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製造管理診斷手法與實例 報告人: 許棟樑清華大學工業工程與工程管理系1製造管理診斷手法與實例 報告人: 許棟樑1OutlinePartI:APlantdiagnosticmethodology<Asummaryofpastfindings>1)Crystallizekeyaspectsofconcern(認清改善標的)2)Diagnostics&ImprovementMethodology(善用分析與改善手法)3)ProcessRe-engineeringApproachPartII:Applications&partialresults1)Indexmodel&usefulnewindices2)Improvementdrivers3)Bestpracticecomparisons4)SMTprocessre-engineering2OutlinePartI:APlantdiagnosPartI:PlantdiagnosticmethodologyI.1)CrystallizeKeyaspectsofconcern(認清改善標的)I.2)Diagnostics&ImprovementMethodology(分析與改善手法)I.3)MfgProcessRe-engineeringApproach3PartI:PlantdiagnosticmethoI.1KeyAspectsofconcernIdea:Top-downsystematicdeploymentofPI->DTCo.ObjectivesPlantObjectivesKeyPerfIndicesAdm.Obj.…Determinants………PIsDTsPIsDTsPIsDTs4I.1KeyAspectsofconcernIde

I.1.1Plant–Top-levelconcernsProfitability&CustomersatisfactionProductivity/ProductionLeadTime&Delivery(targethitrate)Quality&ReliabilityCostFlexibilityServiceI.1KeyAspectsofconcern5

I.1KeyAspectsofconcern5I.1KEYASPECTSOFCONCERNI.1.2AreasofAttention:(DTs)BottleneckManagement/Scheduling&Dispatching(=>Productivity)FlowEfficiency&Layout(=>Time)Inventorycontrol(Cost/profit)ResourceUtilizationEffectiveness(=>Cost/Profit)Equipment/FacilityMaterials(WIP)HumanResourcesSpaceProcess&ChangeControl(=>Quality/variability,Flexibility,etc.)Safety(basicreq.)=>propersetofPIsforeachlevel.6I.1KEYASPECTSOFCONCERNI.1.I.2.分析與改善手法Basicmethodology:I.2.0MethodologyOverviewI.2.1IndexModel&StandardsI.2.2DataRepresentationForms/ToolsI.2.3AnalysisMethods/ToolsI.2.4Sitetour&InterviewsI.3ProcessRe-engineeringapproach7I.2.分析與改善手法Basicmethodology:I.2.0MethodologyOverviewCollectData&BM--CompareStrength&Weakness--SeekImprovementOpport.--RankPerformanceRegressionAnalysis--ModelQuantitiveRelationsAmongPerformanceIndices&Determinants--PerformanceIndex=Fn(Determinants)DataEnvelopAnalysis--IdentifyInefficiencies--ProvideImprovementDirection&ReferenceTargetLevelFeedbackRecomm.--CompareStrength/Weakness--IdentifyImprovementOpportunities&targetlevel--BestPracticeSharingCorrelationAnalysis--FindOutImprovementDriversTrendAnalysisIndexModel-EstablishSystematicPerformanceIndices&DeterminantsAnalysisToolsVisit/Interview--UnderstandFactoryProcedure--VerifyData--ClarifyQuestionsManyothertools...SimulationDatarepforms/questionnaire/tools--Clearly/completely/Concisely8I.2.0MethodologyOverviewCollI.2.1PerformanceIndexModelTopdown/goaldriven/ClearlinkagesStandardizationArrangedforvariouslevels&Org.9I.2.1PerformanceIndexModelTI.2.2DataRepresentationTools表單:Well-designedformstoconcisely&completelydocumentthedetailsituations.I.2.2.1Process/TransportAttributeTable(流程細目表)ProcessattributetableTransportattributetableI.2.2.2LayoutDiagramI.2.2.3S/Wmodelingtools(doc.Processes)ARIS4views/IDEF/PowerDesigner(etc.)Dataview/Functionview/Controlview/Orgview10I.2.2DataRepresentationToolI.2.3AnalysisMethods/Tools(1)I.2.3.1DataBenchmarking(Bar/linechart)+Hi/Lo/Mean3.1.1DirectDataBenchmarkingHorizontalBMVerticalBM(Trends)3.1.2IndirectDataBenchmarkingDunkenmethodtodifferentiategroupsforVariousPerfRankingsincl.:EquipmentperformanceAHP(AnalyticalHierarchicalProcess)RankingI.2.3.2ImprovementdriversCorrelationRegressionI.2.3.3Input/OutputEfficiencyAnalysis(DEA)Plant/Section/Machinelevels11I.2.3AnalysisMethods/ToolsDataEnvelopAnalysis(Concept)Identifyin-efficiency&Impr.Ref.TargetCanidentifyeff4multipleinputs&multipleoutputs35投入人力月產量12DataEnvelopAnalysis(ConceptI.2.3AnalysisMethods/Tools(2)I.2.3.4BottleneckanalysisLineBalanceRateProcesstime+TransporttimehistogrambysectionBottleneckidentification/inclinationindicesI.2.3.5LayoutanalysisLayoutanalysis(Layoutefficiency)PetrinetanalysisI.2.3.6CycletimeanalysisFlowefficiencyI.2.3.7Costdecomposition/Wasteanalysis13I.2.3AnalysisMethods/ToolsI.2.3AnalysisMethods/Tools(3)I.2.3.8Process&MaterialflowanalysisProcessflow(WIPJourney)AnalysisKeycomponenttimejourneybyorg./sectionWIPdistributionI.2.3.9ResourceUtilizationanalysisInventoryutilization/shortage&Stockwaste.EquipmentOEE/WasteanalysisHR(productivity?)Areautilization/productivityI.2.3.10SimulationSimulateexistingsituationtofindoutproblematic/bottleneckareasSimulatere-engineeredsituationto:Predictpossibleresults.Perform“whatif?”analysesDebugnewdesignsbeforemajorcapitalinvestments.14I.2.3AnalysisMethods/ToolsI.3ProcessRe-engineeringApproachDetermineprojscope&targetofstudyPreliminaryprocesstour&discussionEstablishPIs&DTsDatacollection(UseDataRepresentationToolsI.2)AS-ISProcesssimulation/ARISModelUseAnalysisTools(I.2.3)w/externaldata=>ImprovementideasEstablishTO-BEmodelTO-BEModelsimulation=>改善效益評估Feedbacktoco.&Discussion.15I.3ProcessRe-engineeringAppPartII:Applications&ResultExcerptII.1)Indexmodel&UsefulnewindicesII.2)ImprovementdriversII.3)BestpracticecomparisonsII.4)SMTProcessre-engineeringcases16PartII:Applications&ResultII.1HighlightsofIndexModelOrganized:13KeyperformanceIndices124Detailindices(variouslevels)Created12usefulNewindices&2redefinedindices:ORTratio:O-ratio/R-ratio/T-ratio(3*2)LayoutEfficiency(LE)(4)FlowEfficiency(FE)(2)LineBalanceRate(LBR)(redefined)(1)MTBFU–basedonuptime.(redefined)(1)<JMP>17II.1HighlightsofIndexModelNewIndex:ORT-ratioORT_Ratio_Station:

Operation_Ratio_Station=#operationstations/Total#stations Repair_Ratio_Station=#repairstations/Total#stations Test_Ratio_Station=#teststations/Total#stationsORT_Ratio_People: Operation_Ratio_People=operationheadcounts/Totallineheadcount Repair_Ratio_People=repairheadcount/Totallineheadcount Test_Ratio_People=testingheadcount/TotallineheadcountRepresentsthe“maturitylevel”ofproduct&Processdesign/qualification。O-ratioHigh:fewnon-value-addheadcount/processR-ratioHigh:poorprocesscontrol.Needmanypeople/stationtorepairT-ratioH:overtestingorimmatureproduct-processcapabilityNeedlotsoftesting.Amanager:ORTratio有如照妖鏡,讓管理不佳者無所遁形。<RET>18NewIndex:ORT-ratioORT_Ratio_KeyPI:LineBalancerateLBR(%):Original:(ti)/tmNNormalized:(ti)1/N/tm

ti:Timefortheithprocesstm:Max(ti)i=1,…,NN:TotalnumberofprocessesOriginalmethodpenalizeonlonger/moresophiticatelines.=>Recomm.Normalizedmethod.Indexdesc.<RET>19KeyPI:LineBalancerateLBR(LayoutEfficiencyLayoutEfficiency_Time =Theoreticaltotalprocesstime/(theoreticaltotaltransporttime+Theoreticaltotalprocesstime)IndexDesc.LayoutEfficiency_length =Theoreticaltotalprocesslength/(theoreticaltotaltransportlength+Theoreticaltotalprocesslength)IndexDesc.<RET>20LayoutEfficiencyLayoutEfficiFlowEfficiencyFlowEff.=theoreticalcycletime/ActualcysletimeIndexDesc.Theoreticalcycletime=totaltheoreticalprocesstime+totaltheoreticaltransportActualcycletimeActualprocesstime+實際製程時間+actualtransporttime+actualidletime

<RET>21FlowEfficiencyFlowEff.=theoRevisedIndices:MTBFUMTBFu(MeanTimeBetweenFailure-Up-Timebased)=uptime/#failureduringtheperiodMostuse:alltime/#failureorprod.Time/#failureAvoidover-estimatingMTBFwhendowntimeislong.(down1timefor6monthsinayear.MTBFu=6/1;MTBFT=12/1.)aslongasinup-time,thereisapossibilityforfailure.Ret22RevisedIndices:MTBFUMTBFu(MII.2ImprovementDrivers23II.2ImprovementDrivers23II.3

BestpracticecomparisonsProcessBenchingMarking-ExcerptC1CompanyBenchmarkingTableC2CompanyBenchmarkingTableC3CompanyBenchmarkingTableBest-in-classBMOtherDetailIndexTable24II.3BestpracticecomparisonsII.4)SMTProcessreengineeringcases樣本定義本次選擇了國內前三大筆記型電腦廠商,三家廠商1999年產量占全台灣產量的51%以上,基於保密原則,我們將三家公司定為C1、C2、C3,並保留相關機密資料。在C1-C3中,各參與公司提供一條最具代表性的PCBA生產線為樣本,實地由研究人員到廠3-5天,以收集所需的資料。25II.4)SMTProcessreengineerin研究流程建立PCBA生產線流程之ARISMODEL訂定PCBA製造流程指標模式問卷訪談、資料收集無效率分析To-BeModel的建立系統模擬分析改善效益分析參與廠商回饋報告26研究流程建立PCBA生產線流程之ARISMODEL訂定PCC1PCBAlayout:ISvsTO-BE改善後改善前Advantages:1)KeepI/PO/Pfromsameside.2)Reducemanualcarttransp.3)Fastoverheadmovements.Notrafficcongestions.27C1PCBAlayout:ISvsTO-BE改善RecommendationforC1CaseChangelayouttocontinuousU-shapedtoconnectwholePCBAarea.Removetheboardclippingstations.Addingplacementmachinetoincreaselinebalancingrate&reducepulserate.Reducemanualassemblyandinspectiontoreducecycletime.Automaterepairdatacollectionandanalysis.Automateloading/unloadingofATEstations.28RecommendationforC1CaseChC1AS-ISSimulation29C1AS-ISSimulation29Remove2splitstations30Remove2splitstations30AddPlacementmachine&adoptU-shapelayout31AddPlacementmachine&adoptC1ImprovementEffects1/3

BenefitEstimateAfterChangingProductionLineLayoutSimulationItemPresentSimulationDiscardingtwoSplitstationsU-lineLayout/IncreasingTwoPlacementMachineImprove%Pulserate×××××××××↓14%Productionperday×××××××××↑16%AreaProductivity8.788.9710.7↑21.87%LaborProductivity12.6313.0215.07↑19.32%AvgWIP×××××××××↓73%

PCBATotalCycleTime×××××××××↓77%32C1ImprovementEffects1/3

BeC1ImprovementEffects2/3LayoutEfficiency_Length

45.59%

49.04%

75.40%↑52%LayoutEfficiency_Time

82.74%

82.58%

89.25%↑7.87%FlowEfficiency12.16%11.93%46.49%↑282%Linebalancerate

54.47%

53.11%

60.14%↑10.5%33C1ImprovementEffects2/3LayC1ImprovementEffects3/3BottleneckStationTopSideLineMedium-SpeedTopSideLineMedium-SpeedBottomSideLineScreenPrinting

CycleTimeOfBottleneckStation

×××

×××

×××

↓13.3%NumberofLabor575555↓2peopleNumberofStationsXX-2X

34C1ImprovementEffects3/3BotC1:ISvsTO-BE(1)Maximization35C1:ISvsTO-BE(1)MaximizatioC1:ISvsTO-BE(2)Minimization36C1:ISvsTO-BE(2)MinimizatiC3:PCBAlayoutISvsTo-be

WasTo-be37C3:PCBAlayoutISvsTo-RecommendationforC3Case(1)ContinuousU-shapedlayouttoconnectwholePCBAline.RemovingtheX-RAYtestprocess.Yieldatthestationisalreadyveryhigh&itistooslow.Removethevibrationtest..Otherplantcandowithoutit.Hightestratio.Reviewneedsfortests.IntroduceAOI.38RecommendationforC3Case(1C3AS-ISSimulation39C3AS-ISSimulation39C3RemoveX-ray.Vibration.UseAOI.

40C3RemoveX-ray.Vibration.UseU-shapeLayout

41U-shapeLayout41C3Improvementeffects(1/3)

BenefitEstimateAfterChangingProductionLineLayoutSimulationItemPresentSimulationDiscardingX-Ray/DiscardingVibrationtest/AOIreplacesvisualinspectionU-shapedLayoutImprove%Pulserate×××××××××

sameProductionperday×××××××××

sameAreaProductivity13.4214.0814.65↑9.17%LaborProductivity25.8426.9927.02↑4.58%NumberofProductionSegment

3

2

1↓66.7%42C3Improvementeffects(1/3)

BC3Improvementeffects(2/3)AvgWIPXXXXXXXXX↓58%

PCBATotalCycleTimeXXXXXXXXX↓58%LayoutEfficiency_Length

61.87%

62.41%

76.19%

↑23%LayoutEfficiency_Time

83.67%

85.98%

88.73%

↑6%FlowEfficiency38.37%47.55%87.05%↑127%BalanceRatioofProductionLine

82.85%

83.25%

83.34%

43C3Improvementeffects(2/3)AvC3Improvementeffects(3/3)BottleneckStationBottomSideLineScreenPrintingTopSideLineHighSpeedTopSideLineMedium-Speed

CycleTimeOfBottleneckStation

×××

×××

×××

NumberofLabor444242↓2peopleORT_Ratio_People0.4/0.09/0.50.43/0.09/0.480.43//0.09/0.48

NumberofStation565454↓2stations

44C3Improvementeffects(3/3)BoC3:ISvsTO-BE(1)Maximization45C3:ISvsTO-BE(1)MaximizatiC3:ISvsTO-BE(2)Minimization46C3:ISvsTO-BE(2)MinimizatiConclusionsIn-depthreviewed3majorplants.Co.51%Taiwanproductionin1999.ForPCBAline:Established58PIs,8keyPIsNewindices:ORTratios,Layoutefficiency,Flowefficiency,NormalizedLineBalancerateLocatedrelativestrengthandweaknessforplantimprovementoppor.Majorrecom:reducemfgsegments,continuousU-shapeline,reducenon-bottlebuffer,ImproveLBR,UseautomationUsedSimulationtoverifyanddebugre-engineeredprocesses.Someplantscouldgain70%inWIP&cycletimereduction.Significantimprovementscanbeexpected.Simulationisusefulforre-engineering.4147ConclusionsIn-depthreviewed3製造管理診斷手法與實例 報告人: 許棟樑清華大學工業工程與工程管理系48製造管理診斷手法與實例 報告人: 許棟樑1OutlinePartI:APlantdiagnosticmethodology<Asummaryofpastfindings>1)Crystallizekeyaspectsofconcern(認清改善標的)2)Diagnostics&ImprovementMethodology(善用分析與改善手法)3)ProcessRe-engineeringApproachPartII:Applications&partialresults1)Indexmodel&usefulnewindices2)Improvementdrivers3)Bestpracticecomparisons4)SMTprocessre-engineering49OutlinePartI:APlantdiagnosPartI:PlantdiagnosticmethodologyI.1)CrystallizeKeyaspectsofconcern(認清改善標的)I.2)Diagnostics&ImprovementMethodology(分析與改善手法)I.3)MfgProcessRe-engineeringApproach50PartI:PlantdiagnosticmethoI.1KeyAspectsofconcernIdea:Top-downsystematicdeploymentofPI->DTCo.ObjectivesPlantObjectivesKeyPerfIndicesAdm.Obj.…Determinants………PIsDTsPIsDTsPIsDTs51I.1KeyAspectsofconcernIde

I.1.1Plant–Top-levelconcernsProfitability&CustomersatisfactionProductivity/ProductionLeadTime&Delivery(targethitrate)Quality&ReliabilityCostFlexibilityServiceI.1KeyAspectsofconcern52

I.1KeyAspectsofconcern5I.1KEYASPECTSOFCONCERNI.1.2AreasofAttention:(DTs)BottleneckManagement/Scheduling&Dispatching(=>Productivity)FlowEfficiency&Layout(=>Time)Inventorycontrol(Cost/profit)ResourceUtilizationEffectiveness(=>Cost/Profit)Equipment/FacilityMaterials(WIP)HumanResourcesSpaceProcess&ChangeControl(=>Quality/variability,Flexibility,etc.)Safety(basicreq.)=>propersetofPIsforeachlevel.53I.1KEYASPECTSOFCONCERNI.1.I.2.分析與改善手法Basicmethodology:I.2.0MethodologyOverviewI.2.1IndexModel&StandardsI.2.2DataRepresentationForms/ToolsI.2.3AnalysisMethods/ToolsI.2.4Sitetour&InterviewsI.3ProcessRe-engineeringapproach54I.2.分析與改善手法Basicmethodology:I.2.0MethodologyOverviewCollectData&BM--CompareStrength&Weakness--SeekImprovementOpport.--RankPerformanceRegressionAnalysis--ModelQuantitiveRelationsAmongPerformanceIndices&Determinants--PerformanceIndex=Fn(Determinants)DataEnvelopAnalysis--IdentifyInefficiencies--ProvideImprovementDirection&ReferenceTargetLevelFeedbackRecomm.--CompareStrength/Weakness--IdentifyImprovementOpportunities&targetlevel--BestPracticeSharingCorrelationAnalysis--FindOutImprovementDriversTrendAnalysisIndexModel-EstablishSystematicPerformanceIndices&DeterminantsAnalysisToolsVisit/Interview--UnderstandFactoryProcedure--VerifyData--ClarifyQuestionsManyothertools...SimulationDatarepforms/questionnaire/tools--Clearly/completely/Concisely55I.2.0MethodologyOverviewCollI.2.1PerformanceIndexModelTopdown/goaldriven/ClearlinkagesStandardizationArrangedforvariouslevels&Org.56I.2.1PerformanceIndexModelTI.2.2DataRepresentationTools表單:Well-designedformstoconcisely&completelydocumentthedetailsituations.I.2.2.1Process/TransportAttributeTable(流程細目表)ProcessattributetableTransportattributetableI.2.2.2LayoutDiagramI.2.2.3S/Wmodelingtools(doc.Processes)ARIS4views/IDEF/PowerDesigner(etc.)Dataview/Functionview/Controlview/Orgview57I.2.2DataRepresentationToolI.2.3AnalysisMethods/Tools(1)I.2.3.1DataBenchmarking(Bar/linechart)+Hi/Lo/Mean3.1.1DirectDataBenchmarkingHorizontalBMVerticalBM(Trends)3.1.2IndirectDataBenchmarkingDunkenmethodtodifferentiategroupsforVariousPerfRankingsincl.:EquipmentperformanceAHP(AnalyticalHierarchicalProcess)RankingI.2.3.2ImprovementdriversCorrelationRegressionI.2.3.3Input/OutputEfficiencyAnalysis(DEA)Plant/Section/Machinelevels58I.2.3AnalysisMethods/ToolsDataEnvelopAnalysis(Concept)Identifyin-efficiency&Impr.Ref.TargetCanidentifyeff4multipleinputs&multipleoutputs35投入人力月產量59DataEnvelopAnalysis(ConceptI.2.3AnalysisMethods/Tools(2)I.2.3.4BottleneckanalysisLineBalanceRateProcesstime+TransporttimehistogrambysectionBottleneckidentification/inclinationindicesI.2.3.5LayoutanalysisLayoutanalysis(Layoutefficiency)PetrinetanalysisI.2.3.6CycletimeanalysisFlowefficiencyI.2.3.7Costdecomposition/Wasteanalysis60I.2.3AnalysisMethods/ToolsI.2.3AnalysisMethods/Tools(3)I.2.3.8Process&MaterialflowanalysisProcessflow(WIPJourney)AnalysisKeycomponenttimejourneybyorg./sectionWIPdistributionI.2.3.9ResourceUtilizationanalysisInventoryutilization/shortage&Stockwaste.EquipmentOEE/WasteanalysisHR(productivity?)Areautilization/productivityI.2.3.10SimulationSimulateexistingsituationtofindoutproblematic/bottleneckareasSimulatere-engineeredsituationto:Predictpossibleresults.Perform“whatif?”analysesDebugnewdesignsbeforemajorcapitalinvestments.61I.2.3AnalysisMethods/ToolsI.3ProcessRe-engineeringApproachDetermineprojscope&targetofstudyPreliminaryprocesstour&discussionEstablishPIs&DTsDatacollection(UseDataRepresentationToolsI.2)AS-ISProcesssimulation/ARISModelUseAnalysisTools(I.2.3)w/externaldata=>ImprovementideasEstablishTO-BEmodelTO-BEModelsimulation=>改善效益評估Feedbacktoco.&Discussion.62I.3ProcessRe-engineeringAppPartII:Applications&ResultExcerptII.1)Indexmodel&UsefulnewindicesII.2)ImprovementdriversII.3)BestpracticecomparisonsII.4)SMTProcessre-engineeringcases63PartII:Applications&ResultII.1HighlightsofIndexModelOrganized:13KeyperformanceIndices124Detailindices(variouslevels)Created12usefulNewindices&2redefinedindices:ORTratio:O-ratio/R-ratio/T-ratio(3*2)LayoutEfficiency(LE)(4)FlowEfficiency(FE)(2)LineBalanceRate(LBR)(redefined)(1)MTBFU–basedonuptime.(redefined)(1)<JMP>64II.1HighlightsofIndexModelNewIndex:ORT-ratioORT_Ratio_Station:

Operation_Ratio_Station=#operationstations/Total#stations Repair_Ratio_Station=#repairstations/Total#stations Test_Ratio_Station=#teststations/Total#stationsORT_Ratio_People: Operation_Ratio_People=operationheadcounts/Totallineheadcount Repair_Ratio_People=repairheadcount/Totallineheadcount Test_Ratio_People=testingheadcount/TotallineheadcountRepresentsthe“maturitylevel”ofproduct&Processdesign/qualification。O-ratioHigh:fewnon-value-addheadcount/processR-ratioHigh:poorprocesscontrol.Needmanypeople/stationtorepairT-ratioH:overtestingorimmatureproduct-processcapabilityNeedlotsoftesting.Amanager:ORTratio有如照妖鏡,讓管理不佳者無所遁形。<RET>65NewIndex:ORT-ratioORT_Ratio_KeyPI:LineBalancerateLBR(%):Original:(ti)/tmNNormalized:(ti)1/N/tm

ti:Timefortheithprocesstm:Max(ti)i=1,…,NN:TotalnumberofprocessesOriginalmethodpenalizeonlonger/moresophiticatelines.=>Recomm.Normalizedmethod.Indexdesc.<RET>66KeyPI:LineBalancerateLBR(LayoutEfficiencyLayoutEfficiency_Time =Theoreticaltotalprocesstime/(theoreticaltotaltransporttime+Theoreticaltotalprocesstime)IndexDesc.LayoutEfficiency_length =Theoreticaltotalprocesslength/(theoreticaltotaltransportlength+Theoreticaltotalprocesslength)IndexDesc.<RET>67LayoutEfficiencyLayoutEfficiFlowEfficiencyFlowEff.=theoreticalcycletime/ActualcysletimeIndexDesc.Theoreticalcycletime=totaltheoreticalprocesstime+totaltheoreticaltransportActualcycletimeActualprocesstime+實際製程時間+actualtransporttime+actualidletime

<RET>68FlowEfficiencyFlowEff.=theoRevisedIndices:MTBFUMTBFu(MeanTimeBetweenFailure-Up-Timebased)=uptime/#failureduringtheperiodMostuse:alltime/#failureorprod.Time/#failureAvoidover-estimatingMTBFwhendowntimeislong.(down1timefor6monthsinayear.MTBFu=6/1;MTBFT=12/1.)aslongasinup-time,thereisapossibilityforfailure.Ret69RevisedIndices:MTBFUMTBFu(MII.2ImprovementDrivers70II.2ImprovementDrivers23II.3

BestpracticecomparisonsProcessBenchingMarking-ExcerptC1CompanyBenchmarkingTableC2CompanyBenchmarkingTableC3CompanyBenchmarkingTableBest-in-classBMOtherDetailIndexTable71II.3BestpracticecomparisonsII.4)SMTProcessreengineeringcases樣本定義本次選擇了國內前三大筆記型電腦廠商,三家廠商1999年產量占全台灣產量的51%以上,基於保密原則,我們將三家公司定為C1、C2、C3,並保留相關機密資料。在C1-C3中,各參與公司提供一條最具代表性的PCBA生產線為樣本,實地由研究人員到廠3-5天,以收集所需的資料。72II.4)SMTProcessreengineerin研究流程建立PCBA生產線流程之ARISMODEL訂定PCBA製造流程指標模式問卷訪談、資料收集無效率分析To-BeModel的建立系統模擬分析改善效益分析參與廠商回饋報告73研究流程建立PCBA生產線流程之ARISMODEL訂定PCC1PCBAlayout:ISvsTO-BE改善後改善前Advantages:1)KeepI/PO/Pfromsameside.2)Reducemanualcarttransp.3)Fastoverheadmovements.Notrafficcongestions.74C1PCBAlayout:ISvsTO-BE改善RecommendationforC1CaseChangelayouttocontinuousU-shapedtoconnectwholePCBAarea.Removetheboardclippingstations.Addingplacementmachinetoincreaselinebalancingrate&reducepulserate.Reducemanualassemblyandinspectiontoreducecycletime.Automaterepairdatacollectionandanalysis.Automateloading/unloadingofATEstations.75RecommendationforC1CaseChC1AS-ISSimulation76C1AS-ISSimulation29Remove2splitstations77Remove2splitstations30AddPlacementmachine&adoptU-shapelayout78AddPlacementmachine&adoptC1ImprovementEffects1/3

BenefitEstimateAfterChangingProductionLineLayoutSimulationItemPresentSimulationDiscardingtwoSplitstationsU-lineLayout/IncreasingTwoPlacementMachineImprove%Pulserate×××××××××↓14%Productionperday×××××××××↑16%AreaProductivity8.788.9710.7↑21.87%LaborProductivity12.6313.0215.07↑19.32%AvgWIP×××××××××↓73%

PCBATotalCycleTime×××××××××↓77%79C1ImprovementEffects1/3

BeC1ImprovementEffects2/3LayoutEfficiency_Length

45.59%

49.04%

75.40%↑52%LayoutEfficiency_Time

82.74%

82.58%

89.25%↑7.87%FlowEfficiency12.16%11.93%46.49%↑282%Linebalancerate

54.47%

53.11%

60.14%↑10.5%80C1ImprovementEffects2/3LayC1ImprovementEffects3/3BottleneckStationTopSideLineMedium-SpeedTopSideLineMedium-SpeedBottomSideLineScreenPrinting

CycleTimeOfBottleneckStation

×××

×××

×××

↓13.3%NumberofLabor575555↓2peopleNumberofStationsXX-2X

81C1ImprovementEffects3/3BotC1:ISvsT

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