牙体牙髓课件实习指导

Resin-bondedcomposite•After•Afterobservingtheindustrialusephosphoricacidtoimproveadhesionofpaintsandresincoatingtometalsurfaces.•In1955,Buonocoreappliedacidtoteethrenderthetoothsurfacemorereceptivetoadhesion.Buoncore’spioneeringworkingledtomajorchangesisthepracticeofdentistry.AfterobservingtheindustrialuseofphosphoricAfterobservingtheindustrialuseofphosphoricacidtoimproveadhesionofpaintsandresincoatingtometalsurfaces.In1955,Buonocoreappliedacidtoteethtorenderthetoothsurfacemorereceptivetoadhesion.In1955,Buonocoreappliedacidtoteethtorenderthetoothsurfacemorereceptivetoadhesion.Buoncore’spioneeringworkingledtomajorchangesisthepracticeofdentistry.extent,bytoothconservingadhesiverestorativematerialshaveextent,bytoothconservingadhesiverestorativematerialshavebeenTraditionalmechanicalmethodsof•Today,Weareced,toaofadhesivepreparationsandmoreconservativegraduallybeen•Theconceptsoflargepreparationsandmoreconservativegraduallybeen•Theconceptsoflargepreparationsandforprevention,proposedbyblack,in1917,cedbyconceptsof Esthet-XPremisaVenusTetricCeramFourSeasonsVitalescenceGRADIAFiltekSupreme(3MEsthet-XPremisaVenusTetricCeramFourSeasonsVitalescenceGRADIAFiltekSupreme(3M •

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便于操作的材料。FiltekZ350,Filtek™SupremeXT,Ceram•X,GRADIADIRECT,收缩，高强度，耐磨性好。quixfil,FiltekP60，P90纳米树 Ceram•X,FlitekZ350,GRADIADIRECT,Venus,Filtek™Supreme60%）,具有较好的湿润性，弹性和阻射性。）No-etch↓Total-etchbonding(1980s(3↓Total-etchwetbonding(3↓(2↓Oneadhesivesystems(2000s)(1steps)酸蝕＋處理＋TotalEtch系列二酸蝕∕處理＋粘接∕） ““

(conservemore Bettertransmitanddistributefunctionalstressesacrossthebondinginterfacetotheteeth 2.6 2.6%~7.1Vol

6%~7.1Vol4．Mechanicalproperty,suchas4．Mechanicalproperty,suchasenergyoftheifitssurfacetensionislessthantheAnimportantrequirementforadhesionenergyoftheifitssurfacetensionislessthantheAnimportantrequirementforadhesionisthetwomaterialsbeingjoinedmustbeinsufficientlyclose.Besidesanintimatecontact,sufficientwettingoftheadhesivewilloccurContactDifferentcontactangle,different(acid-etching(acid-etching(acid-etching “污染拴(2-7µm)，使牙本质表面dd酸SmearConditioner：弱酸EDTA如0.5mol/LEDTA,10底胶粘接剂(adhesive 形成氧阻聚层(oxygen-inhibitedresin resin

3MESPESingleBond2两遍，15

模式，300mW/cm23秒,600mW/cm240秒；牙本质mW/cm240秒

•••预预输分与光存光储。

2-3mm合面洞缘不短斜面，局限于釉