PICMG-3-0-Shortform原版完整文件

AdvancedTCATM

PICMG3.0

ShortFormSpecification

January2003

ThisshortformspecificationisderivedfromthePICMG3.0®AdvancedTelecommunicationsComputingArchitecture(ATCA)specificationasapprovedonDecember30,2002bythePICMG®ExecutiveMembership.ForguidelinesonthedesignoftheAdvancedTCA™compliantboardsandsystems,refertothefullspecification–donotusethisshortformforanydesigndecisions.

Copyright2003,PCIIndustrialComputersManufacturersGroup(PICMG)

PICMGdisclaimsallwarrantiesandliabilityfortheuseofthisdocumentandtheinformationcontainedhereinandassumesnoresponsibilityforanyerrorsoromissionsthatmayappearinthisdocument,norisPICMGresponsibleforanyincidentalorconsequentialdamagesresultingfromtheuseofanydatainthisdocument,nordoesPICMGassumeanyresponsibilitytoupdateorcorrectanyinformationinthispublication.

PICMG3.0ShortFormSpecification

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Overview

ThisshortformspecificationisasubsetofthefullAdvancedTCA™basePICMG®3.0specificationdevelopedbyPICMG®.ThisdocumentismeanttoprovidebackgroundinformationforthoseinterestedintheprogressanddirectionoftheAdvancedTCAeffort,butitisnotadesigndocument.Anyonewishingtodesignaboard,backplaneorsystemshouldobtainthefullspecificationsfromPICMG®.APDFversionofthisshortformspecificationcanbedownloadedfromtheAdvancedTCAsectionofthePICMG®

WebSiteat.Notethatthe

fulldocumentcontainsfarmoreinformationandmanysectionsnottoucheduponinthisshortformdocument.

Introductionandobjectives

ThePICMG®(PCIIndustrialComputerManufacturersGroup)3.0specificationdefinesopenarchitecturemodularcomputingcomponentsthatcanbequicklyintegratedtodeployhighperformanceservicessolutions.ThePICMG®

3.0familyofspecificationsdrawsheavilyonthePICMG®2.0experiencebyadoptingtheserialinterconnectphilosophythathasevolvedtherewhilemakingchangeswheretheyareindicatedbythatexperience.

ThePICMG®3.0specificationisfocusedonthedefinitionofanarchitecturethatcan:

Enablereduceddevelopmenttimeandcosts

Supportreducedtotalcostofownership

Applytoedge,core,transport,anddatacenter

Applytowireless,wireline,andopticalnetworkelements

Supportarichmixofprocessors,digitalsignalprocessors(DSPs),networkprocessors(NPs),storage,andinput/output(I/O)

Integratewithmultiplenetworkelements

Providemulti-protocolsupportforinterfacesupto40Gb/s

Offerhighlevelsofmodularityandconfigurability

Improvevolumetricefficiency

Improvepowerdistributionandmanagement

Offeranadvancedsoftwareinfrastructureprovidingoperatingsystems(OSs),applicationprogramminginterface(API),andoperation,administration,management,andprovisioning(OAM&P)

Offerworld-classelementcostandoperationalexpense

Providehighlevelsofserviceavailability(99.999%andgreater)throughtheintegrationoffeaturesforresiliency,redundancy,serviceabilityandmanageability

SupportappropriatescalabilityofSystemperformanceandcapacity

Theobjectiveofthisdocumentistopresentbaserequirements,and,insomecases,suggestimplementationsforthePICMG®3.0Specification.Includedisdetailedinformationofthefollowingelementsthatmustbeconsideredduringdevelopment:

Mechanicals

SystemManagement

PowerDistribution

PowerConnectorZone(forDual-48VDCpowertoeachSlot)

RearI/OAccessZone

DataTransportConnectorZone(forSystemmanagementandswitchingfabricinterconnect)

ShelfThermalDissipation

RegulatoryGuidelines

Allsignalsareactivehighunlessdenotedbyatrailing#symbol.Differentialsignalsaredenotedbyatrailing+(positive)or–(negative)symbol.

Specialtermsandacronyms

Thefollowingtermsandacronymsareusedinspecificwaysthroughoutthisspecification:

Term

Definition

Backplane

ApassivecircuitboardprovidingtheZone1andZone2connectorsforFrontBoardSlots.LinkPortsoftheSlotsareconnectedviahighspeedsignalpairs.Powerdistribution,management,andauxiliarysignalconnectionsaresupported.

ComponentSide1

WhenusedinreferencetoanAdvancedTCA™Board,thesideonwhichthehighestelectroniccomponentswouldbemounted.IdenticalwiththeRightsideasdefinedbelow.

ComponentSide2

WhenusedinreferencetoanAdvancedTCA™Board,thesidenormallyreservedformakingsolderconnectionswiththrough-holecomponentsonComponentSide1butonwhichlowheightelectroniccomponentsmayalsobemounted.IdenticalwiththeLeftsideasdefinedbelow.

DataTransportInterface

Thecollectionofpoint-to-pointinterfacesandbusedsignalsintendedtoprovideinterconnectamongthePayloadsonHubandNodeBoardsinSection6ofthespecification.

Dual-DualStarTopology

Aninterconnectfabrictopologyinwhichfourswitchresourcesprovideredundantconnectionstoallendpointswithinthenetwork.TwopairsofHubBoardsprovideredundantinterconnectsbetweenNodeBoardsviatwoindependentnetworksinparallel.

DualStarTopology

Aninterconnectfabrictopologyinwhichtwoswitchresourcesprovideredundantconnectionstoallendpointswithinthenetwork.ApairofHubBoardsprovideredundantinterconnectsbetweenNodeBoards.

ElectronicKeyingorE-Keying

ProtocolusedtodescribethecompatibilitybetweentheBaseInterface,FabricInterface,UpdateChannelInterface,andSynchronizationClocksconnectionsofFrontBoards.

FabricInterface

AZone2interfacethatprovides15connectionsperBoard/Sloteachcomprisedofupto8differentialsignalpairs(Channel)supportingconnectionswithupto15otherSlots/Boards.BackplanesmaysupporttheFabricInterfaceinavarietyofconfigurationsincludingFullMeshandDualStartopologies.BoardsthatsupporttheFabricInterfacemaybeconfiguredasFabricNodeBoards,FabricHubBoards,orMeshEnabledBoards.BoardimplementationsoftheFabricInterfacearedefinedby

thePICMG®3.xsubsidiaryspecifications.

FieldReplaceableUnit(orFRU)

Anyentitythatcanbereplacedbyauserinthefield.NotallFRUsarehot-swappable.Atitsmostbasic,theFRUdoesnothaveanIPMControllerontheassemblyand,hence,isnotdirectlycontrollablethroughtheIPMIinfrastructure.BasicproductinventorydatafortheFRUmaybemaintainedataproxyIPMControllerelsewhereintheShelf.ExamplesofthistypeofFRUmightinclude:backpanel(theShelfhousing,forallpracticalpurposes),powerentrymodule,fanmodule,PMC,andRTMs.

FrontBoardorBoard

ABoardthatconformstoPICMG®3.0mechanicals(8Ux280mm),includingaPCB

andaPanel.Further,aBoardconnectswiththeZone1andZone2Backplaneconnectorsand,optionally,mayconnectwithaZone3MidplaneConnectorordirectlytoanRTMconnectorandisinstalledintothefrontportionofaShelf.

FullMeshTopology

FullMeshconfigurationsmaybesupportedwithintheFabricInterfacetoprovideonededicatedChannelofconnectivitybetweeneachpairofSlotswithinaShelf.FullMeshconfiguredBackplanesarecapableofsupportingMeshEnabledBoardsorHubandNodeBoardsinstalledinaDualStararrangement.(akaFullMeshBackplane)

Term

Definition

IntelligentFRU

AFRUcontaininganIPMController.IntelligentFRUsincludetheNodeandHubBoards,andtheycouldalsoincludeotherFRUssuchasthefantray,powersupplies,alarmboards,etc.

RearBoard,RearTransitionModule,orRTM

An8Ux70mmx6HPassemblyinstalledintotherearportionofaShelfandmatedwithaFrontBoardthroughZone3connectorstoprovideI/Oconnectivity.

ReplicatedMeshTopology

ReplicatedMeshconfigurationsprovidemultipleChannelsofFabricInterfaceconnectivityamongtheSlotswithinaShelf.ThenumberofChannelsprovidedbetweenanytwoSlotsisdependentontheSlotcount.

Shelf

TheShelfconsistsoftheSubrack,Backplane,FrontBoards,coolingdevices,RTMs,powersupplies,etc.Alsohistoricallyknownasachassis.

ShMC

ShelfManagementController.AnIPMCthatisalsocapableofsupportingthefunctionsrequiredoftheShelfManager.

Star

ABackplanetopologyhavingoneofmoreHubSlotsprovidingconnectivityamongthesupportedNodeSlots

Subrack

TheSubrackprovidestheinterfacetoPICMG®3.0Boardsandconsistsofthe

GuideRails,ESDdischarge,alignment/keying,Handleinterface,FacePlatemountinghardware,EMCgasketing,andBackplaneinterface.TheSubrackisasubsetoftheShelf.

Zone1

ThelinearspacealongtheheightdimensionofanAdvancedTCA™Slotallocatedforpower,management,andotherancillaryfunctions.

Zone2

ThelinearspacealongtheheightdimensionofanAdvancedTCA™SlotallocatedtotheDataTransportInterface.

Zone3

ThelinearspacealongtheheightdimensionofanAdvancedTCA™Slotreservedforuserdefinedconnections.

Mechanical

ThissectiondefinestheessentialmechanicalfeaturesforPICMG®3.0compliantplatforms.TheFrameandCabinetmountingstandards,containedinANSI/EIA310-DSection1,IEC60297-1,andIEC60297-2,governtheoveralldimensionsoftheShelfresultingina“softmetric”equipmentpracticeadaptabletotelecommunicationscentralofficeanddatacenterinstallationsthroughouttheworld.

Thebasicelementsoftheplatformareasfollows(see

Figure1,“Formfactor

”):

FrontBoardscontainingthedesiredelectronicfunctionsandtheconnectorsrequiredtointerfacewiththesefunctions.TheFrontBoardis8Uhigh,30.48mmwide,andapproximately280mmdeep.Asmandatoryfeatures,theFrontBoardincludesaFacePlateandtwoHandles.Optionally,theFrontBoardmayincludeacoveronComponentSide2and/oronComponentSide1.OntheFrontBoard,threeconnectorzonesaredefined:Zone1forpowerconnectionandShelfmanagement,Zone2forDataTransportInterface,andZone3foruser-definedIO(Input/Output)interconnect.

RTMsprovidinguserdefinedinputandoutputconnectivitytothecompanionFrontBoardfromtherear.

TheBackplaneprovidingconnectorinterfacesforpowerdistributionandinput/outputconnectivitybetweenFrontBoards,aswellasfinalmechanicalalignmentandsupport.

TheSubrackprovidingattachmentpointsfortheBackplane,aswellasalignment,support,andmechanicalengagementfortheinsertionandextractionofFrontBoardsandRTMs

Zone3

25mm

25mm

RearpanelIOInterconnect

90mmOpticalCabling/AirPlenum

FrontBoard(8Ux280mm)(140in2)

1.2”pitch

Zone2:

Keying/alignment

Synch.Clocks

UpdateChannels

FabricInterface

BaseInterface

75mmMetallicCabling/Air

Rear Plenum

TransitionModule(8Ux

70mm

x1.2”)

(35in2)

Zone1:

Power

Management

322.25mm

(12.697”)

Upto4standardPMCs

Zone3

FrontAccessDoor

RearAccessDoor

Figure1Formfactor

Zone2

Z1

Note: Shelfmaybe19”,23”,or600mmETSI.

FrontBoardassembly

TheFrontBoardPCBformfactorshallbeasdefinedin

Figure2,“FrontBoardPCBformfactor.”

SeeexceptionsinSection2.2.1ofthePICMG3.0specification.

EachFrontBoardshallprovideamulti-segmentdischargestriplocatedonComponentSide1alongthebottomedgeofthePCB.CoversmaybeusedwithFrontBoardsforstiffeningthePCB,EMCandelectricalprotection,minimizingflamespread,and/orphysicalprotectionofcomponents.TheAdvancedTCATMFrontBoardtoFrontBoardpitchshallbe30.48mm(6HPor1.2in).ThePCBshallbepositionedbetweentwoPitchLinessothatthePCB'sComponentSide1surfaceshallbe6.61mmfromtheleftsidePitchLine.ThemaximumComponentSide1heightshallbe21.33mm.The“nocomponentzone”betweenthetwoFrontBoardsshallbe2.54mmwideandshallprovideforelectricalClearancetothenextFrontBoardand/ortheright-handSubracksidewallforFrontBoards.

TheFrontBoardFacePlateshallbemountedintoan8USubrackata6HPpitch(oneSlot).ThethicknessoftheFrontBoardisnotdefinedinthisspecification.FacePlatemetalthicknessshouldbe1.0mmtomaintainauniformlookandfeelamongmanufacturers.TheFrontBoardFacePlateHandlesshallrotatearoundthestandoffsforthemandatoryPCBmountingholesdefinedin

Figure2,“FrontBoardPCBformfactor,”

andshallbedesignedtohaveaSubrackinterface.

Figure2FrontBoardPCBformfactor

EachFrontBoardshallhaveanAlignmentandSafetyGroundpinonbothendsoftheFacePlate.Thesepinsshallbeimplementedevery6HPonmulti-SlotFacePlates,includingfillerpanelsandRTMs.

TheFrontBoardFacePlateshallhavetwocaptiveretentionscrewsandshallprovideretentionscrewholesatthetopandbottom.Fillerpanelsshallbeusedtocloseempty,shallincludeanEMCgasketandretentionscrews,andshallhaveFacePlateAlignmentandSafetyGroundpins.

FourgeneralstatusLEDpositionsandfunctionsaredefinedfortheFrontBoardFacePlate.TwooftheseLEDs(BLUELEDandLED1)aremandatory;useofLED2andLED3isoptional.

ThesefourLEDsshallbemountedonComponent2sideofthePCB.LegendsmaybeprovidedforeachoftheseLEDs.OneBLUELEDshallbeprovidedonallFrontBoardsandshallbepositionedatthebottomoftheFrontBoardFacePlate.LED1shallbecontrolledbyboththeIPMController(fortestoperations)andtheapplication(fornormalapplications).

FrontBoardFacePlate

TheFrontBoardFacePlateshallbeasdefinedin

Figure3,“FrontBoardFacePlateandRTMFacePlateEMC

gasket.”

FrontBoardFacePlatesprovideforaPCBfrontI/Ointerface.AnEMCgasketshallbelocatedontheComponentSide2edgeoftheFrontBoardFacePlateonboththeFrontBoardandRTM.

TheFrontBoardFacePlateshallbemountedintoan8USubrackata6HPpitch(oneSlot).ThethicknessoftheFrontBoardisnotdefinedinthisspecification.FacePlatemetalthicknessshouldbe1.0mmtomaintainauniformlookandfeelamongmanufacturers.TheinternalsurfaceoftheFacePlateshouldnotpenetratebehindtheFacePlateattachmentplane.

FrontI/OusingdevicesrequiringareturnpathtoShelfGroundshallimplementthisreturnpaththroughtheFacePlategroundpin.

TheFacePlateshallprovideforaHandleonbothends,AlignmentandSafetyGroundpinfeature,andretentionscrews.

FacePlatesmayneedtominimizeinsertiontorsiontoensureproperseatingandgasketing.ThismaybeaccomplishedbyaddingstiffenersoradditionalattachmentpointsbetweentheFacePlateandthePBA.

Figure3FrontBoardFacePlateandRTMFacePlateEMCgasket

FrontBoardFacePlateHandles

TheHandlesshallrotatearoundthestandoffsforthemandatoryPCBmountingholesandshallbedesignedtohaveaSubrackinterface.TheHandleshouldallowformaximumverticalFacePlateI/Ospace.ThemaximumlengthoftheHandlealongtheFacePlateshallbe50mmfromthecenterofthemountinghole.

ApositivemechanicalstoporothermeansshallbeprovidedtolocateHandlesattheirproperangularpositionpriortoFrontBoardinsertion.

AnimplementationfortheHandleSwitchandlatchmechanismisshownin

Figure4,“ExampleofHandleSwitch

andlatchmechanism.”

NotethatthisexampleimplementationmountstheswitchonthereturnflangeoftheFacePlate,soasinglepackagingsuppliercansupplyitalongwiththeFrontBoardFacePlate,Handle,andretentionmechanism.

Figure4ExampleofHandleSwitchandlatchmechanism

ProvisionforusingoptionalCMC/PMCMezzanineCards

Optionally,oneormore“CommonMezzanineCards”(CMCs)and“PCIonaCMC”(PMCs)maybeassembledtoBoards.

Amaximumoffour(4)CMCsorPMCsof75mmwidtharepossiblealongtheheightdimensionofaFrontBoard.Withtheejectorsillustratedabove,approximately304mmofverticalspacebetweenspacerequiredforejectorhandlemounting.Notethattheoveralllengthofthehandlesdoesnoteffectthefrontpanelspaceavailableformezzanines.

Thisprovidesapproximately2mmclearanceoneitherendoffourCMC/PMCcards,eachwitha75mmwideenvelope.

RTMassembly

RTMsareoptional.RTMssimplifyservicingofFrontBoardsbyputtingI/OcableassembliesontheRTM.I/OsignalsfromtheFrontBoardareroutedtoZone3whereauser-definedconnectormateswiththeRTMandtakesthesignalsoutsidetherearoftheShelf.ThisallowsFrontBoardstobequicklyandreliablyservicedwithouttheissuesassociatedwithdisconnectingandreconnectingmultiplecableassemblies.

IfRTMsareused,theymayconnecttotheFrontBoardviaZone3connections,buttheyshallnotmakeanyconnectiontotheZone1/Zone2Backplane(excepttherA1alignment/keyingfeature).

ThisspecificationdefinestheRTMenvelopeandelectromechanicalinterfaces.ThespecificimplementationofanRTMmaybeaPCB,wiringharness,orotherconstructionandislefttotheuser.

IftheRTMconsistsofaPBA,itshallbe“in-line”withtheFrontBoard.TheEMCgasketsoftheRTMsshallbelocatedonComponentSide2oftheFacePlate.

Zone1,2,and3connectors

TheZone1connectorshallbetheonlyinterfacebetweenAdvancedTCATMBackplanesandFrontBoardsfordualredundant-48VDCpower,metallictest,ringinggenerator,Shelfmanagementsystemconnections,andHardwareAddressing.

Zone2definestheuseoffiveBackplaneconnectors,P20throughP24,tosupporttheDataTransportInterface.ItprovidesforuptofiveZDconnectorsperFrontBoardtocovertheBaseInterface,FabricInterface,UpdateChannelInterface,andSynchronizationClockInterface.

Zone3includesspaceforkeyingand95.1mmPCBedgespaceforconnectors.ItprovidesaflexiblemethodforuserdefinedI/OsignalstoberoutedtoeitheranRTM,aZone3midplaneextension,orabulkhead-mountedconnector.TheconnectortypeinZone3isnotdefined,ratheritislefttotheusertochoosetheinterconnecttechnologythatbestmeetstherequirements.

TheconnectortypeinZone3isnotdefined;rather,itislefttotheusertochoosetheinterconnecttechnologythatbestmeetstherequirements.A2/K2alignmentandkeyingshallbeusedtopreventincompatibilities.

FrontBoardandRTMalignment/keying

TheFrontBoardisalignedbyafour-stagealignmentsystem:1)GrossalignmentintheSubrackisachievedasthePCBedgeispositionedwithintheGuideRails;2)TheAlignmentandSafetyGroundpinsontheBackplaneandRTMalignwiththereceptaclesontheFrontBoardorRTM;3)TheAlignmentandSafetyGroundpinsontheFrontBoardFacePlatealignwiththereceptaclesinthehorizontalmembers;and4)ThealignmentfeaturesoftheZone1andZone2connectorsthemselves(note:Zone1matesfirst).

KeyingisusedtopreventamismatchbetweenFrontBoardsandBackplanesorbetweenFrontBoardsandRTMs.PhysicalkeyingpreventstheinstallerfromdamagingconnectorsbyattemptingtomateaFrontBoardtoamidplaneorRTMthathaveincompatibleconnectortypes,offsetconnectorlocations,orincompatiblevoltagelevelsthatcannotbehandledbyElectronicKeying.

ForZone1andZone2connectoralignment,BackplanealignmentfeaturesshallbeimplementedtoensureFrontBoardandBackplaneconnectorsarealignedproperlyduringmating.TheBackplaneshallimplementtheA1alignment/keyingfeatureateverySlotpositionasshownin

Figure5,“Backplanealignment/keyingfeature(A1).”

TheFrontBoardshallimplementtheK1keying/alignmentfeatureasshownin

Figure6,“FrontBoardand

alignment/keyingfeatures(K1,K2).”

Figure5Backplanealignment/keyingfeature(A1)

Figure6FrontBoardandalignment/keyingfeatures(K1,K2)

Backplanes

PICMG®3.0Backplanesshallhavethicknessfrom3to8mm.ThenumberofFrontBoardSlotsaccommodatedbytheBackplaneshallbebetween2and16.TheBackplanehasmountingholestoattachtothesubrack,mountingholesforaBackplanesupportbar,andmountingholesforanalignment/keyingmechanismthatislocatedabovetheZone2connectors.

TheBackplanedistributespower,metallictestbus,ringgeneratorbus,andlow-levelShelfManagementsignalsthroughtheZone1connectors.TheBaseInterface,FabricInterface,UpdateChannelInterface,andSynchronizationClockInterfacesignalsaredistributedthroughtheZone2connectors.

Subrack

TheSubrackprovidesthemechanicalinterfacetoPICMG®3.0FrontBoardsandconsistsof:GuideRails,ESDdischargeclips,alignment/keying,Handleinterface,FacePlatemountinghardware,EMCgasketing,andBackplaneinterface.TheSubrackconstructionmaterialsanddesigndetailsarenotdefined;onlytheFrontBoardtoSubrackinterfacedimensionsaredefined.

TheSubrackshallsupportPICMG®3.0formfactorFrontBoards.ASubrackshallprovideforan8UfrontheightandtheDcdepthdimension(295.6mm±0.5mm).TheBackplanesupportbarshallprovideforZone1/Zone2BackplanetoSubrackattachmentfeatures.

TheSubrackfrontand(optional)rearshallprovidefortheFacePlateAlignmentandSafetyGroundpin/25AgroundreceptacleandtheretentionscrewM3threadedholes.TheEMCSubrackgasketshallbemountedontherightsideofthefrontSubrackopening(whenviewedfromthefront).

TheFrontBoardandRTMGuideRailsshallhavethePCBguidancefeatureinthe6.61mmoffsetpositionandshallbepresentatevery6HPintheSubrack.TheSubracksshallholdtheFrontBoardandoptionalRTMsunderthespecifiedshock,vibration,andearthquaketestrequirements.

TheSubrackshallprovideAlignmentandSafetyGroundpinreceptaclestomatewithpinsatbothendsoftheFrontBoardFacePlateandFacePlatesfortheoptionalRTM.

TheSubrackshallprovideM3threadedretentionscrewreceptaclesattheFrontBoardattachmentsurfaceandRTMattachmentsurface.

TheSubrack,aspartofthestructureoftheShelf,shallsupporttheweightoftheFrontBoardsandoptionalRTMs.

SubrackintegritytestsprovideSubrack/Shelfmanufacturerswithdesign/testrequirementsforestablishingminimumperformanceacceptancelevelsandprovidingguidancewhentheendusersystemconfigurationisunknown.

PhysicalSlotnumberingshallbeginfromlefttorightforFrontBoardsasviewedfromthefrontinthestandardorientationandfrombottomtotopinthehorizontalorientation.Numberingshallbeginwithnumeral1andshallincreasebyincrementsofone.

Shelf

TheFrontBoardformfactorhasbeendesignedforuseina12Uverticalsystem,butalternateShelfconfigurationssuchaslow-profile“pizzaboxes”andothersystemsizesareallowed.SinceFrontBoardsrequirefilteredair,Shelvesshallprovidefilteringunlessfilteringisprovidedelsewhere.EachShelfshallprovideawriststrapterminalonthefrontoftheShelf.WriststrapterminalsshallbeunpaintedterminalsconnectedtoShelfGroundandshallbemarkedtoindicateESDfunction.Abananaplug/jackassemblyshallbeusedfortheESDwriststrapconnections.Shelf-levelalarmreportingresourcesmaybeprovidedontheShelf.

CablemanagementmustbedeterminedattheFrame,Shelf,andFrontBoard/RTMlevel.Withineachofthesethreeareas,therearethreetypesofcablemanagementtobeconsidered:powercablemanagement,I/Ocoppercablemanagement,andI/Oopticalfibercablemanagement.

Powerentry

PowerentryintoaPICMG®3.0Shelfissubjecttovariousendcustomerrequirements.Thedistributionofthemain“A”and“B”officeFeedsvary.TheFeedsmaybeconnectedtotheShelfusingsinglepointswithadequaterating.

PowerentryterminalsorconnectorsshallmeettheaccessibilityandspacingrequirementsinSub-clause2ofIEC60950.Powerentrymaybebyconnectororbypowerstud.Ifaconnectorisused,itshallbeakeyedorpolarizedconnector.

Shelfmountingholepatternandlocation

Shelfmountingpatternsvarydependingupontheend-userenvironment.Twomajorstandardstodesignforare:

Inch-basedmountingholepatternperEIA-310andIEC60297-1

Metric-basedmountingholepatternperIEC60917-2

Shelfmountinglocationvariesdependingupontheend-useenvironment.Therearethreebasicoptions:

Frontflangemount

Midmount

Frontmountandrearmountsupport

Shelfmanagement

AdvancedTCA™providesforextensivemanagementcapabilities,whichmaybeusedbytheoverallSystemManager.Multiplelevelsofmanagementservicesareprovidedorfacilitated:

Low-levelhardwaremanagementservices

HighspeedmanagementservicesbasedontheTCP/IPprotocolsuite

In-bandapplicationmanagement

TheShelfmanagementcontentofthisspecificationfocusesonthelowlevelhardwaremanagementservices.Anarchitectureforhigh-speedmanagementservicesisoutlined.In-bandapplicationmanagementisoutsidethescopeofthisspecification.

TheShelfmanagementsystemdoesthefollowing:

Monitors,controls,andassuresproperoperationofAdvancedTCA™BoardsandotherShelfcomponents

Watchesoverthebasichealthofthesystem,reportsanomalies,andtakescorrectiveactionwhenneeded

RetrievesinventoryinformationandsensorreadingsaswellasreceiveeventreportsandfailurenotificationsfromBoardsandotherIntelligentFRUs

Performsbasicrecoveryoperationssuchaspowercycleorresetofmanagedentities

Provideslow-levelhardwaremanagementservicestomanagethepower,cooling,andinterconnectresourcesofaShelf

AdvancedTCA™allowssystemswitheither1)allcomponentsoperatedbyasingleowneror2)componentsoperatedbymultipleowners(Multi-tenancy).

TheShelfmanagementsystemiscomprisedofseveralmajorcomponents:

DistributedmanagementcontrollersthatmanageandmonitortheoperationandhealthofeachFRUinthesystem.

AnIntelligentPlatformManagementInterface(IPMI)infrastructurethatprovidescommunications,management,andcontrolamongthedistributedcontrollersandtoanoverallSystemManager.

Ahigher-level,high-speedserviceforBoardsthatneedTCP/IP-basedmanagementservicessuchasremotebooting,SNMPmanagement,remotediskservices,andotherIP-basedservices.

Shelfmanagementarchitecture

Figure7,“ManagementaspectsofanexampleofAdvancedTCA™Shelf,”

showsthelogicalelementsofanexampleAdvancedTCA™Shelf,withanemphasisonmanagement-relatedaspects.

Figure7ManagementaspectsofanexampleofAdvancedTCA™Shelf

IPMController(IPMC)

ShelfManagementController(ShMC)

AdvancedTCABoard

ShelfManagerw/DedicatedShMC

OtherFieldReplaceableUnit(FRU)

SystemManger

Shelf-ExternalSystemManager

ShelfManager(Active)

ShelfManager(Backup)

FanTray

PowerEntryModule

PowerEntryModule

Key

ImplementationDependentConnection

IPMC

2xRedundant,BussedorRadial,IPMB-0

ATCA

Board

ATCA

Board

ATCA

Board

ATCA

Board

ATC