银スルPCB加工について银浇灌孔线路板加工课件

Introducing

SilverThroughHole

Technology3/16/20231WhatisSilverThroughHole?Toconductbothsidesofcircuits,SilverPastereplacedtraditionalcopperastheconductivematerialthroughholes.銀膠，代替了傳統的銅箔，作為通孔中的導體導通兩面線路。UnliketraditionalPTH,advanceSilver-through-holedeployprecisesilkscreenprintinginsteadofheavymetalelectro-platingprocess.不同于傳統的PTH，先進的銀膠貫孔采用精確的絲印工序而非重金屬電鍍工序。3/16/20232AdvantagesofusingSTH使用STH的優勢CostSaving(20%-25%)節省成本(20%-25%)LessExpensiveLaminate板料價格更便宜EnvironmentalFriendly100%Lead-free環保，100%無鉛O.S.P.finishensureflatpadsforSMTOSP表面處理為SMT保証平整的焊盤Compatibletoallsolderingprocesses適用于所有焊接過程Wideapplicationforconsumerappliances廣泛應用于消費器具中。3/16/20233End-productsApplication終端產品應用ComputerPeripherals(DVD-ROM)電腦周邊MobileCommunications移動通信MedicalElectronics醫學電子RFRemoteControls無線遙控Hand-heldElectronicdevices手持式電子器件Security&AccessControls安全及訪問控制Air-conditionConsole空調控制板AutomobileDashboard汽車儀表板OtherConsumerElectronicAppliances其它消費電子器具3/16/20235Comparisonbetween

STHandPTH

PCBSTH與PTH

PCB對照STH-SilverThroughHole

PTH-PlatingThroughHole3/16/20236CrossSectionsforSTH&PTH切片對照SilverThroughHolePlatingthroughhole3/16/20237ProcessingDifferencesProcessSTHPTHPattern線路WetFilmDryFilmSolderResist阻焊油UVInkPhotoSensitiveInk感光油墨Holeconduction孔導通SilverPaste銀膠Electro-plating電鍍LegendPrinting文字印刷UVInkThermaladhesiveInkRemarks備注GreenProduct綠色產品HeavyMetal重金屬3/16/20239DesignParametersMeasurement(minimum)測量(最小值)STHPTHLineWidth線寬0.15mm0.10mmLineSpace線距0.15mm0.10mmThroughHoleSize通孔尺寸0.50mm0.30mmThroughHolePitch通孔間距1.50mm0.75mmSpacebetweenCopperLandandTrace焊盤與線路的間距0.25mm0.15mm3/16/202310Lessexpensivelaminate板料更便宜GreenProcess綠色制程SavehighercostfromElectro-plating節省了電鍍所需的高成本MuchmoresavingsforMassProduction大量生產