电子元器件封装图示大全_第1页
电子元器件封装图示大全_第2页
电子元器件封装图示大全_第3页
电子元器件封装图示大全_第4页
电子元器件封装图示大全_第5页
已阅读5页,还剩37页未读 继续免费阅读

下载本文档

版权说明:本文档由用户提供并上传,收益归属内容提供方,若内容存在侵权,请进行举报或认领

文档简介

...wd......wd......wd...电子元器件封装图示大全LQFP100LMETALQUAD100LPQFP100LQFP

QuadFlatPackageQFP

QuadFlatPackageTQFP100LRIMMRIMMForDirectRambusSBGASC-705LSDIPSIMM30SIMM30

PinoutSIMM30

SingleIn-lineMemoryModuleSIMM72SIMM72

PinoutSIMM72

SingleIn-lineMemoryModuleSIMM72

SingleIn-lineMemoryModuleSIP

SingleInlinePackageSLOT1

ForintelPentiumIIPentiumIII&CeleronCPUSLOTA

ForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSODIMM

SmallOutlineDualIn-lineMemoryModuleSO

SmallOutlinePackageSOCKET370

Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423

Forintel423pinPGAPentium4CPUSOCKET462/SOCKETA

ForPGAAMDAthlon&DuronCPUSOCKET7

ForintelPentium&MMXPentiumCPUSOHSOJ32LSOJSOPEIAJTYPEII14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP16LSSOPSocket603

FosterLAMINATETCSP20L

ChipScalePackageTO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOP

ThinSmallOutlinePackageTSSOPorTSOPII

ThinShrinkOutlinePackageLAMINATEUCSP32L

ChipScalePackageuBGA

MicroBallGridArrayuBGA

MicroBallGridArray

VLBusVESALocalBusXTBus8bitZIPZig-ZagInlinePackageGullWingLeadsHSOP28ISA

IndustryStandardArchitectureITO220ITO3pJ-STDJ-STD

JointIPC/JEDECStandardsJEPJEP

JEDECPublicationsJESDJESD

JEDECStandardsJLCCLCCLDCCLGALLP8LaLQFPPCDIPPCI32bit5V

PeripheralComponentInterconnectPCI64bit3.3V

PeripheralComponentInterconnectPCMCIAPDIPPGA

PlasticPinGridArrayPLCCPQFPPS/2PS/2

mouseportpinoutPSDIPDIMM168DIMMDDRDIMM168

DualIn-lineMemoryModuleDIMM168DIMM168

PinoutDIMM184

ForDDRSDRAMDualIn-lineMemoryModuleDIP

DualInlinePackageDIP-tab

DualInlinePackagewithMetalHeatsinkEIAEIA

JEDECformulatedEIAStandardsEISA

ExtendedISA

FBGAFDIPFTO220FlatPackAC'97AC'97

v2.2specification

详细规格AGP3.3V

AcceleratedGraphicsPort

Specification2.0

详细规格AGPPRO

AcceleratedGraphicsPortPRO

Specification1.01

详细规格AGP

AcceleratedGraphicsPort

Specification2.0

详细规格AMR

Audio/ModemRiserAX078AX14C-BendLeadCERQUAD

CeramicQuadFlatPackCLCCCNR

CommunicationandNetworkingRiserSpecificationRevision1.2CPGA

CeramicPinGridArrayCeramicCaseLAMINATECSP112L

ChipScalePackage

BGA

BallGridArrayEBGA680LLBGA160LPBGA217L

PlasticBall

GridArraySBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserCPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO-220FlatPackHSOP-28ITO-220ITO-3PJLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackageTO252TO263/TO268QFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackageSOJ32LSOJSOPEIAJTYPEII14LSOT220SSOP16LTO247SSOPTO18TO220TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig-ZagInlinePackageBQFP132C-BendLeadCERQUADCeramicQuadFlatPackCeramicCaseLAMINATECSP112LChipScalePackageGullWingLeadsPDIPPLCCSNAPTKSNAPTKSNAPZPSOHAGP3.3V

AcceleratedGraphicsPort

Specification2.0

\o"详细的物理尺寸"详细规格AGPPRO

AcceleratedGraphicsPortPRO

Specification1.01

\o"详细的物理尺寸"详细规格AGP

AcceleratedGraphicsPort

Specification2.0

\o"详细的物理尺寸"详细规格AMR

Audio/ModemRiserAX078AX14BGA

BallGridArrayBQFP132EBGA680L

\o"详细的物理尺寸"详细规格LBGA160L

\o"详细的物理尺寸"详细规格PBGA217L

PlasticBallGridArray

\o"详细的物理尺寸"详细规格SBGA192L

\o"详细的物理尺寸"详细规格TEPBGA288LTEPBGA288L

\o"详细的物理尺寸"详细规格TSBGA680L

\o"详细的物理尺寸"详细规格C-BendLeadCERQUAD

CeramicQuadFlatPackCLCCCNR

CommunicationandNetworkingRiserSpecificationRevision1.2

\o"详细的物理尺寸"详细规格CPGA

CeramicPinGridArrayCeramicCaseLAMINATECSP112L

ChipScalePackage

\o"详细的物理尺寸"详细规格DIMM168

\o"详细的物理尺寸"详细规格DIMMDDR

\o"详细的物理尺寸"详细规格DIMM168

DualIn-lineMemoryModule

\o"详细的物理尺寸"详细规格DIMM168DIMM168

Pinout

\o"详细的物理尺寸"详细规格DIMM184

ForDDRSDRAMDualIn-lineMemoryModule

\o"详细的物理尺寸"详细规格DIP

DualInlinePackage

\o"详细的物理尺寸"详细规格DIP-tab

DualInlinePackagewithMetalHeatsinkEIAEIA

JEDECformulatedEIAStandardsEISA

ExtendedISA

\o"详细的物理尺寸"详细规格FBGAFDIPFTO220FlatPackGullWingLeadsHSOP28ISA

IndustryStandardArchitectureITO220ITO3pJ-STDJ-STD

JointIPC/JEDECStandardsJEPJEP

JEDECPublicationsJESDJESD

JEDECStandardsJLCCPCDIPPCI32bit5V

PeripheralComponentInterconnect

\o"详细的物理尺寸"详细规格PCI64bit3.3V

PeripheralComponentInterconnect

\o"详细的物理尺寸"详细规格PCMCIAPDIPPGA

PlasticPinGridArray

\o"详细的物理尺寸"详细规格PLCC

\o"详细的物理尺寸"详细规格PQFPPS/2PS/2

mouseportpinoutPSDIPLQFP100L

\o"详细的物理尺寸"详细规格METALQUAD100L

\o"详细的物理尺寸"详细规格PQFP100L

\o"详细的物理尺寸"详细规格QFP

QuadFlatPackageQFP

QuadFlatPackageTQFP100L

\o"详细的物理尺寸"详细规格SBGASC-705L

\o"详细的物理尺寸"详细规格SDIPSIMM30SIMM30

Pinout

\o"详细的物理尺寸"详细规格SIMM30

SingleIn-lineMemoryModuleSIMM72SIMM72

Pinout

\o"详细的物理尺寸"详细规格SIMM72

SingleIn-lineMemoryModuleSIMM72

SingleIn-lineMemoryModuleSIP

SingleInlinePackageSLOT1

ForintelPentiumIIPentiumIII&CeleronCPUSLOTA

ForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSODIMM

SmallOutlineDualIn-lineMemoryModuleSO

SmallOutlinePackageSOCKET370

Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423

Forintel423pinPGAPentium4CPUSOCKET462/SOCKETA

ForPGAAMDAthlon&DuronCPUSO

温馨提示

  • 1. 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。图纸软件为CAD,CAXA,PROE,UG,SolidWorks等.压缩文件请下载最新的WinRAR软件解压。
  • 2. 本站的文档不包含任何第三方提供的附件图纸等,如果需要附件,请联系上传者。文件的所有权益归上传用户所有。
  • 3. 本站RAR压缩包中若带图纸,网页内容里面会有图纸预览,若没有图纸预览就没有图纸。
  • 4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
  • 5. 人人文库网仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对用户上传分享的文档内容本身不做任何修改或编辑,并不能对任何下载内容负责。
  • 6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
  • 7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

评论

0/150

提交评论