PCB专业英语和层定义

1.PCB=PrintedCircuitBoard电路板2.CAM=Computeraidedmanufacture计算机辅助1.PCB=PrintedCircuitBoard电路板2.CAM=Computeraidedmanufacture计算机辅助PCB专业英语(PCBSPECIALENGLISH)3.Pad3.Pad焊盘4.Annularring4.Annularring焊环5.AOI=automaticopticalinspection5.AOI=automaticopticalinspection自动光学检测6.Chargeoffree免费6.Chargeoffree免费7.WIP=workinprocess在线板8.DCC=documentcontrolcenter8.DCC=documentcontrolcenter文控中心9.Legend9.Legend字符10.CS=ComponentSide=TopSide10.CS=ComponentSide=TopSide（顶层）元件面11.SS=SolderSide=BottomSide（底层）焊锡面11.SS=SolderSide=BottomSide（底层）焊锡面12.GoldPlated电金，镀金13.NickelPlated13.NickelPlated电镍，镀镍14.ImmersionGold14.ImmersionGold沉金=沉镍金15.CarbonInkPrint15.CarbonInkPrint印碳油16.MicrosectionReport切片报告，横切面报告16.MicrosectionReport切片报告，横切面报告17.X-out=Cross-out打“X”报告18.Panel（客户称）拼板，（生产线称）工作板18.Panel（客户称）拼板，（生产线称）工作板19.Marking标记，UL标记19.Marking标记，UL标记20.Datecode20.Datecode生产周期21.Unit21.Unit单元，单位23.ProfileByRouting锣(铣)外形24.WetFilm湿菲林,湿绿油,湿膜23.ProfileByRouting锣(铣)外形24.WetFilm湿菲林,湿绿油,湿膜22.Profile外形，轮廓<outline>25.Slot25.Slot槽,方坑26.BaseMaterial=BaseLaminate26.BaseMaterial=BaseLaminate基材,板料27.V-out=V-score27.V-out=V-scoreV28.Finished成品28.Finished成品29.Marketing市场部30.GerberFile30.GerberFileGERBER31.ULLOGO31.ULLOGOUL32.E-Test=ElectricOpen/ShortTest32.E-Test=ElectricOpen/ShortTest电子测试33.PO=PurchaseOrder订单33.PO=PurchaseOrder订单34.Tolerance公差35.Rigid,FlexibleBoard35.Rigid,FlexibleBoard刚性,软性板36.Boardcut36.Boardcut开料37.Boardbaking37.Boardbaking焗板38.Drill钻孔38.Drill钻孔39.PTH=PlatedThroughHole镀通孔,沉铜40.Panelplating40.Panelplating板面电镀,全板电镀41.PhotoImage41.PhotoImage图象,线路图形42.Patternplating42.Patternplating线路电镀43.Etching43.Etching蚀板,蚀刻45.SR=SolderResist防焊,阻焊,绿油46.Goldfinger45.SR=SolderResist防焊,阻焊,绿油46.Goldfinger金手指44.SM=SolderMask防焊,阻焊,绿油47.Silkscreen47.Silkscreen丝印字符48.HAL=HASL=Hotair(Solder)leveling48.HAL=HASL=Hotair(Solder)leveling热风整平喷锡49.Routing49.Routing锣板,铣板50.Punching冲板,啤板50.Punching冲板,啤板51.FOC=finalqualitychecking终检,最后检查52.FOA=finalqualityaudit最后稽查(抽查)52.FOA=finalqualityaudit最后稽查(抽查)53.Shippment53.Shippment出货54.Flux54.Flux松香55.Au55.Au,Cu,Ni,Pb,Tn,Tin-lead56.Leadfree无铅57.COC=complianceofcertificate57.COC=complianceofcertificate材料证明书58.Microsection=crosssection58.Microsection=crosssection微切片,横切片59.Chamicalgold59.Chamicalgold沉镍金60.Mould=punchdie模具,啤模60.Mould=punchdie模具,啤模61.MI=manufactureinstruction制作批示62.QA=qualityassurance62.QA=qualityassurance品质保证63.CAD=computeraideddesign63.CAD=computeraideddesign计算机辅助设计64.Drillbitsize钻咀直径<diameter>64.Drillbitsize钻咀直径<diameter>65.Bowandtwist65.Bowandtwist板弯和板曲67.Bonding邦定,点焊68.Testcoupon67.Bonding邦定,点焊68.Testcoupon测试模块(科邦)66.Hit击打,孔数69.Thievingcopper抢电流铜皮69.Thievingcopper抢电流铜皮70.Rail-web70.Rail-web71.Break-uptab工艺边71.Break-uptab工艺边72.Breakawaytab工艺边73.GND=ground地线,大铜皮72.Breakawaytab工艺边73.GND=ground地线,大铜皮74.Holeedge74.Holeedge孔边,孔内75.Stamphole75.Stamphole邮票孔76.Template76.Template天坯,型板,钻孔样板(首板)77.Dryfilm干菲林,干膜77.Dryfilm干菲林,干膜78.LPI=liquidphotoimage液态感光=湿绿油79.Multilayer79.Multilayer多层板80.SMD=surfacemouteddevice80.SMD=surfacemouteddevice贴片,表面贴装器件81.SMT=surfacemoutedtechnology81.SMT=surfacemoutedtechnology表面贴装技术82.Peelablemask=bluegel蓝胶83.Toolinghole82.Peelablemask=bluegel蓝胶83.Toolinghole工艺孔,管位,定位孔,工具孔84.Fiducialmask84.Fiducialmask测光点,光学对位点,对光点,电眼85.Copperfoil铜箔85.Copperfoil铜箔86.Dimension86.Dimension尺寸87.Nagative负的,positive正的87.Nagative负的,positive正的88.Flashgold88.Flashgold闪镀金,镀薄金89.Engineeringdepartment工程部89.Engineeringdepartment工程部90.Deliverydate90.Deliverydate交货期91.Bevelling91.Bevelling斜边92.Spacing=gap间隙,气隙,线隙PCB的各层定义及描述PCBPCBPCB的各层定义及描述：1、TOPLAYER（顶层布线层）：设计为顶层铜箔走线。如为单面板则没有该层。2、BOMTTOM底层布线层3、TOP/BOTTOMSOLDER（顶层/底层阻焊绿油层）：顶层/及本层非电气走线处阻焊绿油开窗。l 焊盘在设计中默认会开窗（OVERRIDE：0.1016mm），0.1016mm建议不做设计变动，以保证可焊性；l 过孔在设计中默认会开窗（OVERRIDE：0.1016mm），0.1016mm阻焊开窗）中的PENTING过孔开窗。l 另外本层也可单独进行非电气走线，则阻用于做标识和特殊字符丝印，可省掉制作字符丝印层。4、TOP/BOTTOMPASTE（顶层/底层锡膏层）：该层一般用于贴片元件的SMT关系，导出GERBER，PCB5、TOP/BOTTOMOVERLAY（顶层/底层丝印层）：设计为各种丝印标识，如元件位号、字符、商标等。6、 MECHANICAL机械层）：设计为PCB机械外形默认LAYER1为外形层其它LAYER2/3/4等可作为机械尺寸标注或者特殊用途，如某些板子需要制作导电碳油时可以使用LAYER2/3/4等，但是必须在同层标识清楚该层的用途。7、KEEPOUTLAYER（禁止布线层）：设计为禁止布线层，PCBPCBKEEPOUT和MECHANICALLAYER1，则主要看这两层的外形完整度，一般以M