制造管理诊断手法与实例

製造管理診斷手法與實例 報告人: 許棟樑清華大學工業工程與工程管理系第一页，共四十八页。1OutlinePartI:APlantdiagnosticmethodology<Asummaryofpastfindings>1)Crystallizekeyaspectsofconcern(認清改善標的)2)Diagnostics&ImprovementMethodology(善用分析與改善手法)3)ProcessRe-engineeringApproachPartII:Applications&partialresults1)Indexmodel&usefulnewindices2)Improvementdrivers3)Bestpracticecomparisons4)SMTprocessre-engineering第二页，共四十八页。2PartI:PlantdiagnosticmethodologyI.1)CrystallizeKeyaspectsofconcern(認清改善標的)I.2)Diagnostics&ImprovementMethodology(分析與改善手法)I.3)MfgProcessRe-engineeringApproach第三页，共四十八页。3I.1KeyAspectsofconcernIdea:Top-downsystematicdeploymentofPI->DTCo.ObjectivesPlantObjectivesKeyPerfIndicesAdm.Obj.…Determinants………PIsDTsPIsDTsPIsDTs第四页，共四十八页。4

I.1.1Plant–Top-levelconcernsProfitability&CustomersatisfactionProductivity/ProductionLeadTime&Delivery(targethitrate)Quality&ReliabilityCostFlexibilityServiceI.1KeyAspectsofconcern第五页，共四十八页。5I.1KEYASPECTSOFCONCERNI.1.2AreasofAttention:(DTs)BottleneckManagement/Scheduling&Dispatching(=>Productivity)FlowEfficiency&Layout(=>Time)Inventorycontrol(Cost/profit)ResourceUtilizationEffectiveness(=>Cost/Profit)Equipment/FacilityMaterials(WIP)HumanResourcesSpaceProcess&ChangeControl(=>Quality/variability,Flexibility,etc.)Safety(basicreq.)=>propersetofPIsforeachlevel.第六页，共四十八页。6I.2.分析與改善手法Basicmethodology:I.2.0MethodologyOverviewI.2.1IndexModel&StandardsI.2.2DataRepresentationForms/ToolsI.2.3AnalysisMethods/ToolsI.2.4Sitetour&InterviewsI.3ProcessRe-engineeringapproach第七页，共四十八页。7I.2.0MethodologyOverviewCollectData&BM--CompareStrength&Weakness--SeekImprovementOpport.--RankPerformanceRegressionAnalysis--ModelQuantitiveRelationsAmongPerformanceIndices&Determinants--PerformanceIndex=Fn(Determinants)DataEnvelopAnalysis--IdentifyInefficiencies--ProvideImprovementDirection&ReferenceTargetLevelFeedbackRecomm.--CompareStrength/Weakness--IdentifyImprovementOpportunities&targetlevel--BestPracticeSharingCorrelationAnalysis--FindOutImprovementDriversTrendAnalysisIndexModel-EstablishSystematicPerformanceIndices&DeterminantsAnalysisToolsVisit/Interview--UnderstandFactoryProcedure--VerifyData--ClarifyQuestionsManyothertools...SimulationDatarepforms/questionnaire/tools--Clearly/completely/Concisely第八页，共四十八页。8I.2.1PerformanceIndexModelTopdown/goaldriven/ClearlinkagesStandardizationArrangedforvariouslevels&Org.第九页，共四十八页。9I.2.2DataRepresentationTools表單:Well-designedformstoconcisely&completelydocumentthedetailsituations.I.2.2.1Process/TransportAttributeTable(流程細目表)ProcessattributetableTransportattributetableI.2.2.2LayoutDiagramI.2.2.3S/Wmodelingtools(doc.Processes)ARIS4views/IDEF/PowerDesigner(etc.)Dataview/Functionview/Controlview/Orgview第十页，共四十八页。10I.2.3AnalysisMethods/Tools(1)I.2.3.1DataBenchmarking(Bar/linechart)+Hi/Lo/Mean3.1.1DirectDataBenchmarkingHorizontalBMVerticalBM(Trends)3.1.2IndirectDataBenchmarkingDunkenmethodtodifferentiategroupsforVariousPerfRankingsincl.:EquipmentperformanceAHP(AnalyticalHierarchicalProcess)RankingI.2.3.2ImprovementdriversCorrelationRegressionI.2.3.3Input/OutputEfficiencyAnalysis(DEA)Plant/Section/Machinelevels第十一页，共四十八页。11DataEnvelopAnalysis(Concept)Identifyin-efficiency&Impr.Ref.TargetCanidentifyeff4multipleinputs&multipleoutputs35投入人力月產量第十二页，共四十八页。12I.2.3AnalysisMethods/Tools(2)I.2.3.4BottleneckanalysisLineBalanceRateProcesstime+TransporttimehistogrambysectionBottleneckidentification/inclinationindicesI.2.3.5LayoutanalysisLayoutanalysis(Layoutefficiency)PetrinetanalysisI.2.3.6CycletimeanalysisFlowefficiencyI.2.3.7Costdecomposition/Wasteanalysis第十三页，共四十八页。13I.2.3AnalysisMethods/Tools(3)I.2.3.8Process&MaterialflowanalysisProcessflow(WIPJourney)AnalysisKeycomponenttimejourneybyorg./sectionWIPdistributionI.2.3.9ResourceUtilizationanalysisInventoryutilization/shortage&Stockwaste.EquipmentOEE/WasteanalysisHR(productivity?)Areautilization/productivityI.2.3.10SimulationSimulateexistingsituationtofindoutproblematic/bottleneckareasSimulatere-engineeredsituationto:Predictpossibleresults.Perform“whatif?”analysesDebugnewdesignsbeforemajorcapitalinvestments.第十四页，共四十八页。14I.3ProcessRe-engineeringApproachDetermineprojscope&targetofstudyPreliminaryprocesstour&discussionEstablishPIs&DTsDatacollection(UseDataRepresentationToolsI.2)AS-ISProcesssimulation/ARISModelUseAnalysisTools(I.2.3)w/externaldata=>ImprovementideasEstablishTO-BEmodelTO-BEModelsimulation=>改善效益評估Feedbacktoco.&Discussion.第十五页，共四十八页。15PartII:Applications&ResultExcerptII.1)Indexmodel&UsefulnewindicesII.2)ImprovementdriversII.3)BestpracticecomparisonsII.4)SMTProcessre-engineeringcases第十六页，共四十八页。16II.1HighlightsofIndexModelOrganized:13KeyperformanceIndices124Detailindices(variouslevels)Created12usefulNewindices&2redefinedindices:ORTratio:O-ratio/R-ratio/T-ratio(3*2)LayoutEfficiency(LE)(4)FlowEfficiency(FE)(2)LineBalanceRate(LBR)(redefined)(1)MTBFU–basedonuptime.(redefined)(1)<JMP>第十七页，共四十八页。17NewIndex:ORT-ratioORT_Ratio_Station：

Operation_Ratio_Station=#operationstations／Total#stations Repair_Ratio_Station=#repairstations／Total#stations Test_Ratio_Station=#teststations／Total#stationsORT_Ratio_People： Operation_Ratio_People=operationheadcounts／Totallineheadcount Repair_Ratio_People=repairheadcount／Totallineheadcount Test_Ratio_People=testingheadcount／TotallineheadcountRepresentsthe“maturitylevel”ofproduct&Processdesign/qualification。O-ratioHigh:fewnon-value-addheadcount/processR-ratioHigh:poorprocesscontrol.Needmanypeople/stationtorepairT-ratioH:overtestingorimmatureproduct-processcapabilityNeedlotsoftesting.Amanager:ORTratio有如照妖鏡，讓管理不佳者無所遁形。<RET>第十八页，共四十八页。18KeyPI:LineBalancerateLBR(%):Original：(ti)/tmNNormalized：(ti)1/N/tm

ti：Timefortheithprocesstm：Max(ti)i=1,…,NN：TotalnumberofprocessesOriginalmethodpenalizeonlonger/moresophiticatelines.=>Recomm.Normalizedmethod.Indexdesc.<RET>第十九页，共四十八页。19LayoutEfficiencyLayoutEfficiency_Time =Theoreticaltotalprocesstime/(theoreticaltotaltransporttime+Theoreticaltotalprocesstime)IndexDesc.LayoutEfficiency_length =Theoreticaltotalprocesslength/(theoreticaltotaltransportlength+Theoreticaltotalprocesslength)IndexDesc.<RET>第二十页，共四十八页。20FlowEfficiencyFlowEff.=theoreticalcycletime/ActualcysletimeIndexDesc.Theoreticalcycletime=totaltheoreticalprocesstime＋totaltheoreticaltransportActualcycletimeActualprocesstime+實際製程時間+actualtransporttime+actualidletime

<RET>第二十一页，共四十八页。21RevisedIndices:MTBFUMTBFu(MeanTimeBetweenFailure-Up-Timebased)=uptime/#failureduringtheperiodMostuse:alltime/#failureorprod.Time/#failureAvoidover-estimatingMTBFwhendowntimeislong.(down1timefor6monthsinayear.MTBFu=6/1;MTBFT=12/1.)aslongasinup-time,thereisapossibilityforfailure.Ret第二十二页，共四十八页。22II.2ImprovementDrivers第二十三页，共四十八页。23II.3

BestpracticecomparisonsProcessBenchingMarking-ExcerptC1CompanyBenchmarkingTableC2CompanyBenchmarkingTableC3CompanyBenchmarkingTableBest-in-classBMOtherDetailIndexTable第二十四页，共四十八页。24II.4)SMTProcessreengineeringcases樣本定義本次選擇了國內前三大筆記型電腦廠商，三家廠商1999年產量占全台灣產量的51%以上，基於保密原則，我們將三家公司定為C1、C2、C3，並保留相關機密資料。在C1-C3中，各參與公司提供一條最具代表性的PCBA生產線為樣本，實地由研究人員到廠3-5天，以收集所需的資料。第二十五页，共四十八页。25研究流程建立PCBA生產線流程之ARISMODEL訂定PCBA製造流程指標模式問卷訪談、資料收集無效率分析To-BeModel的建立系統模擬分析改善效益分析參與廠商回饋報告第二十六页，共四十八页。26C1PCBAlayout:ISvsTO-BE改善後改善前Advantages:1)KeepI/PO/Pfromsameside.2)Reducemanualcarttransp.3)Fastoverheadmovements.Notrafficcongestions.第二十七页，共四十八页。27RecommendationforC1CaseChangelayouttocontinuousU-shapedtoconnectwholePCBAarea.Removetheboardclippingstations.Addingplacementmachinetoincreaselinebalancingrate&reducepulserate.Reducemanualassemblyandinspectiontoreducecycletime.Automaterepairdatacollectionandanalysis.Automateloading/unloadingofATEstations.第二十八页，共四十八页。28C1AS-ISSimulation第二十九页，共四十八页。29Remove2splitstations第三十页，共四十八页。30AddPlacementmachine&adoptU-shapelayout第三十一页，共四十八页。31C1ImprovementEffects1/3

BenefitEstimateAfterChangingProductionLineLayoutSimulationItemPresentSimulationDiscardingtwoSplitstationsU-lineLayout/IncreasingTwoPlacementMachineImprove%Pulserate×××××××××↓14%Productionperday×××××××××↑16%AreaProductivity8.788.9710.7↑21.87%LaborProductivity12.6313.0215.07↑19.32%AvgWIP×××××××××↓73%

PCBATotalCycleTime×××××××××↓77%第三十二页，共四十八页。32C1ImprovementEffects2/3LayoutEfficiency_Length

45.59%

49.04%

75.40%↑52%LayoutEfficiency_Time

82.74%

82.58%

89.25%↑7.87%FlowEfficiency12.16%11.93%46.49%↑282%Linebalancerate

54.47%

53.11%

60.14%↑10.5%第三十三页，共四十八页。33C1ImprovementEffects3/3BottleneckStationTopSideLineMedium-SpeedTopSideLineMedium-SpeedBottomSideLineScreenPrinting

CycleTimeOfBottleneckStation

×××

×××

×××

↓13.3%NumberofLabor575555↓2peopleNumberofStationsXX-2X

第三十四页，共四十八页。34C1:ISvsTO-BE(1)Maximization第三十五页，共四十八页。35C1:ISvsTO-BE(2)Minimization第三十六页，共四十八页。36C3:PCBAlayoutISvsTo-be

WasTo-be第三十七页，共四十八页。37RecommendationforC3Case(1)ContinuousU-shapedlayouttoconnectwholePCBAline.RemovingtheX-RAYtestprocess.Yieldatthestationisalreadyveryhigh&itistooslow.Removethevibrationtest..Otherplantcandowithoutit.Hightestratio.Reviewneedsfortests.IntroduceAOI.第三十八页，共四十八页。38C3AS-ISSimulation第三十九页，共四十八页。39C3RemoveX-ray.Vibration.UseAOI.

第四十页，共四十八页。40U-shapeLayout

第四十一页，共四十八页。41C3Improvementeffects(1/3)

BenefitEstimateAfterChangingProductionLineLayoutSimulationItemPresentSimulationDiscardingX-Ray/DiscardingVibrationtest/AOIreplacesvisualinspectionU-shapedLayoutImprove%Pulserate×××××××××

sameProductionperday×××××××××

sameAreaProductivity13.4214.0814.65↑9.17%LaborProductivity25.8426.9927.02↑4.58%NumberofProductionSegment

3

2

1↓66.7%第四十二页，共四十八页。42C3Improvementeffects(2/3)AvgWIPXXXXXXXXX↓58%

PCBATotalCycleTimeXXXXXXXXX↓58%LayoutEfficiency_Length

61.87%

62.41%

76.19%

↑23%LayoutEfficiency_Time

83.67%

85.98%

88.73%

↑6%FlowEfficiency38.37%47.55%87.05%↑127%BalanceRatioofProductionLine

82.85%

83.25%

83.34%

第四十三页，共四十八页。43C3Improvementeffects(3/3)BottleneckStationBottomSideLineScreenPrintingTopSideLineHighSpeedTopSideLin