PCB专业术语名词解释A50

线路板专业名词解释Tilt

e印制电路：printed

circuit印制线路：printed

wiring印制板：printed

board印制板电路：printed

circuit

board(pcb)印制线路板：printed

wiring

board(pwb)印制元件：printed

component印制接点：printed

contact印制板装配：printed

board

assembly板：board第一篇：

常用术语18.MI:

Manufacture

Instruction(制作指示).

ECN:

Engineering

Change

Notice(工程更改通知).MOR：Marketing

Order

ReleaseOC

:Order

Confirmation(定单).IPC

---

The

Institute

for

Interconnectingand

packaging

Electronic

Circuits(美国电子电路互连与封装协会)22.UL

:Underwrites’Laboratories(美国保险商实验所)ISO

--International

Standards

Organization国际标准化组织On

hold

and

Release

:暂停和释放SPEC

:specification客户规格书WIP:

Work

in

process

正在生产线上生产的

产品Gerber

file

:软件包Master

A/W

:客户原装菲林Net

list

:客户提供的表明开短路的文件HMLV

:High

Mixed

Low

Volume,多批少量31.TCN：

Temporary

Change

notice临时更改通知32.

ENIG

:

Electroless

Nickel

/Immersion

Gold(IPC-4552)33.

OSP

:

Organic

Surface

protectionIT

:

Immersion

TinIS:

Immersion

SilverHAL:

Hot

air

leveling第二篇：

有关材料Copper-clad

Laminate

:覆铜箔基材Prepreg:聚酯胶片FR-4(FlameRetardant-4):一种用玻璃布和环氧樹脂制造有阻燃性能的材料Solder

mask:阻焊剂Peelable

solder

mask:蓝胶Carbon

Ink:碳油Dry

film

:干膜RCC

:Resin

Coated

Copper(不含玻璃布)9.基材：base

material层压板：laminate覆金属箔基材：metal-clad

bade

material12、覆铜箔层压板：copper-clad

laminate

(ccl)13、单面覆铜箔层压板：single-sided

copper-cladlaminate14、双面覆铜箔层压板：double-sided

copper-cladlaminate15、复合层压板：composite

laminate16、薄层压板：thin

laminate17、金属芯覆铜箔层压板：metal

core

copper-cladlaminate18、金属基覆铜层压板：metal

base

copper-cladlaminate第三篇：有关工序1.

PTH:

(Plated

through

hoTHPA.Via

hole:通路孔。·作用：仅作为导通用（不作插件或焊接），如测试点和一般导通孔。le)电镀孔B.

IC

hole:插件孔。·作用：用于插件或焊接，也可导通内外层。2.

NPTH：·

作用：一般是作为装配零件的定位孔或工具孔。NP

HT·

(Non-plated

through

hole)非电镀孔3.

SMT/SMDSurface

Mounting

TechMST

nology:表面贴覆技术SMTPad:指在线路板表面帖覆焊接元件的Pad，包括QFP

(Quad

flat

pad)，2-Roll等。这些也是SMT

pad4.

BGA/CSP:BGA---Ball

Grid

ArrayCSP---

Chip

Scale

package·

说明：它们都是一种封装技术。在PCB上都表现为一VIA孔联了一个焊接PAD。PSC/AGBBGA

PadLineVia

Hole·

要求：一般BGA区域VIA孔要求塞孔5.

Fiducial

mark

:·

作用：装配时作为对位的标记·

说明：它是非焊接用的焊盘，通常为圆形或方形，有金属窗和绿油窗。almarkFiduci6.

Dummy

pattern(thief

pattern)：·

作用：使整块板的线路分布更均匀，从而提高图电质量和减少板的曲度和扭度。·

要求：通常以不影响线路为标准，一般为又有三种：圆形/方形----命名为“Dummy”网状----命名为“网状Dummy”铜皮------命名为“铜皮”Dumm

y7.无孔测试Pad：eT

tx

aP/d

rB

ae

ik

gnaT

b·

此类Pad仅供装配完后作为测试点，不装配零件。不包括SMT

PAD,BGA

PAD,Fiducial

mark

pad.8.

Breaking

Tab：·

印制板上无电气性能，在制作过程中用于加工具孔、定位孔或Dummy等的部分。与线路板主体部分相连处有折断孔或V-Cut。Breaking

TabV-CutThermal：(heat

shield）热隔离盘（大面积导电图形上，元件周围被蚀刻掉的部分）作用：它使在焊接时因截面过分散热而产生虚焊的可能性减少。Thermal/Clearance10.

Clearance：·

无铜空间（通常指铜皮上为孔开的无铜区域）11.

S/M

Bridge：S/Mbri阻焊桥（装配Pad间的阻焊条）·

作用gd

：防止焊接时Pad间被焊锡短路。eS/M

Bridge

Solder

mask

in

theseareasS/M

bridge12.Gold

finger：金手指·

说明：电镀金耐磨。一般金指的S/M

OPENING均为整体开窗。13.Key

slot：键槽·

作用：使印制板（金手指）只能插入与之配合的连接器中，防止插入其他连接器中的槽口。·

要求：一般公差要求较紧。14.Beveling：金指斜边Go

dl

if

gn

re

K/

ye

ls

to

B/

ve

leing16.

VOP：15.

VIP：·

(Via

In

Pad)Via

孔位于SMT

Pad上。·

要求：一般为S面塞孔，C面作为SMT

PAD。·说明：(Via

On

Pad)Via

孔先被树脂塞满，其表面（一面或两面）经过打磨、沉铜、板电镀等工序后，要求作为装配Pad。VIP/VO

PS面塞孔SMT

PadVia

hole树脂塞孔SMT

PadBlind/Buriedhole17.

Blind/Buried

hole：盲/埋孔·

盲孔：从一个表面开始，在内层结束，未贯穿整板的孔。·

埋孔：不经过两外表面，只在某些内层中贯穿的孔。盲孔埋孔·

High

Density

Interconnection

:18.

HDI高密度互联----特点：一般线宽/线间小于3mil/3mil导通孔小于8mil,microvia一般要求用激光钻孔。19.

LDI·

Laser

Direct

Image---镭射直接曝光----特点：直接用激光在干膜上曝光，不必用菲林，能保证完成线宽更细。20.

Heat

sink:Side

faceBottom

SideTop

SidePCBPallet大铜块PrepregPCB+Prepreg+PalletAspectratio21.

Aspect

Ratio：纵横比（板厚孔径比）---影响电镀和喷锡·

说明：一般采用板厚最大值与最小孔径之比。dHDAspect

Ratio

=

d

/

H22.

AGP:显卡主显示芯片AGP内存插孔PCI插槽CPU插座AGP插槽23.

Mother

board:主(机)板MotherboardMe

om

yr

ab

kn24.Memory

bank:内存条内存芯片组第四篇：检查与测试欧盟RoHS

&

WEEE指令对无铅PCB要求无铅PCB必须满足欧盟RoHS（Restriction

of

the

use

ofcertain

Hazardous

Substances

in

electrical

andelectronic

equipment）2002/95/EC指令和《电子信息产品生产污染防治管理办法》的规定，从2006年7月开始禁用六种物质（铅、镉、六价铬、水银、PBB（多溴化联苯）、PBDE（多溴联苯醚）。其中PCB板主要检测项目包括：PCB基材、阻焊、丝印、铜皮等。

If

this

specification

conflicts

with

any

other

documentthe

following

order

of

precedence

shall

apply:a)b)Purchase

orderPrinted

wiring

board

drawings

and

drill

and

trimdocumentationThis

specificationDocuments

referred

to

in

this

speciation.c)d)•

Supplier

shall

use

applicable

fabrication

panelcoupon

as

defined

in

IPC-2221.Micro-sectionscoupon

,and

solder

samples

shall

be

provided

witheach

shipment

for

validation

requirement.

1.

Maximum

3

repair

operations

are

allowed

on

eachboard

and

the

number

of

repaired

PCB’S

cannot

exceed

the10

percent

of

the

entire

lot

population.•

2.

Unless

otherwise

specified

on

the

engineeringdrawing

,plated

through

via

holes

with

a

nominal

size

of0.020inch

or

less

may

be

partially

or

completely

plugged

witsolder.•

3.

As

a

preventive

precaution

.before

the

laying

dowof

the

solder

,the

PCB’S

will

have

to

be

washed

toremove

the

residuals

due

to

the

production

process,

theclearing

degree

of

the

PCB’S

before

the

coating

has

tothe

following

one

MAX

1

ug

/square

cm..1.Solder

mask

(SMOBC)-Apply

LPI

solder

masks

per

IPC-SM-840

type

B.

class

3.

color

green

and

minimum

solder

masksthickness

over

the

edges

shall

be

0.001”.LPI

solder

mask

andsolder

shall

meet

the

UL

94v-o

requirements.

There

shall

be

nosolder

masks

over

the

SMT

pads

,there

shall

be

no

exposed

traceson

outside

layers

and

solder

mask

opening

should

be

0.002”sidelarger

than

pad.2.

PCB “Stack-Up”

construction

requirements

are

to

bedetermined

by

the

PCB

vendor

unless

specified.

Leit