X1/3D1/3D X1/3D1/3D Y20mil Y10 0mil X1/3D1/3D X1/3D1/3D Y20 0 mil Y10 0 mil 註：為明瞭起見,焊點上的錫已 省去。 Note:In order to clarify the figure , the solder joint be eliminated D PCBA外观 检验标准14 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度 SMD Assembly wo

9、rkmanship criteria-Gull-Wing footprint alignment 1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。 1.All the leads footprint is centered on the lands 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)。(S5mil) 1.The length of the lead footprint shifted off the land(X)shall less 1/2 width of

10、 lead 2.The clearance(S)between lead shifted off and land shall over 5 mil 允收狀況(Accept Condition) W S XX1/2W S S5mil5mil X1/2W S S5mil5mil 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超 過接腳本身寬度的1/2W (MI)。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)(MI)。(S5mil) 3.Whichever is rejected . PCBA外观 检验标准15 理想狀況(Target Condition)

11、 拒收狀況(Reject Condition) SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度 SMD Assembly workmanship criteria-Gull-Wing toe alingnment 1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。 1.All the leads footprint is centered on the lands 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過焊墊側端外緣。 1.The lead had shifted and footprint not over the end of land 1.各接腳側端

12、外緣，已 超過焊墊側端外緣(MI)。 1.The lead had shifted and footprint had over the end of land(MI) 允收狀況(Accept Condition) W W 已超過焊墊側端外緣已超過焊墊側端外緣 PCBA外观 检验标准16 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度 SMD Assembly workmanship criteria-Gull-Wing heel alingnment 1.各接腳都能座落在各焊 墊的

13、中央，而未發生偏 滑。 1.All the leads footprint is centered on the lands 1.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，最少保 有一個接腳厚度(XT)。 1.The lead had shifted the length from lead heel to end of land (X) shall be over the thickness of land (T) 1.各接腳己發生偏滑，腳跟剩 餘焊墊的寬度，已小於接腳 厚度(XT)(MI)。 允收狀況(Accept Condition) T X X T X TT T XT PCBA外观 检验

14、标准17 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量 SMD solder joint workmanship criteria-Minimum solder of Gull Wing footprint 1.引線腳的側面,腳跟吃錫良好 2.引線腳與板子焊墊間呈現凹面 焊錫帶。 3.引線腳的輪廓清楚可見。 1.side face and footprint have good solder fillet 2.concave fillet between land and lea

15、d 3.the shape(pro lead be clearly visible 1.引線腳的底邊與板子焊墊間的 銲錫帶至少涵蓋引線腳長的 2/3L以上。 2.腳跟(Heel)焊錫帶涵蓋高度h 大於零件腳1/2厚度。 (h1/2T) 。 3.腳跟(Heel)沾錫角需90度。 1.Width of solder fillet between lead and land(X) shall over 2/3 lead footprint(L) 2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel 3

16、.Wetting angle 90on heel 1.引線腳的底邊與板子焊墊間的 銲錫帶不足涵蓋引線腳長的 2/3L。 2.腳跟(Heel)焊錫帶涵蓋高 度 h小於零件腳1/2厚度。 (h=2/3L L X2/3L h1/2T T h1/2T T PCBA外观 检验标准18 理想狀況(Target Condition) SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量 SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprint 1.引線腳的側面,腳跟吃錫良好。 2.引線腳與板子焊墊間呈現凹

17、面 焊錫帶。 3.引線腳的輪廓清楚可見。 1.side face and footprint have good solder fillet 2.concave fillet between land and lead 3.the shape(pro lead be clearly visible 1.引線腳與板子焊墊間的焊錫連 接很好且呈一凹面焊錫帶。 2.引線腳的側端與焊墊間呈現稍 凸的焊錫帶。 3.引線腳的輪廓可見。 1.Good solder flow up and concave fillet between land and lead 2.Concave solder fillet

18、 between side face of lead and land 3.The shape (profile) of lead (footprint) be clearly visible 1.焊錫帶延伸過引線腳的 頂部(MI)。 2.引線腳的輪廓模糊不清(MI)。 3.Whichever is rejected . 1.solder flow cover the end (TIP) of lead 2.The shape (profile) of lead not be visible clearly 3.Whichever is rejected 拒收狀況(Reject Conditi

19、on) 允收狀況(Accept Condition) PCBA外观 检验标准19 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量 SMD solder joint workmanship criteria-Minimum solder of Gull Wing Heel 1.腳跟的焊錫帶延伸到引線上彎 曲處底部(B)與下彎曲處頂部 (C)間的中心點。 註： ：引線上彎頂部 ：引線上彎底部 ：引線下彎頂部 ：引線下彎底部 1.Solder flow up to the center bet

20、ween B,C point on the heel of lead 1.腳跟的焊錫帶已延伸到引線 上彎曲處的底部(B)。 1.solder flow up to B point on the heel 1.腳跟的焊錫帶延伸到引線上 彎曲處的底部(B)，延伸過 高，且沾錫角超過90度，才 拒收(MI)。 1.Solder flow up over(cross) B point and the wetting angle over 90 degree 允收狀況(Accept Condition) 沾錫角超過沾錫角超過90度度 A BD C PCBA外观 检验标准110 理想狀況(Target C

21、ondition) 拒收狀況(Reject Condition) SMT焊點性工藝標準-J型接腳零件之焊點最小量 SMD solder joint workmanship criteria-Minimum solder of J type lead 1.凹面焊錫帶存在於引線的四側 2.焊錫帶延伸到引線彎曲處兩側 的頂部(A,B)。 3.引線的輪廓清楚可見。 4.所有的錫點表面皆吃錫良好。 1.Solder concave fillet on the 4 face of lead 2.solder flow up to the angle high point A,B 3.Lead shape(

22、pro be clearly visible 4.Good soldering joint at every solder contact 1.焊錫帶存在於引線的三側 2.焊錫帶涵蓋引線彎曲處兩 側的50%以上(h1/2T)。 1.Solder concave fillet on the 3 face of lead 2.Height of solder flow-up on the lead angle(h) shall over 1/2 angle height(T) 1.焊錫帶存在於引線的三側以 下(MI)。 2.焊錫帶涵蓋引線彎曲處兩側 的50%以下(h1/2T)(MI)。 3.Whi

23、chever is rejected . 1.Solder concave fillet is less 3 face 2.Height of solder flow-up on the lead angle(h) under 1/2 angle height(T) 3.Whichever is rejected 允收狀況(Accept Condition) h1/2T A T B h 1/2T PCBA外观 检验标准111 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT零件組裝工藝標準- J型腳零件對準度 SMD Assembly work

24、manship criteria-J type lead alignment 1.各接腳都能座落在焊墊的中 央，未發生偏滑。 1.All the leads footprint is centered on the lands 允收狀況(Accept Condition) S W S5mil5mil X1/2W S1/2W 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超 過接腳本身寬度的1/2W (MI)。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)以下(MI)。 (S5mil) 3.Whichever is rejected . 1.各接腳已發生偏

25、滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W ) 2.偏移接腳之邊緣與焊墊外 緣之垂直距離5mil (0.13mm)以上。(S5mil) The lead had shifted off the land 1.The length of lead shifted off the land (X) shall less 1/2 width of lead (W) 2.The clearance distance between shifted lead and land edge shall over 5 mil PCBA外观 检验标准112 理想狀況(Targe

26、t Condition) 拒收狀況(Reject Condition) SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點 SMD solder joint workmanship criteria-Maximum solder of J type lead 1.凹面焊錫帶存在於引線的四側 2.焊錫帶延伸到引線彎曲處 兩側的頂部(A,B)。 3.引線的輪廓清楚可見。 4.所有的錫點表面皆吃錫良好。 1.Solder concave fillet on the 4 face of lead 2.solder flow up to the angle high point A,B 3.Lea

27、d shape(pro be clearly visible 4.Good soldering joint at every solder contact 1.凹面焊錫帶延伸到引線彎 曲處的上方,但在組件本 體的下方。 2.引線頂部的輪廓清楚可見。 1.Solder flow up to top of lead angle and not touch the body 2.Shape(pro lead angle can be visible clearly 1.焊錫帶接觸到組件本體(MI)。 2.引線頂部的輪廓不清楚(MI)。 3.錫突出焊墊邊(MI)。 4.Whichever is rej

28、ected . 1.Solder had touched the body 2.Shape (profile) of lead angle can not be visible clearly 3.Excess solder on the side of solder land 允收狀況(Accept Condition) A B PCBA外观 检验标准113 理想狀況(Target Condition) 拒收狀況(Reject Condition) SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點) SMD solder joint workmanship criter

29、ia-Minimum solder fillet of chip component( 3 or 5 face terminations) 1.焊錫帶延伸到晶片端電極 高度的25%以上。 (h1/4T) 2.焊錫帶從晶片外端向外延 伸到焊墊的距離為晶片高 度的25%以上。(X1/4H) 1.1/4 component height be fillet by solder at least 2.Solder flow spread on the land shall 1/4 width of component height at least , (Count from tip of compo

30、nent) 1.焊錫帶延伸到晶片端電極 高度的25%以下(MI)。 (h1/4T) 2.焊錫帶從晶片外端向外延 伸到焊墊端的距離為晶片 高度的25%以下(MI)。 (X1/4T) 3.Whichever is rejected . 允收狀況(Accept Condition) T h1/4 T X1/4 T h1/4 T X10mil。(D,L10mil)(MI) 且 10mil 不易被剝除者不易被剝除者L 10mil 不易被剝除者不易被剝除者L 10mil PCBA外观 检验标准116 理想狀況(Target Condition) 拒收狀況(Reject Condition) 允收狀況(Ac

31、cept Condition) X0X0 X0 Y YTT YT X 1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。 1.The footprint of every lead be centered on the land 1.各接腳已發生偏滑，引線 腳的側面仍保留在焊墊 上(X0), 2.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，最少保 有一個接腳厚度(YT)。 Footprint had shifted 1.Side face still on the land (X0) 2.The space from end of land to heel shall over the thic

32、kness of lead 1.各接腳己發生偏滑，引線腳 的側面已超出焊墊(X0)。 2.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，小於一個 接腳厚度(YLmax判定拒收 (MI) 。 5.Whichever is rejected . 1.Protrusion lead can not be visible 2.Protrusion lead out of spec (include Lmin or Lmax) 3.Lead bend / missing / no-through 4.Special spec of protrusion lead out of spec (Lmax) 5.Wh

33、ichever is rejected PCBA外观 检验标准120 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-臥式電子零組件(R,C,L)浮件與傾斜(1) DIP component Assembly workmanship criteria-Tilt & floating of horizontal electronic component ( R , C , L ) 1.零件平貼於機板表面。 2.浮高判定量測應以PCB零件面 與零件基座之最低點為量測依 據。 1.Component is perpendicular

34、 and base is parallel to board surface 2.The floating height is measured from face of PCB substrate to the lowest point of component 允收狀況(Accept Condition) + 1.量測零件基座與PCB零件面之 最大距離須2.0mm。 (Lh2.0mm) 2.零件腳未折腳與短路。 3.臥式COIL之Lh2mm . Wh2mm)不受第1點之限制 1.The height of the component body above the land “Lh”is 2

35、.0mm maximum 2.No leads be shorted or bended of component 3.Coil floating be specified to 2mm maximum 傾斜傾斜/ /浮高浮高Lh2.0 mm傾斜傾斜Wh2.0 mm 傾斜傾斜/ /浮高浮高Lh2.0 2.0 mm傾斜傾斜Wh2.0 2.0 mm 1.量測零件基座與PCB零件面之 最大距離2.0mm(MI)。 (Lh2.0mm) 2.零件腳折腳、未入孔、缺件 等缺點影響功能(MA)。 3.臥式COIL之Lh或Wh2mm判定 距收(MI) 。 4.Whichever is rejected PCB

36、A外观 检验标准121 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-臥式電子零組件(Wire)浮件與傾斜(2) DIP component Assembly workmanship criteria-Tilt & floating of horizontal electronic component ( Wire ) 1.單獨跳線平貼於機板表面。 2.固定用跳線不得浮高,跳線需 平貼零件。 1.Jumper wire lay flat and touch the board 2.Jumper wire used for f

37、ixing component shall touch the component body 1.單獨跳線Lh,Wh1.0mm。 2.被固定零件浮高1.0mm 。(Y1.0mm) 3.固定用跳線投影於PCB後左右 偏移量零件孔邊緣1.0mm 。(X1.0mm) 4.固定用跳線浮高Z0.8mm (被固定零件平貼於PCB時) 1.The height of jumper wire above the land is 1.0mm Maximum 2.Jumper wire used for fixing component is 0.8mm maximum 3.The shift length of

38、 reflection of jumper wire used for fixing component on the board is 1.0mm maximum measuring from the edge of PTH 4.The height of jumper wire above the component is 0.8mm maximum since component lay flat 允收狀況(Accept Condition) Lh1.0 1.0 mm Wh1.0 1.0 mm X1.0m m 1.單獨跳線Lh,Wh1.0mm(MI)。 2.被固定零件浮高1.0mm(MI

39、) 。(Y1.0mm) 3.固定用跳線投影於PCB後左右 偏移量零件孔邊緣1.0mm (MI)。(X1.0mm) 4.固定用跳線浮高Z0.8mm (被固定零件平貼於PCB時)(MI) 5. Whichever is rejected Lh1.0 1.0 mm Wh1.0 1.0 mm X 1.0mm Y1.0m m Y1.0mm Z0.8m m Z0.8m m Z Z PCBA外观 检验标准122 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)浮件 DIP component Ass

40、embly workmanship criteria-Floating of vertical electronic component ( C , F , L , Buzzer ) 1.零件平貼於機板表面。 2.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。 1.Component is perpendicular and base is parallel to board surface 2.The floating height is measured from face of PCB substrate to the lowest point of compon

41、ent 1.浮高2.0mm。 (Lh2.0mm) 2.錫面可見零件腳出孔。 3.無短路。 1.The height of component above the land (Lh)is 2.0mm maximum 2.Lead protrusion on the solder side can be identified 3.No solder bridge 1.浮高2.0mm(MI)。 (Lh2.0mm) 2.零件腳折腳、未入孔、缺件 等缺點影響功能(MA)。 3.短路(MA)。 4.Whichever is rejected . 允收狀況(Accept Condition) 1000F 6

42、.3F - - - 10 16 + 1000F 6.3F - - - 10 16 + Lh 2.0mm Lh 2.0mm 1000F 6.3F - - - 10 16 + Lh 2.0mm Lh 2.0mm PCBA外观 检验标准123 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)傾斜 DIP component Assembly workmanship criteria-Tilt of verticle electronic component ( C , F , L , Buz

43、zer ) 1.零件平貼於機板表面。 2.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。 1.Component is perpendicular and base is parallel to board surface 2.The floating height is measured from face of PCB substrate to the lowest point of component 1.量測零件基座與PCB零件面之 最大距離2.0mm。 (Wh2.0mm) 2.傾斜不得觸及其他零件或造 成組裝性之干涉。 1.The maximum height

44、 of component above the land is 2.0mm maximum 2.No touch neighboring component or No. interfering with neighbor component assembly 允收狀況(Accept Condition) 1000F 6.3F - - - 10 16 + 1000F 6.3F - - - 10 16 + Wh 2.0mm 1000F 6.3F - - - 10 16 + Wh 2.0mm 1.量測零件基座與PCB零件面之 最大距離2.0mm(MI)。 (Wh2.0mm) 2.傾斜已觸及其他零件

45、或造成 組裝性之干涉(MA)。 4.零件傾斜與相鄰零件之本體 垂直空間干涉(MI)。 5.Whichever is rejected . PCBA外观 检验标准124 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-機構零件(Slot,Socket,DIMM,Heatsink)浮件 DIP component Assembly workmanship criteria-Floating of constructive component ( slot , socket , Dim , Heats sink ) 1.浮高與傾斜之

46、判定量測應以 PCB零件面與零件基座之最低 點為量測依據。 2.機構零件基座平貼PCB零件面 ，無浮高傾斜。(a,b,c,d四點 平貼於PCB）。 1.The floating height is measure from face of PCB substrate to the lowest point of component 2.The base of constructive component shall touch the face of PCB substrate (a,b,c,d point touch PCB) 1.短軸a,b兩點平貼PCB或垂直 上浮,但c,d兩點浮高0.8

47、mm 。(Lh 0.8mm) 2.錫面可見零件腳出孔 3.無短路。 1.The height of component short axis side above the land is 0.8mm maximum 2.Lead protrusion can be identified on solder side 3.No solder bridge 允收狀況(Accept Condition) CARD CARD Lh 0.8mm CARD Lh 0.8mm a b c d 1.短軸a,b兩點平貼PCB或垂直 上浮,但c,d兩點浮高0.8mm (MI)。(Lh 0.8mm) 2.零件腳折腳

48、、未入孔、缺件 等缺點影響功能(MA)。 3.短路(MA)。 4.Whichever is rejected . a b c d a b c d PCBA外观 检验标准125 理想狀況(Target Condition) 拒收狀況(REJECT CONDITION) DIP零件組裝工藝標準-機構零件(Slot,Socket,DIMM,Heatsink)傾斜 DIP component Assembly workmanship criteria-Tilt of constructive component ( slot , socket , Dim , Heat sink ) 1.浮高與傾斜之判

49、定量測應以 PCB零件面與零件基座之最低 點為量測依據。 2.機構零件基座平貼PCB零件面 ，無浮高傾斜現象。(a,b,c,d 四點平貼於PCB) 。 1.The floating height is measure from face of PCB substrate to the lowest point of component 2.The base of constructive component shall touch the face of PCB substrate (a,b,c,d point touch PCB) 1.長軸a,c兩點平貼PCB或垂直 上浮，但b,d兩點傾斜高

50、度 0.5mm。(Wh0.5mm) 2.若a,b,c三點平貼PCB容許d點 浮高/傾斜0.8mm。 (Wh0.8mm) 3.錫面可見零件腳出。 1.The height of component long axis side above the land is 0.5mm maximum 2.If 3 point of 4 corner touch the PCB . The height of the other point above the land is 0.8mm maximum 3.Lead protrusion can be identified on solder side 允

51、收狀況(Accept Condition) CARD Wh 0.5mm CARD Wh 0.5mm CARD a b c d a b c d a b c d 1.長軸a,c兩點平貼PCB或垂直 上浮，但b,d兩點傾斜高度 0.5mm(MI)。(Wh0.5mm) 2.若a,b,c三點平貼PCB但d點 浮高/傾斜0.8mm(MA)。 (Wh0.8mm) 3.零件腳折腳、未入孔、缺件 等缺點影響功能(MA)。 4.Whichever is rejected . PCBA外观 检验标准126 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝

52、標準-機構零件(Jumper Pins,Box Header)浮件 DIP component Assembly workmanship criteria-Floating of constructive component ( Jumper Pins , Box header ) 1.零件平貼於PCB零件面。 2.無傾斜浮件現象。 3.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。 1.Component is perpendicular and base is parallel to board surface 2.The floating height is me

53、asured from face of PCB substrate to the lowest point of component 1.浮高1.0。(Lh1.0mm) 2.錫面可見零件腳出孔且無短 路。 1.The height of component above the land is 0.8mm maximum 2.No solder bridge and lead protrusion can be identified on solder side 允收狀況(Accept Condition) Lh1.01.0mm Lh1.0mm 1.浮高1.0mm(MI)。(Lh1.0mm) 2

54、.零件腳折腳、未入孔、缺件 等缺點影響功能(MA)。 3.短路(MA)。 4.Whichever is rejected . PCBA外观 检验标准127 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)傾斜 DIP component Assembly workmanship criteria-Tilt of constructive component ( Jumper Pins , Box header ) 1.零件平貼 PCB 零件面。 2.無傾斜浮件現象。 3.

55、浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。 1.Component is perpendicular and base is parallel to board surface 2.The floating height is measured from face of PCB substrate to the lowest point of component 1.量測零件基座與PCB零件面之 最大距離1.0mm。 (Wh1.0mm) 2.傾斜不得觸及其他零件或造 成組裝性之干涉。 3.排針頂端最大傾斜不得超過 PCB板邊邊緣。 1.The maximum hei

56、ght (Wh) of component above the land is 1.0mm maximum 2.No touch neighboring components assembly 3.The projection of tilted header on the board is not over the edge of PCB 允收狀況(Accept Condition) Wh1.01.0mm Wh1.0mm 1.量測零件基座與PCB零件面之 最大距離1.0mm(MI)。 ( Wh1.0mm ) 2.傾斜觸及其他零件或造成組 裝性之干涉(MA)。 3.排針頂端最大傾斜不得超過 P

57、CB板邊邊緣(MI)。 4.零件傾斜與相鄰零件之本體 垂直空間干涉(MI)。 5.Whichever is rejected 1000F 6.3F- - - 1000F 6.3F- - - 1000F 6.3F- - - PCBA外观 检验标准128 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-機構零件(CPU Socket)浮件與傾斜 DIP component Assembly workmanship criteria-Tilt and floating of constructive component ( CPU

58、Socket ) 允收狀況(Accept Condition) 浮高浮高 Lh 1.浮高與傾斜之判定量測應以 PCB零件面與零件基座之最低 點為量測依據。 2.CPU Socket平貼於PCB零件面 。 浮高浮高 Lh 浮高浮高 Lh 浮高浮高 Lh 傾斜傾斜Wh0.80.8mm浮件浮件Lh0.80.8mm 浮高浮高 Lh 浮高浮高 Lh 傾斜傾斜Wh0.8mm浮件浮件Lh0.8mm 1.量測零件基座與PCB零件面之 最大距離0.8mm。 ( Lh,Wh0.8mm) 2.錫面可見零件腳出孔。 3.無短路。 1.量測零件基座與PCB零件面之 最大距離0.8mm(MI)。 ( Lh,Wh0.8mm

59、) 2.零件腳折腳、未入孔、缺件 等缺點影響功能(MA)。 3.短路(MA)。 4.Whichever is rejected . PCBA外观 检验标准129 理想狀況(Target Condition) 拒收狀況(Reject Condition) DIP零件組裝工藝標準-機構零件(USB,D-SUB,PS/2,K/B Jack)浮件與傾斜 DIP component Assembly workmanship criteria-Tilt and floating of constructive component ( USB , D-sub , PS/2 , K/B Jack ) 1.US

60、B,D-SUB,PS/2,K/B Jack, Printer Port,COM Port 平貼於PCB零件面。 允收狀況(Accept Condition) 浮高浮高 Lh 0.5mm 傾斜傾斜Wh 0.5mm 浮高浮高 Lh 0.5mm 傾斜傾斜Wh 0.5mm 1.量測零件基座與PCB零件面之 最大距離0.5mm。 ( Lh,Wh0.5mm) 2.錫面可見零件腳出孔。 3.無短路。 1.量測零件基座與PCB零件面之 最大距離0.5mm(MI)。 ( Lh,Wh0.5mm) 2.零件腳折腳、未入孔、缺件 等缺點影響功能(MA)。 3.短路(MA)。 4.Whichever is reject