制程控制审核表-先途电子

Area:ReworkandRepair(返工和维修),,,,,,,,,,,,,,,,,,

No.,AuditCriterion,,Actual,,,,,,,,,,,,,,,Remark

,,"关键

(Y)","請记""X""字

(如果适用)",0,25,50,75,100,,,,,,Applicable,Sum,Valid,Total,

1.基本维修能力,,,,,,,,,,,,,,,,,,

1.1,维修工位是否相关的维修SOP?(SMT/AI/HI/组装)修理人员是否有效执行?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.2,SMT/AI/HI/组装工序中的补料是否有补料流程或SOP?修理人员是否有效执行?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.3,维修SOP中辅料有否定义焊锡(锡线)、助焊剂、清洁剂的型号/厂家/适用的客户吗?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.4,有否明示说明不同部件的应用温度及烙铁嘴的尺寸?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.5,维修工在更换无件之前，操作工有否用万用表确认其数值或确认规格丝印?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.6,"SMT补件的板是否按正常修理板流程处理?

(查找BOM→找物料→更换或补件前测量数值→补件→作补件标示和修理标示→记录维修报表→单独区分→单独送检→单独转后工序跟踪)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.7,SMT/HI维修SOP是否明确定义金手指元件被拆卸后是不可以再使用?证据?实际作业方式确认?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.8,"SMT/HI维修SOP是否注明金手指元件/开关类元件假焊/连锡需补焊时,严禁使用热风枪,必须进行烙铁点焊?证据?实际作业方式确认?",Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.9,SMT/HI维修SOP是否注明金手指元件的维修OK后的清洗方式?维修清洗如何避免液体的浸入?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.10,带接地片IC（QFN)的维修：是否遵循定位--→接地加热焊接--→烙铁托焊原则?证据?实际作业方式确认?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

1.11,"HI维修工将补件的板修理OK后,是否在手补的HI元件上打点作标示?(便于检查工位确认HI补件的方向极性是否正确)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.12,"AI操作员是否在工作中发现抛料时需及时停机,在漏料的位置做标示,再继续生产,带整块板打完AI后,进行补料?(适用于排序式AI)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.13,"AI抛料的板给维修工维修时,抛料的位置是否依据BOM进行补料?",,,,,,,,0,0,0,0,0,0,0,1,0,

1.14,"AI维修工将补件的板修理OK后,是否在手补的AI元件上打点作标示?(便于检查工位确认AI补件的方向极性是否正确)",,,,,,,,0,0,0,0,0,0,0,1,0,

1.15,对于金手指（锅仔片）按键板的维修，是否必须带手指套作业，不可以带手套作业?,,,,,,,,0,0,0,0,0,0,0,1,0,

1.16,修理工是否接受过以上培训?证据?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.返工及维修管理,,,,,,,,,,,,,,,,,,

2.1,是否有返工流程文件?返工流程文件是否被审核批准?（抽检不良/客户反馈等品质异常返工）,,,,,,,,0,0,0,0,0,0,0,1,0,

2.2,电烙铁溫度有否定期监控?(漏电流及温度点检),,,,,,,,0,0,0,0,0,0,0,1,0,

2.3,所有维修使用的烙铁/电批有否接地?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.4,维修区的物料是否有按客户/供应商管理?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.5,CHIP元件是否在料带中保存?料带外是否有物料编码/规格型号?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.6,IC类物料的是否存放在ESD防护盒中和原料带/料盘中?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.7,"IC的领用是否建立相关领用台帐?不可以多领用,做备用.",,,,,,,,0,0,0,0,0,0,0,1,0,

2.8,"维修工使用的MSD元件必须在下班后退回到仓库,由仓库放入干燥箱中进行保管.",,,,,,,,0,0,0,0,0,0,0,1,0,

2.9,"AI补料使用的物料需从编带上拆散,放入相应的有物料标签的料盒中?(防止应物料盒太小,再次引脚变形拉伸,损坏元件)",,,,,,,,0,0,0,0,0,0,0,1,0,

2.10,是否有鉴别待维修的板及其维修OK待测试的板的分放?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.11,每个维修位是否都有适当的调试设备?如：万用表，示波器等?调试设备是否有校验?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.12,维修工位是否有使用视觉教具，工具作识别数值，位置及极性部件。,,,,,,,,0,0,0,0,0,0,0,1,0,

2.13,是否有用到最新的缐路图?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.14,维修品有序列号管理吗?如维修报表/QC报表中有记录不良品序列号(适合有序列号管理的组件),,,,,,,,0,0,0,0,0,0,0,1,0,

2.15,"在维修/不良分析工位,每件维修品被更换的元件是否清楚?都有被更换元件的记录吗?",,,,,,,,0,0,0,0,0,0,0,1,0,

2.16,"是否对维修品进行全检,是否对数量/维修标示/工程更改状态进行确认?",,,,,,,,0,0,0,0,0,0,0,1,0,

2.17,是否所有维修品都有维修“R”标示及外箱有单独的维修标示?,,,,,,,,0,0,0,0,0,0,0,1,0,

2.18,维修品是否有单独区分送OQA检验和出货?,Y,,,,,,,0,0,0,0,0,0,0,1,0,

2.19,"维修中发现同一原因不良超过3PCS,是否有预警反馈上级领导?是否有相关分析改善措施?证据?是否所有的维修人员都知