IPC-A-610F-2014 电子组件的可接受性

SINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEIPC-A-610CNF版-2014年7月

取代E版2010年4月电子组件的可接受性由IPC开发SINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE标准化1995年5月，IPC技术行动执行委员会(TAEC)采用了该“标准化的原则”作为IPC致的原则·表达可制造性设计(DFM)与为环境设计(DFE)的关系·最小化上市时间·使用简单的(简化的)语言·只涉及技术规范特别说明IPC改进，协助买家进行选择并以最短的延迟时间获得满足其特殊需要的适当的产品，以IPC会员或非会员制造或销售不符合这些标准和出版物要求的产品，也不应当排斥那些IPCIPC提供的标准和出版物是推荐性的，不考虑其采用是否涉及有关文献、材料或工艺的专利。IPC准和出版物的团体承担任何义务。使用者对于一切专利侵权的指控承担全部辩护的责IPC关于规范修订使用和执行IPCIPC技术行动执行委员会的立场。当某个IPC出版物升级以及修订版面世时，TAEC的意变更的⽴见是，除非由合同要求，这种新的修订版作为现行版的一部分来使用的关系不是自动场声明1998106为什么要您购买本标准是在为今后的新标准开发和行业标准升级作贡献。标准让制造商、用付费购买户、供应商更好地相互理解。标准会帮助制造商建立满足行业规范的工艺，获得更高本⽂件？效率IPC每年投入数十万美元支持IPC的志愿者在标准和出版物上的开发。草案稿需要多遍

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7-30及7-30CIPC-A-6107-31B技术组、7-31BC亚洲技术组、7-31BD北欧技术组、7-31BDE德语技术组和7-31BI印度技术组的主要成员。然而我们不得不提到IPCTGAsia7-31BC技术组的成员，他们力求译文文字的信达雅，为此标准中文版的翻译、审核付出了大量的时间和艰苦的劳动。我们在此一并对上述各有关组织和个人表示衷心的感谢。产品保证委员会IPC董事会技术联络员主席MelParrishSTIElectronics,Inc.BobevesMicrotek(Changzhou)Laboratories副主席MikeHillGroup,Inc.IPC-A-610技术组(7-31B)IPC-A-610技术组–中国(7-31BC)联合主席ConstantinoJ.GonzalezACME&Consulting主席RenhuaJabilCircuit(Shanghai)Ltd.JenniferDayCGIFederalKathyJohnstonRaytheonMissileSystemsIPC-A-610技术组–德语(7-31BDE)主席RainerElectronicGmbHIPC-A-610技术组–北欧(7-31BND)联合主席AlexChristensenHYTEKClausMolgaardALPHA-elektronikA/SKeldMaaloeeLEGOSystemsA/SIPC-A-610技术组–印度(7-31BI)主席anjundaswamyIPCConsultingPvtLtdIPC-A-610（7-31B）技术组成员JonRobertsScottArrowElectronicsInc.DougRogersMarkShireman,ArmamentSystemsRoweDonaldMcFarland,3iAryeGrushka,A.A.ConsultingandA.G.Ltd.AgnieszkaOzarowski,BAESystemsMarkHoylman,BAESystemsCIJosephKane,BAESystemsPlatformSolutionsAlejandroCruz,ACME&ConsultingConstantinoGonzalez,ACME&ConsultingDebbieAdvancedReworkMarvinBanks,BallAerospace&Corp.JonathonBallAerospace&Corp.AndreBaune,BautechInc.JohnAdvancedReworkGeraldLeslieBogert,BechtelPlantInc.DarrinDodson,Alcatel-LucentJosephSmetana,Alcatel-LucentormanBESTInc.DorothyCornell,BlackfoxInstituteRussellowland,Alcatel-LucentKarlBoeingCompanySeanKeating,AmphenolLimited(UK)BruceHughes,AmrdecMS&TEPPTMichaelAldrich,AnalogDevicesInc.EdwardCuneo,BoeingCompanyMaryBellon,BoeingResearch&DevelopmentMichaelJawitz,BoeingResearch&DevelopmentChristopherAQS-AllQuality&Services,Inc.JackOlson,CaterpillarInc.IPC-A-610F2014年7月iiiSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEZenaidaCelesticaJenniferCGIFederalAlanisHeriberto,ChamberlainMarcoHuberConsultingPoulJuul,HYTEKBertEl-Bakri,Inc.StevenPerng,CiscoSystemsInc.JagadeeshRadhakrishnan,IntelCorporationRobertPriore,CiscoSystemsInc.LavanyaGopalakrishnan,CiscoSystemsInc.IfeHsu,IntelCorporationRicardoMoncaglieri,SERichardBrown,CommScopeJames(Chunguang)Liu,IPCChina(BeijingMarilynLawrence,ConformanceInc.IsraelMartinez,ContinentalAutomotiveogalesS.A.deCynthiaGomez,ContinentalSAdeCVJoseServin,ContinentalSAdeCVMiguelDominguez,ContinentalSAdeCVMaryCraneAerospace&ElectronicsReggieMalli,CreationLowellSherman,DefenseSupplyCenterColumbusAbles,DellInc.JohnBorneman,DelphiElectronicsandSafetyIreneRomero,DeltaGroupElectronicsInc.JohnI-SACElectronicCo.,Ltd.RichardPond,ItronInc.QuyenChu,JabilCircuit,Inc.GirishJabilCircuit,Inc.(HQ)ThomasCipielewski,JabilCircuit,Inc.(HQ)MinhDo,JetPropulsionLaboratoryReza,Ghaffarian,JetPropulsionLaboratoryFrankHules,JohansonDielectricsInc.AkikazuShibata,JPCA-JapanElectronicsPackagingandCircuitsAssociationancyBullock-Ludwig,KimballElectronicsAugustinStan,L&GAdviceServSRLMichaelMora,DeltaGroupElectronicsInc.CengizOztunc,DZLtd.GabrielRosin,ElbitSystemsLtd.ShelleyHolt,L-3CommunicationsRobertFornefeld,L-3CommunicationsFrederickBeltran,L-3CommunicationsPamMcCord,ElbitSystemsofAmericaByronCase,L-3CommunicationsImeldaEPICHelenaPasquito,CorporationLeoLambert,CorporationPeterMenuez,L-3Communications-CincinnatiElectronicsBruceBryla,L-3Communications-ardaMicrowaveEastKeldMaaloee,LEGOSystemsA/SJoachimSchuett,FED-FachverbandElektronikDesignancyChism,FlextronicsOmarKarinHernandez,FlextronicsManufacturingMex,SAdeCVEricCamden,Foresite,Inc.MichaelFoxconnCMMSG-VPDDougLamond,FoxconnLLCStephenFribbins,FribbinsServicesRayDavison,FSIGaryFerrari,FTGCircuitsFrederickSantos,GeneralDynamics-C4SystemsKristenHewlett-PackardCompanyElizabethBenedetto,Hewlett-PackardCompanyRobertZak,HoneywellJohnMastorides,HoneywellAerospaceRichardRumas,HoneywellCanadaovak,HoneywellInternationalJennieHwang,GroupLindaLockheedMartinMissile&FireControlLockheedMartinMissile&FireControlSamPolk,LockheedMartinMissiles&FireControlKimberlyShields,LockheedMartinMissionSystems&PamelaLockheedMartinMissionSystems&DominikLockheedMartinSpaceSystemsCompanyeilLogicPDDanielMissileDefenseAgencyBillKasprzak,MoogInc.MaryLouSachenik,MoogInc.MoogInc.AnthonyASAJohnsonSpaceCenterRobertCooke,ASAJohnsonSpaceCenterJamesBlanche,ASAMarshallSpaceFlightCenterCharlesGamble,ASAMarshallSpaceFlightCenterChristopherHunt,ationalPhysicalLaboratoryThomas,exteerAutomotiveReneMartinez,orthropGrummanAerospaceSystemsiv2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEMahendraGandhi,orthropGrummanAerospaceSystemsRobertCass,orthropGrummanAmherstSystemsRandyMcutt,orthropGrummanCorp.DavidHillman,RockwellCollinsDavidAdams,RockwellCollinsGregHurst,RSI,Inc.MacorthropGrummanCorporationeilJohnson,Saab-ElectronicDefenceSystemsorthropGrummanCorporationDorisMcGee,orthropGrummanCorporationCasimirBudzinski,SafariCircuitsInc.GastonHidalgo,SamsungAmericaSKCo.,ltd.RichardHenrick,SanminaCorporationAngelaPennington,EngineeringKenMoore,OmniCorp.RaymondFalkenthal,OptimumDesignAssociatesMaryJames,SchlumbergerServicesDanScienscopeInternationalCorporationFinnSkaanning,SkaanningQuality&Certification-SQCMattGarrett,PhononCorporationRonPIEKInternationalEducationCentre(I.E.C.)BVFrankHuijsmans,PIEKInternationalEducationCentre(I.E.C.)BVRobPIEKInternationalEducationCentre(I.E.C.)BVPeterPKSSystemtechnikGmbHRichardKraszewski,PlexusCorp.Pitsch,PlexusCorporationBillBarthel,PlexusManufacturingSolutionsPoleZeroCorporationGuyR&DAssemblyLisaMaciolek,RaytheonCompanyJamesSaunders,RaytheonCompanyDavidelson,RaytheonCompanyJoeRaytheonCompanyRogerMiedico,RaytheonCompanyAmyRaytheonCompanyRaytheonCompanyDavidRaytheonCompanyRaytheonCompanyFondaRaytheonCompanyJamesDaggett,RaytheonCompanyKathyJohnston,RaytheonMissileSystemsLanceBrack,RaytheonMissileSystemsMillman,RaytheonMissileSystemsPatrickKane,RaytheonSystemPaulaJackson,RaytheonUKUdoRobertBoschGmbHCarolineRockwellCollinsDebieRockwellCollinsDouglasPauls,RockwellCollinsCraigSouthernCaliforniaBraidingInc.GreggOwens,SpaceExplorationRogerBell,SpaceSystems/LoralPaulPidgeon,STEMMelParrish,STIElectronics,Inc.PatriciaScott,STIElectronics,Inc.FloydBertagnolli,STM-ServiceMankindClitheroe,SurfaceMountCircuitBoardAssociationAndresOjalill,PolytechnicSchoolRainerElectronicGmbHClancyCenterCarySchmidt,Inc.ConstantinosMetaxas,CorporationThomasAhrens,GmbHCaletteChamness,U.S.Army&MissileCommandR.MichaelMoore,U.S.Army&MissileCommandDavidCarlton,U.S.Army&MissileCommandSharonU.S.Army&MissileCommandHeidiHavelka,UnipowerCorporationScottUTCAerospaceSystemsConstantinHudon,Inc.Gabriela,MedicalSystemsLindaProducts,Inc.Lawrence(Skip)Foust,HospitalGerjanDiepstraten,SoltecDavidZueck,DigitalCorporationBlack,ElectricCo.-POPeterewell,WhirlpoolCorporationLionelFullwood,WKKDistributionLtd.Zhe(Jacky)Liu,ZTECorporationJiaminZhang,ZTECorporationJianfengLiu,ZTECorporationIPC-A-610F2014年7月vSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEIPC-A-610（7-31BC）中国技术组成员HeZhouHuilin,HuaweiCo.,Ltd.ZhouGuanjunCaoAlcatel-LucentShanghaiBellCo.,Ltd.LiuZhijie,BeijingDinghanCo.,LtdZhaoJack,EmersonetworkPowerCo.Ltd.Zhao,Charlie,EmersonetworkPowerCo.Ltd.ZhangCylin,FlextronicsElectronics(Suzhou)Co.Ltd.Zhang,HuaweiCo.,Ltd.(Danny),HuaweiCo.,Ltd.GongHuaweiCo.,Ltd.CaoXi,HuaweiCo.,Ltd.HeDapeng,HuaweiCo.,Ltd.ChenIntegratedService(Kunshan)Renhua,JabilCircuit(Shanghai)Ltd.SunJabilCircuit(Shanghai)Ltd.JabilCircuit(Shanghai)Ltd.LiLiyi,JabilCircuit(Shanghai)Ltd.ZhaoJohnson(Songtao),ShenZhenEasywayScience&Co.Ltd.LuoJinsong,ShenzhenKaiFaCo.,Ltd.JiaBianfen,ZTECorporationGaoZTECorporationXuemei,ZTECorporationIPC-A-610（7-31BD）北欧技术组成员ClausMolgaard,ALPHA-elektronikA/SJacobAPCDenmarkElinOlsen,KitronASKeldMaaloee,LEGOSystemsA/SRoslund,Bang&OlufsenHenrickSnaebum,MADieselStenstrup,DanfossDrivesA/SJesperKonge,GaasdalBygningsindustriA/Sordhus,orautronASPallePedersen,PrintcaGRAPHICA/SJesperDjurhuus,GPVElectronicsA/SGregersDybdal,ProtecElectronicsApSKruse,GrundfosManagementA/SSveinKolbu,HaproASAlexChristensen,HYTEKCarstens,ProtecElectronicsApSStevenHansen,ControlSystemsBjarneHartvigsen,ControlSystemsEvaKitronASJanIPC-A-610（7-31BDE）德语技术组成员ThomasCassidianPeterPKSSystemtechnikGmbHJoachimSchuett,FED-FachverbandElektronikDesignRainerElectronicGmbHMarcoHuberConsultingThomasAhrens,GmbHIPC-A-610（7-31BI）印度技术组成员Jithashreeayakarahalli,CentumElectronicsLimitedPhanishayee,IPCConsultingPvtLtdagarajaUpadhya,CentumRakonIndiaPvt.Ltd.IPCConsultingPvtLtdRentachintalaElectronics&DevelopmentCenterChandrashekaraiahagaraj,IPCConsultingPvtLtdAppanallurSaravanan,IndianInstituteofSciencePanchapakesanKannan,IndsoltechDilip,Rane,IPCConsultingPvtLtdB.J.,Srinivas,Kreativevi2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE特别鸣谢对于以下提供本修订版中所用的照片和图片的成员表示特别的感谢。DonaldMcFarland,3iLindaLockheedMartinMissile&FireControlConstantinoGonzalez,ACME&ConsultingHueGreen,LockheedMartinSpaceSystemsCompanyDarrinDodson,Alcatel-LucentJonathonBallAerospace&Corp.DanielMissileDefenseAgencyKenMoore,OmniCorp.1JenniferCGIFederalRobPIEKInternationalEducationCentreBVCynthiaGomez,ContinentalSAdeCVAnithaSinkfield,DelphiElectronicsandSafetyJackZhao,EmersonetworkPowerCo.Ltd.JuliePitsch,PlexusCorp.Davidelson,RaytheonCompanyKathyJohnston,RaytheonMissileSystemsOmarKarinHernandez,FlextronicsManufacturingMex,SAdeCVHeDaPeng,HuaweiCo.,ZhouHuiLing,HuaweiCo.,ZhangHuaweiCo.,AlexChristensen,HYTEKBertEl-Bakri,Inc.LucaMoliterni,IstitutoItalianodellaSaldaturaRenhua,JabilCircuit,ShanghaiancyBullock-Ludwig,KimballElectronicsGroupC.DonDupriest,LockheedMartinMissilesandFireControlPaulaJackson,RaytheonUKMarcinREEXDavidHillman,RockwellCollinsDouglasPauls,RockwellCollinsDavidSamtecBobGroup2MelParrish,STIElectronicsPatriciaScott,STIElectronicsBee-EngSarafyn,StrataflexCorporationThomasAhrens,GmbHPhilippGmbH&CoKG参与IPC-A-610F中⽂版开发的7-31BC技术组成员：李泽山捷普科技(上海)有限公司孙梦华忆科华电子系统(苏州)有限公司付成丽佰电科技(苏州)有限公司贾变芬中兴通讯股份有限公司陈彦奇宜特科技(昆山)电子有限公司刘振鑫宜特科技(昆山)电子有限公司赵松涛深圳市易思维科技有限公司赵景清艾默生网络能源有限公司周冠军比比电子(苏州)有限公司卢坛广州视源电子科技股份有限公司张源华为技术有限公司汪书遥捷普科技(上海)有限公司罗劲松深圳长城开发科技股份有限公司张晓燕伟创力电子技术(苏州)有限公司1.Figures3-4,3-5,5-18,5-40,6-19,6-22,6-24,6-46,6-68,6-72,6-73,6-86,

6-87,6-96,6-100,6-101,6-102,6-103,6-104,6-107,6-108,6-109,6-123,6-124,7-17,7-28,

7-32,7-84,7-92,7-95,8-171,8-172are©Omniusedbypermission.2.Figures5-50,8-59,8-66,8-95,8-135,8-164,8-165,8-166,8-167,8-168,

8-169,andare©BobWillis,usedbypermission.IPC-A-610F2014年7月viiSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINEviii2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE1前⾔....................................1-11.7图例与插图............................1-61.1范围...................................1-21.8检查⽅法..............................1-61.2⽬的...................................1-31.9尺⼨鉴定..............................1-61.3员⼯熟练程度..........................1-31.10放⼤辅助装置.........................1-61.4分级...................................1-3照明..................................1-71.5对要求的说明..........................1-31.5.1验收条件............................1-目标条件............................1-可接受条件..........................1-缺陷条件............................1-.1处置................................1-制程警示条件........................1-.1制程控制方法........................1-组合情况............................1-未涉及情形..........................1-特殊设计............................1-52适⽤⽂件................................2-12.1IPC标准...............................2-12.2联合⼯业标准..........................2-12.3EOS/ESD协会标准.....................2-22.4电⼦⼯业联合会标准....................2-22.5国际电⼯委员会标准....................2-22.6美国材料与测试协会....................2-21.6术语和定义............................1-51.6.1板面方向............................1-*主面................................1-*辅面................................1-*焊接起始面..........................1-*焊接终止面..........................1-51.6.2*冷焊接连接..........................1-51.6.3电气间隙............................1-51.6.4FOD(外来物)........................1-51.6.5高电压..............................1-51.6.6通孔再流焊..........................1-61.6.7弯月形涂层(元器件)..................1-61.6.8*非功能盘............................1-61.6.9针插焊膏............................1-61.6.10焊料球..............................1-6线径................................1-61.6.12导线重叠............................1-61.6.13导线过缠绕..........................1-62.7技术出版物............................2-23电⼦组件的操作..........................3-13.1EOS/ESD的预防........................3-23.1.1电气过载(EOS).......................3-33.1.2静电释放(ESD).......................3-43.1.3警告标识............................3-53.1.4防护材料............................3-63.2EOS/ESD安全⼯作台/...............3-73.3操作注意事项..........................3-93.3.1指南................................3-93.3.2物理损伤...........................3-103.3.3污染...............................3-103.3.4电子组件...........................3-3.3.5焊接后.............................3-3.3.6手套与指套.........................3-12IPC-A-610F2014年7月ixSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE4机械零部件..............................4-14.1机械零部件的安装......................4-24.1.1电气间隙............................4-24.1.2妨碍................................4-34.1.3大功率元器件安装....................4-44.1.4散热装置............................4-绝缘垫和导热复合材料................4-接触................................4-84.1.5螺纹紧固件和其它螺纹部件的安装......4-扭矩...............................4-导线...............................4-134.2螺栓安装.............................4-154.3连接器插针...........................4-164.3.1板边连接器引针.....................4-164.3.2压接插针...........................4-焊接...............................4-205.2.8焊料受扰...........................5-145.2.9焊料开裂...........................5-155.2.10拉尖...............................5-16无铅填充起翘.......................5-175.2.12无铅热撕裂/孔收缩..................5-185.2.13焊点表面的探针印记和其它类似表面状况.........................5-196端⼦连接................................6-16.1铆装件................................6-26.1.1接线柱..............................6-接线柱基座-焊盘间隙.................6-塔形................................6-双叉形..............................6-46.1.2卷式翻边............................6-56.1.3喇叭口形翻边........................6-66.1.4花瓣形翻边..........................6-76.1.5焊接................................6-84.4线束的固定...........................4-234.4.1概述...............................4-234.4.2连轧...............................4-2损伤...............................4-274.5布线–导线和线束.....................4-284.5.1导线交叉...........................4-284.5.2弯曲半径...........................4-294.5.3同轴线缆...........................4-304.5.4空置线头...........................4-314.5.5接头和焊环上的扎点.................4-325焊接....................................5-15.1焊接可接受性要求......................5-35.2焊接异常..............................5-45.2.1暴露金属基材........................5-45.2.2针孔/吹孔...........................5-65.2.3焊膏再流............................5-75.2.4不润湿..............................5-85.2.5冷焊/松香焊接连接...................5-95.2.6退润湿..............................5-95.2.7焊料过量...........................5-焊料球.............................5-桥连...............................5-锡网/泼锡..........................5-136.2绝缘⽪...............................6-106.2.1损伤...............................6-焊前...............................6-焊后...............................6-126.2.2间隙...............................6-136.2.3挠性套管...........................6-放置...............................6-损伤...............................6-176.3导体..................................6-186.3.1形变...............................6-186.3.2损伤...............................6-多股导线...........................6-实芯线.............................6-206.3.3股线发散(鸟笼形)–焊前............6-206.3.4股线发散(鸟笼形)–焊后............6-216.3.5上锡...............................6-226.4维修环...............................6-246.5应⼒释放.............................6-256.5.1线束...............................6-256.5.2引线/导线弯曲......................6-266.6引线/导线放置–通⽤要求..............6-286.7焊接–通⽤要求.......................6-30x2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE6.8塔形和直针形.........................6-316.8.1引线/导线放置......................6-316.8.2塔形和直针形–焊接................6-3直角...............................7-带侧墙的插针头和直立插座连接器.....7-227.1.9导体外壳...........................7-236.9双叉形...............................6-346.9.1引线/导线放置–侧面进线连接........6-346.9.2引线/导线放置–导线的加固..........6-376.9.3引线/导线放置–底部和顶部进线连接..6-386.9.4焊接...............................6-396.10槽形.................................6-426.10.1引线/导线放置......................6-426.10.2焊接...............................6-43穿孔形...............................6-44引线/导线放置......................6-44焊接...............................6-466.12钩形.................................6-476.12.1引线/导线放置......................6-476.12.2焊接...............................6-496.13锡杯.................................6-506.13.1引线/导线放置......................6-506.13.2焊接...............................6-526.14及更细的导线–引线/导线放置..6-546.15串联连接............................6-556.16边缘夹簧–位置......................6-567通孔技术................................7-17.2元器件的固定.........................7-237.2.1固定夹.............................7-237.2.2粘合剂粘接.........................7-2粘合剂粘接–非架高元器件...........7-2粘合剂粘接–架高元器件.............7-297.2.3其它器件...........................7-307.3⽀撑孔...............................7-317.3.1轴向引线–水平.....................7-317.3.2轴向引线–垂直.....................7-337.3.3导线/引线伸出......................7-357.3.4导线/引线弯折......................7-367.3.5焊接...............................7-3垂直填充(A).......................7-4焊接终止面–引线到孔壁(B).........7-4焊接终止面–焊盘区覆盖(C).........7-4焊接起始面–引线到孔壁(D).........7-4焊接起始面–焊盘区覆盖(E).........7-4焊料状况–引线弯曲处的焊料.........7-4焊料状况–接触通孔元器件本体.......7-4焊料状况–焊料中的弯月面绝缘层.....7-50焊接后的引线剪切...................7-50焊料内的漆包线绝缘层...............7-53无引线的层间连接–导通孔...........7-52子母板.............................7-557.1元器件的安放..........................7-27.1.1方向................................7-方向–水平..........................7-方向–垂直..........................7-57.1.2引线成形............................7-弯曲半径............................7-密封/熔接处与弯曲起始处之间的距离...7-应力释放............................7-损伤...............................7-107.1.3引线跨越导体.......................7-7.1.4通孔阻塞...........................7-127.1.5DIP/SIP器件和插座..................7-137.1.6径向引线–垂直.....................7-限位装置...........................7-167.1.7径向引线–水平.....................7-187.1.8连接器.............................7-197.4⾮⽀撑孔.............................7-587.4.1轴向引线–水平.....................7-587.4.2轴向引线–垂直.....................7-597.4.3引线/导线伸出......................7-607.4.4引线/导线弯折......................7-617.4.5焊接...............................7-637.4.6焊接后的引线剪切...................7-657.5跳线..................................7-667.5.1导线的选择.........................7-667.5.2布线...............................7-677.5.3导线的固定.........................7-697.5.4支撑孔.............................7-7支撑孔–引线在孔内.................7-717.5.5缠绕连接...........................7-727.5.6搭焊连接...........................7-73IPC-A-610F2014年7月xiSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE8表⾯贴装组件............................8-18.1粘合剂固定............................8-38.1.1元器件粘接........................8-38.1.2机械强度..........................8-48.2SMT引线..............................8-68.2.1塑封元器件........................8-68.2.2损伤..............................8-68.2.3压扁..............................8-78.3.3圆柱体帽形端⼦.....................8-3侧面偏出(A).......................8-3末端偏出(B).......................8-3末端连接宽度(C)...................8-3侧面连接长度(D)...................8-3最大填充高度(E)...................8-3最小填充高度(F)....................8-3焊料厚度(G).......................8-40末端重叠(J)........................8-418.3SMT连接..............................8-78.3.1⽚式元器件–仅有底部端⼦............8-侧面偏出(A)......................8-末端偏出(B)......................8-末端连接宽度(C)..................8-侧面连接长度(D).................8-最大填充高度(E)..................8-最小填充高度(F)..................8-焊料厚度(G).....................8-末端重叠(J)......................8-148.3.2矩形或⽅形端⽚式元器件–1，3或5⾯端⼦.......................8-侧面偏出(A).....................8-末端偏出(B)......................8-末端连接宽度(C)..................8-侧面连接长度(D).................8-最大填充高度(E)..................8-最小填充高度(F)..................8-焊料厚度(G).....................8-末端重叠(J)......................8-2端子异常.........................8-2.1侧面贴装(公告板)................8-2.2底面朝上贴装.....................8-2.3叠装.............................8-2.4立碑.............................8-300居中焊端.........................8-30.1侧面焊接宽度.....................8-30.2侧面最小填充高度.................8-328.3.4城堡形端⼦..........................8-4侧面偏出(A).......................8-4末端偏出(B).......................8-4最小末端连接宽度(C)...............8-4最小侧面连接长度(D)...............8-4最大填充高度(E)...................8-4最小填充高度(F)....................8-4焊料厚度(G).......................8-468.3.5扁平鸥翼形引线.....................8-4侧面偏出(A).......................8-4趾部偏出(B).......................8-5最小末端连接宽度(C)...............8-5最小侧面连接长度(D)...............8-5最大跟部填充高度(E)...............8-5最小跟部填充高度(F)................8-5焊料厚度(G).......................8-5共面性.............................8-598.3.6圆形或扁圆(精压)鸥翼形引线..........8-60侧面偏出...........................8-6趾部偏出(B).......................8-6最小末端连接宽度(C)...............8-6最小侧面连接长度(D)...............8-6最大跟部填充高度(E)...............8-6最小跟部填充高度(F)................8-6焊料厚度(G).......................8-6最小侧面连接高度(Q)...............8-6共面性.............................8-67xii2014年7月IPC-A-610FSINGLEUSERLICENSE-NOTFORUSEONANETWORKORONLINE8.3.7J形引线.............................8-6侧面偏出(A).......................8-6趾部偏出(B).......................8-70末端连接宽度(C)...................8-70侧面连接长度(D)...................8-7最大跟部填充高度(E)...............8-7最小跟部填充高度(F)................8-7焊料厚度(G).......................8-7共面性.............................8-768.3.16P型连接...........................8-10最大侧面偏出(A)..................8-10最大趾部偏出(B)..................8-10最小末端连接宽度(C)..............8-10最小侧面连接长度(D)..............8-10最小填充高度(F)...................8-1058.4特殊SMT端⼦........................8-1068.5表⾯贴装连接器......................8-1078.3.8垛形/I形连接........................8-7修整的通孔引线.....................8-7预置焊料端子.......................8-7最大侧面偏出(A)...................8-7最大趾部偏出(B)...................8-80最小末端连接宽度(C)...............8-8最小侧面连接长度(D)...............8-8最大填充高度(E)...................8-8最小填充高度(F)....................8-8焊料厚度(G).......................8-848.6跳线.................................8-1088.6.1SMT..............................8-10片式和圆柱体帽形元器件............8-10鸥翼形引线........................8-J形引线...........................8-城堡形端子........................8-焊盘..............................8-9元器件损伤..............................9-19.1⾦属镀层缺失..........................9-28.3.9885扁平焊⽚引线........................-8.3.10仅有底部端⼦的⾼外形元器件........8-86内弯L形带状引线...................8-878.3.12889表⾯贴装⾯阵列....................-890对准...........