标准解读

《GB/T 44514-2024 微机电系统(MEMS)技术 层状MEMS材料界面黏附能四点弯曲试验方法》是一项国家标准,专门针对微机电系统中的层状材料界面之间的黏附性能进行评估。该标准通过四点弯曲测试来量化不同层间材料的结合强度,对于理解与优化MEMS器件的可靠性和耐用性至关重要。

在具体操作上,本标准详细规定了实验设备的要求、试样的制备过程以及具体的测试步骤。首先,需要准备符合特定尺寸和形状要求的层状MEMS材料样品。接着,在专用的四点弯曲测试机上按照预定条件对样品施加力直至其断裂。通过记录断裂时所施加的最大载荷,并结合材料的几何参数,可以计算出层间界面的黏附能量值。


如需获取更多详尽信息,请直接参考下方经官方授权发布的权威标准文档。

....

查看全部

  • 现行
  • 正在执行有效
  • 2024-09-29 颁布
  • 2024-09-29 实施
©正版授权
GB/T 44514-2024微机电系统(MEMS)技术层状MEMS材料界面黏附能四点弯曲试验方法_第1页
GB/T 44514-2024微机电系统(MEMS)技术层状MEMS材料界面黏附能四点弯曲试验方法_第2页
GB/T 44514-2024微机电系统(MEMS)技术层状MEMS材料界面黏附能四点弯曲试验方法_第3页
GB/T 44514-2024微机电系统(MEMS)技术层状MEMS材料界面黏附能四点弯曲试验方法_第4页
免费预览已结束,剩余12页可下载查看

下载本文档

GB/T 44514-2024微机电系统(MEMS)技术层状MEMS材料界面黏附能四点弯曲试验方法-免费下载试读页

文档简介

ICS

31.080.99

CCS

L

59

中华人民共和国国家标准

GB/T44514—2024/IEC62047﹘31:2019

微机电系统(MEMS)技术

层状MEMS材料界面黏附能四点弯曲

试验方法

Micro-electromechanicalsystem(MEMS)technology—Four-pointbendingtest

methodforinterfacialadhesionenergyoflayeredMEMSmaterials

(IEC62047-31:2019,Semiconductordevices—Micro-electromechanical

devices—Part31:Four-pointbendingtestmethodforinterfacialadhesionenergy

oflayeredMEMSmaterials,IDT)

2024-09-29发布2024-09-29实施

国家市场监督管理总局发布

国家标准化管理委员会

GB/T44514—2024/IEC62047﹘31:2019

目次

前言

·····································································································

1

范围

··································································································

1

2

规范性引用文件

······················································································

1

3

术语、定义、符号和名称

············································································

1

3.1

术语和定义

······················································································

1

3.2

符号和名称

······················································································

1

4

试验件

································································································

2

4.1

总体要求

·························································································

2

4.2

试验件的形状

····················································································

2

4.3

尺寸测量

·························································································

3

4.4

能量释放率的评价

···············································································

3

5

试验方法和试验装置

·················································································

3

5.1

试验原理

·························································································

3

5.2

试验设备

·························································································

3

5.3

试验程序

·························································································

3

5.4

试验环境

·························································································

4

6

试验报告

······························································································

4

附录A(资料性)

四点弯曲试验中的失效模式

·······················································

6

A.1

总则

·····························································································

6

A.2

失效模式

························································································

6

参考文献

··································································································

8

GB/T44514—2024/IEC62047﹘31:2019

前言

本文件按照GB/T1.1—2020《标准化工作导则第1部分:标准化文件的结构和起草规则》的规

定起草。

本文件等同采用IEC62047﹘31:2019《半导体器件微机电器件第31部分:层状MEMS材料界

面结合能的四点弯曲试验方法》。

本文件做了下列最小限度的编辑性改动:

—为与现有标准协调,将标准名称改为《微机电系统(MEMS)技术层状MEMS材料界面黏附

能四点弯曲试验方法》;

—为显示试验件原始状态,增加了图1a)试验前带有预制裂纹的试验件示意图,同时增加了压辊

和支承辊的说明。

请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。

本文件由全国微机电技术标准化技术委员会(SAC/TC336)提出并归口。

本文件起草单位:北京自动化控制设备研究所、合肥美的电冰箱有限公司、中机生产力促进中心有

限公司、北京晨晶电子有限公司、山东中康国创先进印染技术研究院有限公司、苏州大学、西安交通大

学、中国科学院空天信息创新研究院、深圳市速腾聚创科技有限公司、无锡华润上华科技有限公司、安

徽奥飞声学科技有限公司、航天长征火箭技术有限公司、天津新智感知科技有限公司、华东电子工程研

究所(中国电子科技集团公司第三十八研究所)、山东中科思尔科技有限公司、苏州和林微纳科技股份

有限公司、明石创新(烟台)微纳传感技术研究院有限公司。

本文件主要起草人:王永胜、曹诗亮、尚克军、李根梓、刘韧、汤一、毛志平、孙立宁、王志广、

陈德勇、杨旸、要彦清、张鲁宇、鲁毓岚、张新伟、安志武、郑冬琛、路文一、陈得民、张红旗、

商艳龙、李帆雅、钱晓晨、高峰。

GB/T44514—2024/IEC62047﹘31:2019

微机电系统(MEMS)技术

层状MEMS材料界面黏附能四点弯曲

试验方法

1范围

本文件描述了基于断裂力学概念的四点弯曲测量方法,利用作用在层状MEMS材料上的纯弯曲力

矩,以最弱界面稳态开裂的临界弯曲力矩来测量界面黏附能。

本文件适用于在半导体基底上沉积薄膜层的MEMS器件。薄膜层总厚度宜小于支撑基底(通常是硅

晶片)厚度的1/100。

2规范性引用文件

本文件没有规范性引用文件。

3术语、定义、符号和名称

3.1术语和定义

下列术语和定义适用于本文件。

3.1.1

能量释放率energyreleaserate

G

在裂纹增长过程中释放的单位表面积的应变能。

注:能量释放率被认为是裂纹驱动力,单位为焦耳每平方米(J/m2)。

3.1.2

界面黏附能interfacialadhesionenergy

Gc

当界面裂纹开始增长并沿界面稳定扩展时的能量释放率。

温馨提示

  • 1. 本站所提供的标准文本仅供个人学习、研究之用,未经授权,严禁复制、发行、汇编、翻译或网络传播等,侵权必究。
  • 2. 本站所提供的标准均为PDF格式电子版文本(可阅读打印),因数字商品的特殊性,一经售出,不提供退换货服务。
  • 3. 标准文档要求电子版与印刷版保持一致,所以下载的文档中可能包含空白页,非文档质量问题。

评论

0/150

提交评论