单输出与门-MC74VHC1G08DFT2G完整文件

May,2015−Rev.21

MC74VHC1G08/D

MC74VHC1G08

Single2-InputANDGate

TheMC74VHC1G08isanadvancedhighspeedCMOS2−inputANDgatefabricatedwithsilicongateCMOStechnology.

Theinternalcircuitiscomposedofmultiplestages,includingabufferoutputwhichprovideshighnoiseimmunityandstableoutput.

TheMC74VHC1G08inputstructureprovidesprotectionwhen

voltagesupto7.0Vareapplied,regardlessofthesupplyvoltage.This allowstheMC74VHC1G08tobeusedtointerface5.0Vcircuitsto

3.0Vcircuits.

Features

HighSpeed:tPD=3.5ns(Typ)atVCC=5.0V

LowPowerDissipation:ICC=1.0µA(Max)atTA=25C

PowerDownProtectionProvidedonInputs

BalancedPropagationDelays

PinandFunctionCompatiblewithOtherStandardLogicFamilies

ChipComplexity:FETs=62

TheseDevicesarePb−FreeandareRoHSCompliant

NLVPrefixforAutomotiveandOtherApplicationsRequiringUniqueSiteandControlChangeRequirements;AEC−Q100QualifiedandPPAPCapable

SC−88A/SOT−353/SC−70DFSUFFIX

CASE419A

TSOP−5/SOT−23/SC−59DTSUFFIX

CASE483

V2 =DeviceCodeM =DateCode*

MARKING

DIAGRAMS

V2M■

■

M

5

1

5

V2M■

■

1

INB

INA

GND

Inputs

Output

A

B

Y

L

L

L

L

H

L

H

L

L

H

H

H

Figure1.Pinout(TopView)

■ =Pb−FreePackage

4

3

2

5

1

(Note:Microdotmaybeineitherlocation)

*DateCodeorientationand/orpositionmayvarydependinguponmanufacturinglocation.

PINASSIGNMENT

1

INB

2

INA

3

GND

4

OUTY

5

VCC

VCC

OUTY

FUNCTIONTABLE

&

INA

INB OUTY

Figure2.LogicSymbol

ORDERINGINFORMATION

Seedetailedorderingandshippinginformationinthepackage

dimensionssectiononpage

4

ofthisdatasheet.

SemiconductorComponentsIndustries,LLC,2015

1 PublicationOrderNumber:

MC74VHC1G08

PAGE

2

MAXIMUMRATINGS

Symbol

Parameter

Value

Unit

VCC

DCSupplyVoltage

-0.5to+7.0

V

VIN

DCInputVoltage

−0.5to+7.0

V

VOUT

DCOutputVoltage

-0.5toVCC+0.5

V

IIK

DCInputDiodeCurrent

−20

mA

IOK

DCOutputDiodeCurrent

20

mA

IOUT

DCOutputSinkCurrent

12.5

mA

ICC

DCSupplyCurrentperSupplyPin

25

mA

TSTG

StorageTemperatureRange

-65to+150

C

TL

LeadTemperature,1mmfromCasefor10Seconds

260

C

TJ

JunctionTemperatureUnderBias

+150

C

OJA

ThermalResistance SC70−5/SC−88A(Note

1)

TSOP−5

350

230

C/W

PD

PowerDissipationinStillAirat85C SC70−5/SC−88ATSOP−5

150

200

mW

MSL

MoistureSensitivity

Level1

FR

FlammabilityRating OxygenIndex:28to34

UL94V−0@0.125in

VESD

ESDWithstandVoltage HumanBodyModel(Note

2)

MachineModel(Note

3)

ChargedDeviceModel(Note

4)

>2000

>200

N/A

V

ILATCHUP

LatchupPerformance AboveVCCandBelowGNDat125C(Note

5)

500

mA

StressesexceedingthoselistedintheMaximumRatingstablemaydamagethedevice.Ifanyoftheselimitsareexceeded,devicefunctionalityshouldnotbeassumed,damagemayoccurandreliabilitymaybeaffected.

MeasuredwithminimumpadspacingonanFR4board,using10mm−by−1inch,2−ouncecoppertracewithnoairflow.

TestedtoEIA/JESD22−A114−A.

TestedtoEIA/JESD22−A115−A.

TestedtoJESD22−C101−A.

TestedtoEIA/JESD78.

DeviceJunctionTemperatureversusTimeto0.1%BondFailures

FAILURERATEOFPLASTIC=CERAMIC

UNTILINTERMETALLICSOCCUR

1

RECOMMENDEDOPERATINGCONDITIONS

Symbol

Characteristics

Min

Max

Unit

VCC

DCSupplyVoltage

2.0

5.5

V

VIN

DCInputVoltage

0.0

5.5

V

VOUT

DCOutputVoltage

0.0

VCC

V

TA

OperatingTemperatureRange

−55

+125

C

tr,tf

InputRiseandFallTime VCC=3.3V0.3V

0

100

ns/V

VCC=5.0V0.5V

0

20

NORMALIZEDFAILURERATE

TJ=130CTJ=120C

TJ=110C

TJ=100C

TJ=90C

TJ=80C

JunctionTemperatureC

Time,Hours

Time,Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1 10 100 1000

TIME,YEARS

Figure3.FailureRatevs.TimeJunctionTemperature

DCELECTRICALCHARACTERISTICS

Symbol

Parameter

TestConditions

VCC(V)

TA=25°C

TA::;85°C

-55°Cto125°C

Unit

Min

Typ

Max

Min

Max

Min

Max

VIH

MinimumHigh−LevelInputVoltage

2.0

3.0

4.5

5.5

1.5

2.1

3.15

3.85

1.5

2.1

3.15

3.85

1.5

2.1

3.15

3.85

V

VIL

MaximumLow−LevelInputVoltage

2.0

3.0

4.5

5.5

0.5

0.9

1.35

1.65

0.5

0.9

1.35

1.65

0.5

0.9

1.35

1.65

V

VOH

MinimumHigh−LevelOutputVoltage

VIN=VIHorVIL

VIN=VIHorVIL

IOH=−50µA

2.0

3.0

4.5

1.9

2.9

4.4

2.0

3.0

4.5

1.9

2.9

4.4

1.9

2.9

4.4

V

VIN=VIHorVIL

IOH=−4mAIOH=−8mA

3.0

4.5

2.58

3.94

2.48

3.80

2.34

3.66

VOL

MaximumLow−LevelOutputVoltage

VIN=VIHorVIL

VIN=VIHorVIL

IOL=50µA

2.0

3.0

4.5

0.0

0.0

0.0

0.1

0.1

0.1

0.1

0.1

0.1

0.1

0.1

0.1

V

VIN=VIHorVIL

IOL=4mAIOL=8mA

3.0

4.5

0.36

0.36

0.44

0.44

0.52

0.52

IIN

MaximumInputLeakageCurrent

VIN=5.5VorGND

0to5.5

0.1

1.0

1.0

µA

ICC

MaximumQuiescentSupplyCurrent

VIN=VCCorGND

5.5

1.0

10

40

µA

ACELECTRICALCHARACTERISTICSInputtr=tf=3.0ns

Symbol

Parameter

TestConditions

TA=25C

TA85C

−55TA125C

Unit

Min

Typ

Max

Min

Max

Min

Max

tPLH,tPHL

MaximumPropaga-tionDelay,

InputAorBtoY

VCC=3.30.3V CL=15pF

CL=50pF

4.1

5.9

8.8

12.3

10.5

14.0

12.5

16.5

ns

VCC=5.00.5V CL=15pF

CL=50pF

3.5

4.2

5.9

7.9

7.0

9.0

9.0

11.0

CIN

MaximumInputCa-pacitance

5.5

10

10

10

pF

CPD

PowerDissipationCapacitance(Note

6)

Typical@25C,VCC=5.0V

pF

11

CPDisdefinedasthevalueoftheinternalequivalentcapacitancewhichiscalculatedfromtheoperatingcurrentconsumptionwithoutload.Averageoperatingcurrentcanbeobtainedbytheequation:ICC(OPR)=CPD•VCC•fin+ICC.CPDisusedtodeterminetheno−loaddynamicpowerconsumption;PD=CPD•VCC2•fin+ICC•VCC.

InputAorB

50%

50%VCC

tPLH

tPHL

50%VCC

GND

INPUT

VCC

CL*

OUTPUT

OutputY

VOHVOL

*Includesallprobeandjigcapacitance.

A1−MHzsquareinputwaveisrecommendedforpropagationdelaytests.

Figure4.SwitchingWaveforms Figure5.TestCircuit

DEVICEORDERINGINFORMATION

Device

Package

Shipping†

MC74VHC1G08DFT1G

SC70−5/SC−88A/SOT−353

(Pb−Free)

3000/Tape&Reel

NLVVHC1G08DFT1G*

MC74VHC1G08DFT2G

NLVVHC1G08DFT2G*

MC74VHC1G08DTT1G

SOT23−5/TSOP−5/SC59−5

(Pb−Free)

NLV74VHC1G08DTT1G*

†Forinformationontapeandreelspecifications,includingpartorientationandtapesizes,pleaserefertoourTapeandReelPackagingSpecificationsBrochure,BRD8011/D.

*NLVPrefixforAutomotiveandOtherApplicationsRequiringUniqueSiteandControlChangeRequirements;AEC−Q100QualifiedandPPAPCapable.

MC74VHC1G08

PACKAGEDIMENSIONS

PAGE

5

SC−88A(SC−70−5/SOT−353)

CASE419A−02ISSUEK

A

G

S

D5PL

3

4

2

1

5

−B−

NOTES:

DIMENSIONINGANDTOLERANCINGPERANSIY14.5M,1982.

CONTROLLINGDIMENSION:INCH.

419A−01OBSOLETE.NEWSTANDARD

419A−02.

C

H

N

J

K

DIM

INCHES

MILLIMETERS

MIN

MAX

MIN

MAX

A

0.071

0.087

1.80

2.20

B

0.045

0.053

1.15

1.35

C

0.031

0.043

0.80

1.10

D

0.004

0.012

0.10

0.30

G

0.026BSC

0.65BSC

H

0.004

0.10

J

0.004

0.010

0.10

0.25

K

0.004

0.012

0.10

0.30

N

0.008REF

0.20REF

S

0.079

0.087

2.00

2.20

0.2(0.008)M

BM

DIMENSIONSAANDBDONOTINCLUDEMOLDFLASH,PROTRUSIONS,ORGATEBURRS.

MC74VHC1G08

PACKAGEDIMENSIONS

TSOP−5CASE483−02ISSUEH

NOTE5

D

BS

L

G

A

5 4

1 23

T

0.10

0.20

C

AB

5X

2X

0.20

T

2X

C

H

T

0.05

SEATINGPLANE

K

M

DETAILZ

DETAILZ

J

NOTES:

DIMENSIONINGANDTOLERANCINGPERASMEY14.5M,1994.

CONTROLLINGDIMENSION:MILLIMETERS.

MAXIMUMLEADTHICKNESSINCLUDESLEADFINISHTHICKNESS.MINIMUMLEADTHICKNESSISTHEMINIMUMTHICKNESSOFBASEMATERIAL.

DIMENSIONSAANDBDONOTINCLUDEMOLDFLASH,PROTRUSIONS,ORGATEBURRS.

DIM

MILLIMETERS

MIN

MAX

A

3.00BSC

B

1.50BSC

C

0.90

1.10

D

0.25

0.50

G

0.95BSC

H

0.01

0.10

J

0.10

0.26

K

0.20

0.60

L

1.25

1.55

M

0°

10°

S

2.50

3.00

OPTIONALCONSTRUCTION:ANADDITIONALTRIMMEDLEADISALLOWEDINTHISLOCATION.TRIMMEDLEADNOTTOEXTENDMORETHAN0.2FROMBODY.

SOLDERINGFOOTPRINT*

1.9

0.074

0.950.037

2.4

1.0

0.039

0.094

0.7

0.028

SCALE10:1

mminches

( )

*ForadditionalinformationonourPb−Freestrategyandsolderingdetails,pleasedownloadtheONSemiconductorSolderingandMountingTechniquesReferenceManual,SOLDERRM/D.

ONSemiconductorand

areregisteredtrademarksofSemiconductorComponentsIndustries,LLC(SCILLC).SCILLCownstherightstoanumberofpatents,trademarks,

copyrights,tradesecrets,andotherintellectualproperty.AlistingofSCILLC’sproduct/patentcoveragemaybeaccessedat

/site/pdf/Patent−Marking.pdf

.SCILLCreservestherighttomakechangeswithoutfurthernoticetoanyproductsherein.SCILLCmakesnowarranty,representationorguaranteeregardingthesuitabilityofitsproductsforanyparticularpurpose,nordoesSCILLCassumeanyliabilityarisingoutoftheapplicationoruseofanyproductorcircuit,andspecificallydisclaimsanyandallliability,includingwithoutlimitationspecial,consequentialorincidentaldamages.“Typical”parameterswhichmaybeprovidedinSCILLCdatasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime.Alloperatingparameters,including“Typicals”mustbevalidatedforeachcustomerapplicationbycustomer’stechnicalexperts.SCILLCdoesnotconveyanylicenseunderitspatentrightsnortherightsofothers.SCILLCproductsarenotdesigned,intended,orauthorizedforuseascomponentsinsystemsintendedforsurgicalimplantintothebody,orotherapplicationsintendedtosupportorsustainlife,orforanyotherapplicationinwhichthefailureoftheSCILLCproductcouldcreateasituationwherepersonalinjuryordeathmayoccur.ShouldBuyerpurchaseoruseSCILLCproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdSCILLCanditsofficers,employees,subsidiaries,affiliates,anddistributorshar