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VibrationandNoiseDesignof

AdvancedTechnologyFacilitiesAhmadBayat,P.E.J.ByronDavisVibro-AcousticConsultants29June20041VibrationandNoiseDesignofAdvancedTechnologyFacilitiesBriefbackgroundonVACCVibrationDesignofFacilitiesProblemDefinitionTwoDesignFundamentalsNoiseDesignofFacilitiesToolHook-UpStructuralEvaluation2BackgroundonVACCOurbackground3WesternU.S.:IntelFabsLCE,C6,11,12,22,23;SandiaNat’lLabs;HPFortCollins;MotorolaCOM1,MOS12,andFlatPanel;MicronLehi,Boise,andMaskShop;Atmel;Vitesse;PhilipsFab25;Microchip(Phoenix);NCR

Projects–UnitedStatesTexas:Atmel;MotorolaULSI/MOS13;TIDMOS5,DMOS6,KilbyCenter;AMDFab25;Samsung;MethodistHeartCenter(Lubbock)EastCoast:IBM(Burlington,EastFishkill);Dominion

Semiconductor;Lucent(Orlando);Seagate(Pitts.);Nat’lSecurityAgency(Ft.Meade)4California:IntelFabsD2,SC1,SC2,andIMO;StanfordUniversity;AMATBldg.s2,3,92,ArquesCenter,ScottCampus;IBMSanJose;IDT;LAM

Research;Vishay/

Siliconix;National

Semiconductor;Linear

Technology;AT&T;UCCampusesatBerkeley,Davis,andSanFrancisco;Lawrence

BerkeleyNationalLabs;Lawrence

LivermoreNat’lLabs/NationalIgnitionFacility;Projects–USWestCoastPacificNorthwest:IntelFabsD1B,D1C,RB1,15,andPathfinder;Hyundai;WaferTechCamus;FujitsuGresham;LSILogic;IDTMASCA;Maxim;SeattleFerryTerminal;UniversityofWashington

CalPolySanLuisObispo;International

Rectifier;UCIrvine;STMicroelectronics5Projects–SoutheastAsiaTaiwan,R.O.C.:TSMCFabs3,6,and7;WaferTech;QuantaTFT;Arima;Formosa;Nan

YaFabs1and3;Winbond;Formosa;Macronix;OPTOFab;AMATTaiwan;EagleTFTFab;UMC;PowerchipFab2;Acer;ChunghwaPictureTube;NanYa/InoteraChina:MotorolaTianjinMOS17,MOS17-XKorea:CTISKorea;AMATKoreaThailand:SMTMalaysia:WTM/SilterraSingapore:STMicroelectronicsAMK86Projects–EuropeScotland:MotorolaEastKillbrideIreland:IntelFabs10,24Italy:STMicroelectronicsCataniaM6France:STMicroelectronics

Rousset7ProblemDefinition:ProcessesBasicResearchUniversities,NationalLabsCorporateR&DSemiconductors,DevicesFlatPanelDisplayTechnologiesPharmaceuticals,BiotechnologyNanotechnologyMatureProcessesDevelopingProcessesManufacturingMicroelectronics,FlatPanelDisplaysPharmaceuticals,BiotechnologyToolsNanotechnology(comingsoon)VibrationDesignofAdvancedTechnologyFacilities8ProblemDefinition:WhyVibration?Submicronmanufacturing/R&D……usuallyinasuper-cleanenvironmentSensitivityvs.power:100/100ruleMarriageof“Beauty”and“Beast”VibrationDesignofAdvancedTechnologyFacilities9ProblemDefinition:Sources

Rotatingmachinery(tones/BB)–unknown

Piping/ductworkturbulence(BB)–unknown

Movementofpeople/materials(BB)–known

Environmentalsources–usuallyknownVibrationDesignofAdvancedTechnologyFacilities10Local&EnvironmentalSources11Tonesvs.Broadband“Tones”“BroadbandRandomExcitation”VibrationDesignofAdvancedTechnologyFacilities12Tonesvs.BroadbandttDeterministicSineWave(tone)FrequencyatShaftSpeedAmplitudeUnbalancedForceVibrationDesignofAdvancedTechnologyFacilities131/3OctaveBandDataDominatedby30Hz‘tone’Dominatedby60Hz‘tone’VibrationDesignofAdvancedTechnologyFacilities141/3OctaveBandvs.NarrowbandDataVibrationDesignofAdvancedTechnologyFacilities15ImportanceofTonesVibrationDesignofAdvancedTechnologyFacilities16ImportanceofTonesVibrationDesignofAdvancedTechnologyFacilities17ProblemDefinition:StructuresMegafabs(usually10,000+m2CR)Sub-fabs(one-&two-level),stackedfabsMostlyconcrete,mostlycast-in-placeStructuralisolationbreaks(SIBs)Accessfloorsfrom~150mmto1.7msecondarystructuresforsensitivetoolsSoilDynamicsVibrationDesignofAdvancedTechnologyFacilities18ProblemDefinition:Structures–FPD

FPDPanelSizeDrivingVibrationDesignVibrationDesignofAdvancedTechnologyFacilities

NewerGenerationsLargerSubstrates

Larger(Heavier)Tools

Larger(Longer)FabsFabFabFabFootprint19ProblemDefinition:Structures–FPD

FPDPanelSizeDrivingVibrationDesignVibrationDesignofAdvancedTechnologyFacilities

NewerGenerationsLargerSubstrates

Larger(Heavier)AMHSsPotentialProcessTool,AMHSGeneratedVibrationTraditionalVibrationRequirements(VCCurves)20ProblemDefinition:Structures–FPD

FPDProcessesDrivingVibrationDesignVibrationDesignofAdvancedTechnologyFacilities

DifferentiatedProcessesDifferentFunctionalAreas

DifferentVibrationCriteria

Multi-Level(Stacked)Fabs21ProblemDefinition:SensitivitiesVCcurvesRMSvelocityin1/3octavebands4to80HzThreedirectionsBroadbandrandomvibrationsEnvironmentalcontrol–toolprotectionVCcurvesvs.processtechnologyScannerdynamicstiffnessrequirementVibrationDesignofAdvancedTechnologyFacilities22GenericVibrationCriterionCurvesVC-C–500min/sWorkshop(ISO)–32,000min/sOffice(ISO)–16,000min/sOperatingTheater(ISO)–4,000min/sResidentialDay(ISO)–8,000min/sVC-A–2,000min/sVC-B–1,000min/sVC-D–250min/sVC-E–125min/sVibrationDesignofAdvancedTechnologyFacilities23Workshop(ISO)32,000min/secN/AOffice(ISO)16,000min/secN/AResidentialDay(ISO)8,000min/sec75micronsOperatingTheater(ISO)4,000min/sec25micronsVC

–

A2,000min/sec8micronsVC

–

B1,000min/sec3micronsVC

–

C500min/sec1micronVC

–

D250min/sec0.3micronsVC

–

E125min/sec0.1micronsCriterionCurveMaxLevelDetailSizeGenericVibrationCriterionCurvesVibrationDesignofAdvancedTechnologyFacilities24DynamicsofSteppersandScannersScannerMotionStepperMotionVibrationDesignofAdvancedTechnologyFacilities25TypicalVC-DFloorsVibrationDesignofAdvancedTechnologyFacilities26TypicalVC-EFloorsVibrationDesignofAdvancedTechnologyFacilities27TwoDesign

FundamentalsControlofVibrationSourcesStructural/FoundationDesignVibrationDesignofAdvancedTechnologyFacilities28DesignFundamentals:Structures

~30+HzforVC-D/VC-Efloors

Designforwalker,mechanicalexcitationVertical

Design

Bendingmodesoffabbays

Functionofbaysizes,waffledepth,etcDwLspanVibrationDesignofAdvancedTechnologyFacilities29FEAEvaluationExampleVibrationDesignofAdvancedTechnologyFacilities30Local&EnvironmentalSources31Local&EnvironmentalSources32Horizontal

DesignDesignFundamentals:Structures

Potentialforstrongcouplingtosoilmodes

~3–6Hz

Designforwalker,mechanicalexcitation

Shearwall+floordiaphragmrigidityglobalstructuralmodeVibrationDesignofAdvancedTechnologyFacilities33DesignFundamentals:Structures

Structural/FoundationDesignSIBsvs.soilPre-castvs.cast-in-placeVibrationDesignofAdvancedTechnologyFacilities34DesignFundamentals:SoilConditionSoilStiffness

SmallresponsetoforceinputsInefficientpropagationSIBsusuallymoreeffectiveLittletono“geometric”dampingBedrockLargeresponsetoforceinputsEfficientdistancepropagation(typicallylowdamping)SIBsusuallylesseffectiveWeakSoilIdealSoilCondition:Stifftoresistinput,butwithGood“geometric”dampingVibrationDesignofAdvancedTechnologyFacilities35DesignFundamentals:Sources

Inspectisolationsystemsafterinstallation

Usewell-specified,well-balancedequipment(15240)Fc

Ft

SpecifygoodisolationsystemsforequipmentF1F2

F1/10

Specifygoodisolationsystemsforpiping,ductworkF1F2

F1/10VibrationDesignofAdvancedTechnologyFacilities36Precast–CrossGirder37Precast–GirderSection38Precast–Top+BottomViews3