SMD-PFMEA模板中英文版

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,,,,,,,,,,,,,,,,,,

ProcessPotentialFailureModeandEffectsAnalysis,,,,,,,,,,,,,,,,,

过程潜在的失效模式及后果分析（PFMEA),,,,,,,,,,,,,,,,,

FMEANumber：,,,,,Item：,,,,,,PAGE：,,,,,,

FMEA编号：,FMEA-P-1335,,,,项目：NCO-0024(TW-1335)SMD,,,,,,"页码：第1页,共5页",,,,,,

TWMode/Rev:,,,,,CustomerModel/Rev:,,,,,,ProcessResponsibility:,,,,,,

公司型号/版本：TW-1335/L,,,,,"客户型号/版本：

",NetcomNo.5462(1A)/MotorolaNo.0114981F01(A),,,,,过程责任：SMDPDQCQE,,,,,,

CoreTeam:,,,,,,,,,,,,,,,,,

核心小组：,,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,

AMENDMENTHISTORY文件修改记录,,,,,,,,,,,,,,,,,

REV.NO.,,AMENDMENTDESCRIPTION,,,,,,,PREPAREDBY/DEPT.,,,,DATE,,,,

版本号,,修改内容,,,,,,,制作者/部门,,,,日期,,,,

A,,Released,,,,,,,江海峰/PIE,,,,15-10月-08,,,,

B,,增加FMEA封面及更新RPN要求,,,,,,,江海峰/PIE,,,,23-11月-09,,,,

,,,,,,,,,,,,,,,,,,

ProcessFunctions/Requirements过程功能/要求,PotentialFailureMode潜在失效模式,PotentialEffect(s)ofFailure潜在失效后果,"Severity

严重度

(S)",Level级别,PotentialCause(s)Mechanism(s)ofFailure潜在失效起因/机理,"Occurrrence

频度(O)","CurrentProcessControlsPrevent

现行过程控制

预防","CurrentProcessControlsDetectability

现行过程控制

探测","

探测度

(D)",风险顺序数(RPN),"RecommendedAction(s)

建议的措施","Responsibility&

CompletionDate

责任部门/

完成日期",ActionsResults措施结果,,,,

,,,,,,,,,,,,,ActionsTaken采取的措施,S,O,D,RPN

"Solderpasteprinting

刷锡膏","Solderpastemisalignmentwithpads.

锡膏与焊盘偏位","Dryjoint.

假焊",7,,"Improperadjustingtheequipment.

设备调试不良",4,"OrientthestencilandPCB.

钢网和PCB板定位","Firstarticleinspection,andIPQCsamplingcheckperiodically.

首件确认，定期抽检",3,84,"

IPQCusedmagnifiertodothesamplinginspectionevery2hours,adjusttheequipmentwhenIPQCfoundsodlerpasteprintednotgood.","PIE

2008-12-26","

IPQCusedmagnifiertodothesamplinginspectionevery2hours,adjusttheequipmentwhenIPQCfoundsodlerpasteprintednotgood.",7,1,3,21

,"Excesssolderpaste.

锡膏太多","Componentsshortcircuited.

元件短路",6,,"Improperadjustingtheequipment.

设备调试不良",3,"MeasureandcontrolsolderpastethicknessanddrawXbar-Rchart.

用锡膏厚度仪进行测试并绘制Xbar-R图进行控制",,3,54,None,,,,,,

,"Insufficientsolderpaste.

锡膏太少","Dryjointandinsufficientsoldering.

假焊，少锡",6,,"Improperadjustingtheequipment.

设备调试不良",4,,,3,72,由印刷员每2小时增加锡膏1次Addthesolderpasteonetimeeverytwohoursbyoperator.,"PIE

2008-12-26",由印刷员每2小时增加锡膏1次Addthesolderpasteonetimeeverytwohoursbyoperator.,6,2,2,24

,"Solderingpasteinvalidated.

锡膏失效","Dryjoint,insufficientsolder,andsolderingball.

假焊、冷焊、锡珠",4,,"Operator'scarelessness.

人为疏忽",3,"Controlexpirydate,storagetemperatureandre-warmtime.

控制有效期、储存温度和回温时间",,4,48,None,,,,,,

,"Soldersplash

锡飛濺","Shorts

產生短路",5,,"Stencilcleanliness

模版清潔/幹淨情況",1,"CleanstencileveryPCB

在每次印完印制電路板後清潔模版",,7,35,,,,,,,

,"Solderingbridge.

锡膏连锡","Shortcircuit

電路產生短路",7,,"Operator'scarelessness,ormachinenotstable.

人为疏忽，机器异常",2,"Autoprintthesolderpaste.

自动刷锡膏",,4,56,None,,,,,,

"Chipmounting

贴片","Wrongcomponentusedandmissingcomponent.

元件错贴、漏贴","Apartoffunctionfailure.

产品部分功能失效",8,,"Operator'scarelessness,ormachinenotstable.

人为疏忽，机器异常",3,"Periodicallyanddailydoequipmentmaintenance.

定期保养、检修设备","Firstarticleinspection,IPQCsamplinginspection,self-checkbyoperators.

首件确认，定期抽检、自检",3,72,"

1.IPQCconfirmthematerialsaddedrecordandsignintherecordwhenaddedmaterials.

2.Checkthenozzleperiodically(definethefrequency)","PIE

2008-12-26","

1.IPQCconfirmthematerialsaddedrecordandsignintherecordwhenaddedmaterials.

2.Checkthenozzleperiodically(definethefrequency)",8,1,3,24

,"Misalignmentandsolderingpointoutoffrompads.

元件焊点偏移焊盘超出规格。","Shortcircuit.

元件与元件短路",7,,"Improperadjustingtheequipment.

设备调试不良",3,,,3,63,"

Do100%visualinspectionwithmagnifierbeforereflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.","PIE

2008-12-26","

Do100%visualinspectionwithmagnifierbeforereflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.",7,1,3,21

,,"Componentmisalignwiththepads.

零件贴歪，焊点脱离焊盘",7,,"Improperadjustingtheequipment.

设备调试不良",3,,,3,63,"

Dothe100%visualinspectionwithmagnifierbeforereflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.","PIE

2008-12-26","

Dothe100%visualinspectionwithmagnifierbeforereflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.",7,1,3,21

,"Componentwrongorientationmounted.

元件极性反","Apartoffunctionfailure.

产品功能失效",8,,"Operator'scarelessness,ormachinenotstable.

人为疏忽，机器异常",2,,,3,48,None,,,,,,

,"Incorrectprogramselected.

程序选错","Functionfailure

功能失效",8,,"Operator'scarelessness.

人为疏忽",2,"Controltheprogram.

程序控制","Firstarticleinspection.

首件确认",4,64,按照工作指示选取程序。RequiringoperatortoselectprogramaccordingtoWIN.ApprovedtoproductuntilprogramisconformedOKbyIPQC.,"PIE

2008-12-26",按照工作指示选取程序。RequiringoperatortoselectprogramaccordingtoWIN.ApprovedtoproductuntilprogramisconformedOKbyIPQC.,8,1,4,32

,"Impropersetting.

参数设定错误","Functionfailure

功能失效",8,,"Operator'scarelessness.

人为疏忽",2,"SetallparametersbySMTEngineer.

由工程师进行设定","Firstarticleinspection.

首件确认",4,64,由工程师每2小时检查设置的参数1次Checksetedparameteronetimeevery2hoursbysmtengineer,"PIE

2008-12-26",由工程师每2小时检查设置的参数1次Checksetedparameteronetimeevery2hoursbysmtengineer,8,2,2,32

"IRoven

过回流焊","Solderbridge.

连锡","Partialfunctionalfailure.

部分功能失效",7,,"Operator'scarelessness,ormachinenotstable.

人为疏忽，机器异常",2,"Automaticallycontrolledwithtemperaturesensor.Periodicalequipmentmaintenance.

自动化，程序控制，定期检查、保养、检修设备","Firstarticleinspection.Self-check.100%inspectionbyQC,andsamplingcheckbyIPQC.

自检，首件确认，QC全检，IPQC定期抽检",4,56,None,,,,,,

,"Solderbead.

锡珠、锡碎","Shortcircuit.

导致短路",6,,"Improperadjustingtheequipment.

设备调试不良",2,,,2,24,None,,,,,,

,"Erectcomponent.

立件","Partialfunctionalfailure.

部分功能失效",8,,"Improperadjustingtheequipment.

设备调试不良",2,,,4,64,"

Do100%visualinspectionwithmagnifierafterreflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.","PIE

2008-12-26","

Do100%visualinspectionwithmagnifierafterreflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.",8,1,3,24

,"Insufficientsoldering.

少锡","Reliabilityreduced.

产品可靠性降低",7,,"Mal-operationofoperator.

刷锡膏人员操作疏忽",2,,,4,56,None,,,,,,

,"Dryjoint.

假焊","Reliabilityreducedorpartialfunctionfailure.

产品部分功能失效或可靠性降低",6,,"Improperadjustingtheequipment.

设备调试不良",3,,,4,72,"

Do100%visualinspectionwithmagnifierafterreflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.","PIE

2008-12-26","

Do100%visualinspectionwithmagnifierafterreflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.",6,1,4,24

,"Misalignment.

偏移","Dryjointorshortcircuited.

元件假焊或短路",7,,"Improperadjustingtheequipment.

设备调试不良",2,,,4,56,None,,,,,,

,"Missingcomponent.

掉件","Partialfunctionfailure.

产品部分功能失效",8,,"Operator'scarelessness.

人为疏忽",3,,,3,72,"

Dothe100%visualinspectionwithmagnifierafterreflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.","PIE

2008-12-26","

Dothe100%visualinspectionwithmagnifierafterreflow.InformSMDengineertoadjusttheequipmentwhenabnormityhappen.",8,1,3,24

,"*Incorrectprogramselected.

程序选错","Functionfailure

功能失效",8,,"Operator'scarelessness.

人为疏忽",2,"Controltheprogram.

程序控制","Firstarticleinspection.

首件确认",4,64,按照工作指示选取程序。RequiringoperatortoselectprogramaccordingtoWIN.ApprovedtoproductuntilprogramisconformedOKbyIPQC.,"PIE

2009-11-23",按照工作指示选取程序。RequiringoperatortoselectprogramaccordingtoWIN.ApprovedtoproductuntilprogramisconformedOKbyIPQC.,8,1,3,24

,"Impropersetting.

参数设定错误","Partialfunctionfailureandpoorsoldering.

部分功能失效，焊接质量差",6,,"Operator'scarelessness.

人为疏忽",2,"SetallparametersbySMTengineer.

由工程师进行设定","Firstarticleinspectionandconfirmtemperatureprofile.

首件确认、温度曲线确认。",4,48,None,,,,,,

"Touchup

执锡","Temperatureistoohigh.

温度太高。","Thermalshockdamagethecomponents.

元件受高温损伤。",8,,Improperadjustingtheequipmentcausedbyoperator'scarelessness.人员疏忽设定错误,2,"1.SetallparameterbyIPQC.2.Xbar-Rchartcontrol.

由IPQC设定参数；Xbar-R图进行监测。","1.RoutinelyinspectedbyIPQCtwotimeseveryday.2.Firstarticleinspectiontoconfirmsolderingeffect.

1.IPQC每天检查2次；2.首件确认焊后效果",4,64,IPQC每2小时检查温度1次。Inspectingonetimeevery2hoursbyIPQC,"PIE

2008-12-26",IPQC每2小时检查温度1次。Inspectingonetimeevery2hoursbyIPQC,8,1,2,16

,"Temperatureistoolow.

温度太低。",Nonconformingsolderingjoints.上锡不良,6,,Improperadjustingtheequipmentcausedbyoperator'scarelessness.人员疏忽设定错误,2,,,4,48,None,,,,,,

"Remark:

S:Severity,O:Occurrence,D:Detection1~2=Remote,3~4=Low,5~6=Moderate,7~8=High,9~10=VeryHigh

RPN:RiskPriorityNumber=S*O*D.

IfS,OorD≥9，orRPN>60,havetotakecorrectiveactiontopreventthefailure.",,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,

Packing包装,Packingquantitynotcorrect.数量不正确,Customercomplaint.客户投诉,7,,Missquantitywhenpacking.包装时漏装产品,2,TrainoperatorstooperateaccordingtoWI.培训员工，按工作指示，标准化,InspectedbyQC，Weightbyhousekeeper.QA检查，货仓称重量,4,56,None,,,,,,

,Labelcontentnotcorrect.标贴内容错误,Customercomplaint.客户投诉,7,,"1.Notproperlysetparameterswhenprintinglabels.打印标贴时设定错误

2.Wronglabelusedwhenlabelling.贴标贴时贴错",2,TrainoperatorstooperateaccordingtoWI.培训员工依工作指示作业。,Self-inspectedbyoperators.100%QCinspection.SamplingcheckedbyQA.员工自检、QC100%检查，QA抽检。,4,56,None,,,,,,

,Labelismissing漏贴标贴,Customercomplaint.客户投诉,8,,1.Missedtostickthelabelduetothe'scarelessness.员工疏忽漏贴标贴2.QCmissedtocheck.QC漏检,4,Trainoperatorstostrengthenoperators'selfcheckingabrility.培训员工，加强员工自检力度。,"QC100%inspectionandwroteon""TC""cardinaccordance.QC100%检查，且要在TC卡上作相应记录。",4,128,AddphototoexplainthelocationinWI.工作指示中加以图片说明，且标明位置。,QualityAssuranceDept;PIEDept.品保部、PIE部,Haveimplemented.已执行,8,1,4,32

,SeriesNo.repeated.序列号重复,Customercomplaint.客户投诉,8,,1.Wrongprinted.打印错误2.Theoperatorcheckscarelessly.人员检查疏忽,4,Addthecomputerscanner增加电脑扫描仪,100%scanbyQC.QC100%扫描,4,128,AddthecomputerscannerandQC100%insprction.增加电脑扫描仪，要求QC100%扫描。,QualityAssuranceDept;PIEDept.品保部、PIE部,Haveimplemented.已执行,8,1,4,32

Store仓储,Cartonboxdamagedanddistorted.外箱变形.,1.Productsnotkeptinorder.2.Damagetoproductappearance.3.Damagetocomponents.外观损伤；零件碰弯或歪斜,6,,Toomanylayersstackedtogether.外箱堆压过多.,2,Trainoperatorsandlimitnumberoflayerswhichcanbestacked.人员培训；限制堆积层数,Self-inspectionbyhousekeeper.QAinspection.仓管员自检，QA检查。,3,36,None,,,,,,

,Cartonboxabsorbingmoisture.外箱潮湿.,Potentialfunctionfailure隐患性功能不良,7,,Storingconditionsoutofcontrol.仓储条件不正确.,2,Dehumidifywithadrier.增加除湿机.,Dailytemperatureandhumiditytestandcontrol每日温湿度测试和控制.,3,42,None,,,,,,

Shipment出货,The)physicalgoodsshippedoutnotmatchingshippingorder.出货实物与要求不符。,Customercomplaint.客户投诉,7,,operators'smal-operation.人员操作失误,1,,SamplinginspectionbyQAinspectorforeverydeliverylot.QA每批抽样检查,4,28,None,,,,,,

"Remark:

1.Explainrisk:

S:Severity,O:Occurrence,D:Detection.Rating:1~2=Remote,3~4=Low,5~6=Moderate,7~8=High,9~10=VeryHigh

RPN:RiskPriorityNumber=S*O*D.

IfS,OorD≥9,orRPN≥60,havetotakecorrectiveactiontopreventthepotentialfailure.

2.Thenotation""★""denotesspecialcharacteristics,shallstrengthcontrol.",,,,,,,,,,,,,,,,,

,,,,,,,,,,,,,,,,,,

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SMD-PFMEA模板中英文版

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