X射线萤光光谱仪XRF检验规范标准

機密等級:機密USIControlledDocumentConfidentialLevel:ConfidentialDocumentTitle(文献名稱):X-Rayfluorescencetestspecification(X射線螢光光譜儀(XRF)檢驗規範)DocumentNumber(文献編號):AT-0801-M427Revision(文献版本):A6ReviseDate:6/26Preparedby(撰寫者):EdwinHuang黃基泉CreatebywhichUnit(制定單位):CQM/GRM/GDAG-0801-M006-F2Rev.:A1 AmendmentRecordsItem:Date:Revision:Page:ChangeDescription:Changedby:10A26,71.DeletetheCrfromtheitemofXRFtest.2.Addremark.EricChang204/10/A371.Addremark3EricChang304/10/A36包裝材料旳測試值修改為:鉛+汞+鎘+铬需小於100ppm,其中需鎘小於5ppmEricChang405/05/A1AllCodingchangefromTT-0801-Q095toTT-0801-M401EricChang50A16,7修改附件一XRF測試零件及產品類別之有害物質限值表規格之Pb,Cr,Hg:700ppm，增长Cd:60ppm之管制刪除Remark對Cr暫不設定管制上限之規定EricChang607/05/A1All1.DocumentcodingchangefromTT-0801-M401-A1toAT-0801-M427-A1.2.Addthepurposeandscope.KenKe柯炤榕711/30/A22,4,111.OmitthatthisprogramispracticableinTaiwanandChinasites.2.ModifyMethod3:testpointofPCB.3.RemovePackageitemonattachment1:theCdmustunder5ppm.EdwinHuang804/29/A310,121.AddhalogenfreeandSpottestitems.2.DeleteBrcontrollingitem.EdwinHuang908/A41,10,12~141.Addattentionitemsforthetoolmanagementprocessofmechanicalpreparation.2.Addtheflowchartandformforthemanagementprocesstoattachment.EdwinHuang1009/04/A510~12UpdatedAttachment1:EHSthresholdvalueofcomponenttypeforXRFtestEdwinHuang1106A610111214AddtestmethodifcustomerrequestDelete”IQCwon’tcontrolthethresholdvalueofCl..Add“Ifthematerialcomposedofmetal,glassandceramic.Thecomponentwon’tbecarriedouthalogenfree..UpdatedAT-0801-M427-F1toA2version.EdwinHuangAG-0801-M006-F3Rev.:A1目錄

Content目旳

Purpose適用範圍

Scope樣品檢測條件及措施Testcondition&methodforsample零件及產品測試原則TestingRule測試措施TestMethod注意事項Attentionitem附件Attachment1.XRF測試零件及產品類別之有害物質限值表限值表EHSthresholdvalueofcomponenttypeforXRFtest2.拆解治工具管理流程Themanagementprocessfordisassemblytoolsofthecomponent.XRF治工具季驗證紀錄表(AT-0801-M427-F1) TherecordofdisassemblytoolsinquarterinspectionbyXRF(AT-0801-M427-F1).

目旳：

Purpose

本規範在建立進料之XRF檢驗標準，以確保品質合乎既定之標準。

ThepurposeofthisprogramistoestablishthespecificationoftheXRFinspectionforincomingmaterialstoassurethequalityofmaterialsandcomplywithspecifiedcriteria.適用範圍：

Scope適用於各大類零件之檢驗。Applytoalltypesofmaterials.樣品檢測條件及措施：Testcondition&method1.分析措施分為檢量線法及FP法，說明如下：TestmethodscanbeseparatedtothemethodofcalibrationcurveandFPmethod.檢量線法：對應於XRF之分析條件為”Cd,Pb,Hg,Br,Cr.bcc”，適用之材質為塑料、紙張、木材及Mg,Al,Si較輕元素)為主材質之樣品。Methodofcalibrationcurve:Themethodisusedforplastic,paper,woodandsomematerialsmainlycomposingofMg,Al,andSi.Theanalysisconditionis”Cd,Pb,Hg,Br,Cr.bcc”.FP法：對應於XRF之分析條件為”metal2.bfb”，適用之材質為金屬(較重元素)為主材質之樣品。FPmethod:Themethodisusedforsomematerialsmainlycomposingofheavymetal.Theanalysisconditionis”metal2.bfb”.四、零件及產品測試原則：TestingRule1.金屬及塑料共存者:平鋪於測試台並裁切至適當尺寸測試之。Thesamplecomposedofmetallicandplasticmaterials:Cutthesampletobesuitablesizeinthetestplatform.2.形狀凹凸不平者：測試點過高(超過0.5cm)時須拆解樣品，再取平整面測試(約1cm×1cm)。Thesurfacenotbumpy:Separatethesamplewhilethetestpointishigherthantestplatform(0.5cm).3.條狀金屬線者:依其縱方向排列於測試台測試之。Themetallicsampleshapedintobartype:Arrangeitverticallyintestplatform.4.鮮豔紅、黃、橙色者:應優先量測(如油墨、塑膠類、PVC等)。Thesamplepaintedbybrightlyred,yellowandorangecolor:Measurethepointfirst(suchasink,plasticandPVC).五、測試措施：TestMethod:Method1：1.DIP類測試措施：以檢量線法測試。DIP:testbythemethodofcalibrationcurve.1.1.本體大於1cm時：以本體為主並涉及部分接腳進行測試(請參閱圖1)。Samplesize>1cm:Focusonbodyandincludespartialterminal(Refertofigure1).1.2.本體小於1cm時：涉及本體及接腳測試(請參閱圖2)。Samplesize<1cm:Includingthewholebodyandterminal(Refertofigure2).圖1DIP類(本體>1cm)量測流程Figure1ThetestprocedureforDIPtype(samplesize>1cm)本體含接腳之影像視窗圖圖1DIP類(本體>1cm)量測流程Figure1ThetestprocedureforDIPtype(samplesize>1cm)本體含接腳之影像視窗圖Thetestimageincludingbodyandpartialterminal.縱方向平鋪於測試台PutthesampleintestplatformverticallyDIP類DIPtype縱方向平鋪於測試台Putthesampleintestplatformvertically本體涉及接腳之影像視窗圖縱方向平鋪於測試台Putthesampleintestplatformvertically本體涉及接腳之影像視窗圖Thetestimageincludingbodyandpartialterminal.DIP類DIPtype圖2圖2DIP類(本體<1cm)量測流程Figure1ThetestprocedureforDIPtype(samplesize>1cm)Method2：以檢量線法測試。Testbythemethodofcalibrationcurve.2.SMD類：分為長(L)，寬(W)，高(H)<2mm類及其她尺寸類。SMD:Dividesampleintotwotypes,oneisLength(L),width(W),orheight(H)<2mm,andanotherisotherdimension。2.1.長(L)，寬(W)，高(H)<2mm：裝滿1/2樣品杯測試(請參閱圖3)。Length(L),width(W),orheight(H)<2mm:Fillupthe1/2testcupwithsamples.(Refertofigure3)2.1.其她尺寸類：以pad或接腳為優先量測面(請參閱圖4)。Otherdimension:Focusonpadorterminal.(Refertofigure3)L，WL，W，H<2mm類L，W，H<2mmtype填裝1/2填裝1/2樣品杯Fillup1/2cupwithsamples空樣品杯Φ=2.7cmTestCup圖3圖3SMD類填裝於1/2樣品杯之流程Figure3Procedureforfillup1/2cupwithSMDtype其她尺寸類其她尺寸類OtherDimension含含pad之影像視窗圖Testimageincludingpad圖4測試含圖4測試含pad面之SMD類Figure4ProcedureforSMDtypeincludingpadMethod3：以檢量線法測試。Testbythemethodofcalibrationcurve.3.PCB類：測試點以涵蓋pad、文字、印刷線路為優先選擇,否則應依序分開測試(請參閱圖5)。PCB:Testthepad、word、printedlinebythemethodofcalibrationcurve.(Refertofigure5)PCB板PCB偵測點之影像視窗圖TestimagePCB板PCB偵測點之影像視窗圖TestimageTestpoint圖5含圖5含pad、文字、印刷線路點之PCB板測試部位Figure5Testpointincludingpad、word、printedlineforPCBMethod4：4.電感，變壓器類：InductorandTransformer:4.1.DIP類：分為漆包線外露(純金屬材質)所組成及外覆塑料之零件之兩種。DIP:Divideintotwotypes,oneisEnamel-insulatedwirethatisobvioustodisplay;andanotheriscoveredwithplastic.4.1.1.漆包線外露之零件：FP法測試(請參閱圖6)。Enamel-insulatedwireisobvioustodisplay:testbyFPmethod(Refertofigure6)4.1.2.外覆塑料之零件：本體以檢量線法測試，接腳以FP法測試(請參閱圖7)。Theinductorwiththeplasticjacket:Testthebodybythemethodofcalibrationcurve,andtheterminalbyFPtestmethodseparately(Refertofigure7)接腳之影像視窗圖Terminalimage本體之影像視窗圖Bodyimage拆解為本體及接腳Toseparatethesampleintobodyandterminal外覆塑料之電感Theinductorwiththeplasticjacket圖7外覆塑料之電感之測試流程接腳之影像視窗圖Terminalimage本體之影像視窗圖Bodyimage拆解為本體及接腳Toseparatethesampleintobodyandterminal外覆塑料之電感Theinductorwiththeplasticjacket圖7外覆塑料之電感之測試流程Figure7Procedureforinductorwiththeplasticjacket偵測點之影像視窗圖Testimage平鋪於測試台偵測點之影像視窗圖Testimage平鋪於測試台Puttheinductorontestplatform電感Inductor圖6圖6漆包線外露之電感測試流程Figure6Procedureforenamel-insulatedwirebeingobvioustodisplay4.2.SMD類：SMDtype:4.2.1.長(L)，寬(W)，高(H)<5mm：裝滿1/2樣品杯測試，並使用檢量線法。Length(L),width(W),orheight(H)<5mm:Fillupthe1/2testcupwithsamples,andthentestbythemethodofcalibrationcurve.4.2.2.長(L)，寬(W)，高(H)任一邊>5mm，則量測方式分為：Anysideonlength(L),width(W),orheight(H)>5mm:Thetestmethodsasthefollowings,.漆包線外露之零件：FP法測試(請參閱圖8)。Thecomponentofenamel-insulatedwireisobvioustodisplay:testbyFPmethod(Refertofigure8)。.包覆漆包線之零件：含pad面為優先量測面(請參閱圖9)。若pad面之主材質為塑料時，應以檢量線法測試。Thecomponentofenamel-insulatedwirebeingcovered:Testthepadsidefirst(Refertofigure9).Ifthematerialsonpadsideiscomposedofplastic,choosethemethodofcalibrationcurvefortest.測試底部Testthebottom測試底部Testthebottom測試側邊Testtheside測試側邊Testtheside漆包線外露之漆包線外露之SMD元件(頂面含鮮豔之油墨)SMDcomponentwithenamel-insulatedwirebeingobvioustodisplay(Containcolorfulink)測試頂部Testthetopside測試頂部Testthetopside圖8圖8漆包線外露之零件測試流程Figure8ProcedurefortheSMDcomponentofenamel-insulatedwirebeingobvioustodisplay測試pad測試pad面Testthepadside包覆漆包線之SMD元件Componentwithenamel-insulatedwirebeingcovered圖9圖9包覆漆包線之零件測試流程Figure9Procedureforthecomponentofenamel-insulatedwirebeingcoveredMethod5：5.金屬、塑膠材料類：樣品必須平貼測試，必要時將個別拆開(約1cm×1cm)(請參閱圖10)。MetallicandPlasticmaterials:Thetestsideofsampleshallbeflatonthetestplatform,anditcouldbetestedspecificallyifnecessary.(about1cmx1cm)(Refertofigure9)5.1.塑膠件：以檢量線法測試。Plasticmaterials:testbythemethodofcalibrationcurve.5.2.複合材料：金屬類以FP法測試，塑料類以檢量線法測試。Complexmaterials:MetallicmaterialsaretestedbyFPmethodandplasticmaterialsbythemethodofcalibrationcurve.測試塑料TestplasticTestplastic測試塑料Testplastic測試金屬Testmetal拆解成金屬及塑料Separate測試金屬Testmetal拆解成金屬及塑料Separatethesample無法平鋪於測試平台Ifthesamplecouldn’tbeflatonthetestplatform含塑料及金屬之機構件Testsampleincludingmetalandplastic圖10機構件圖10機構件之測試流程Figure10Procedureformechanicalcomponent5.3.金屬件：分鋁(鎂)合金及其她非鋁(鎂)合金系列材質(如銅，鐵，鋅等)。Metallicmaterials:separatetotwoportions,oneisforAlorMgalloy,anotherisfornon-AlorMgalloy(e.g.Cu,Fe,andZn).5.3.1鋁(鎂)合金(如heatsink，housing)：檢量線法測試(請參閱圖11)。Aluminum(Al)ormagnesium(Mg)alloy(e.g.heatsinkandhousing):testbythemethodofcalibrationcurve(Refertofigure11)5.3.2其她非鋁(鎂)合金系列材質：FP法測試。Non-aluminum(Al)ormagnesium(Mg)alloymaterials:testbyFPmethod.平鋪於測試台Putthesampleontestplatform平鋪於測試台PutthesampleontestplatformHousing(Al)圖11圖11金屬件之測試流程Figure11ProcedureforMetalcomponentMethod6：6.包裝材：檢量線法測試(必要時再裁切)。Packagingmaterials:Testbythemethodofcalibrationcurve(Tocutthesampleasthesuitablesizeifnecessary)6.1.蓬鬆之包裝材：重疊高度至少3cm(請參閱圖12)。Fluffypackagematerials:Thethicknessshallbetakenaheightof3cmatleast(Refertofigure12).6.2.Label、說明書、tray盤類：重疊高度至少0.5cm。Label,UsermanualandTray:Thethicknessshallbetakenaheightof0.5cmatleast.瓦楞紙板Corrugat瓦楞紙板Corrugated氣泡袋Bubblebag發泡棉Sponge圖12圖12包裝材之測試流程Figure12.ProcedureforpackagingMethod7：檢量線法測試(針對外觀測試即可)Testbythemethodofcalibrationcurve(Onlytestthesurfaceofsample)7.周邊材料類：以鮮豔紅、黃、橙顏色之部位優先測試,另一方面為外殼,導線等。Peripherymaterials:Prefertotestthelocationpaintedbybrightlyred,yellowandorange,andthentestoutercoveringinturn.Method8：檢量線法測試Testbythemethodofcalibrationcurve8.PCBA板：插件之焊點處優先量測,另一方面為SMD之焊點(請參閱圖12)。PCBA:PrefertotestthesolderjointofDIPcomponents,andthesecondisthesameareaofSMD(Refertofigure12).8.1.Samplesize小於L:12cmW:15cm時，則任選2點焊點。Samplesize<L(12cm)andW(15cm):Choosetwosolderjointrandomly.8.2.Samplesize超過L:12cmW:15cm時，則任選4點焊點測試。Samplesize>L(12cm)andW(15cm):Choosefoursolderjointrandomly.SMD焊點放大圖SMDviewSMD焊點放大圖SMDview插件之焊點放大圖DIPview插件之焊點放大圖DIPview選擇SMD及插件選擇SMD及插件之焊點測試TochoosethesolderareaofDIPorSMD測點距測試台過高ThegapistoobigbetweensampleandXRFPCBA板PCBA圖13圖13PCBA板之測試流程Figure13ProcedureforPCBAMethod9：9.若為上述未涵蓋之零件類別，請取其平整面進行測試，並以鮮豔顏色如紅、黃、橙色之油墨，以及pad為優先量測點。Iftherearetheothermaterialtypethatdidn’tbecoveredabove,theyarepreferredtotesttheflatsideofthepadandthelocationpaintedbybrightlyred,yellowororange.9.1.塑料材質以檢量線法進行測試。Plasticmaterialshavetotestbythemethodofcalibrationcurve.9.2.金屬部分以FP法進行測試。MetallicmaterialshavetotestbyFPmethod.六、注意事項：Attentionitem:1.零件及產品經XRF試驗後之測定值應依XRF測試零件及產品類別之有害物質限值表（參照附件1）進行確認程序。AfterthetestingbyXRF,theresultshouldbeverifiedbyattachment1.2.當總鉻含量超過附件一旳限值時，且零件具有金屬外層時，得根据AT-0801-M428《金屬樣品塗覆鉻酸鹽之六價鉻存在之斑塊測試措施》之化學檢測措施確認。IftheXRFtestresultoverthresholdvalueinCrwithmetalliccoating,thenfollowupAT-0801-M428《SpotTestforthePresenceofHexavalentChromium(CrVI)inChromateCoatingonMetallicSamples》tomakesurewhethercontain(CrVI).3.拆解治工具管理注意要項(管理流程如附件二)：Themanagementprocessfordisassemblytoolsofthecomponent.(Seeattachment2)3.1拆解治工具須經XRF驗證符合規範後始得使用，否則須另購新治工具並經檢測合格為止。 ThedisassemblytoolsshouldpassthroughXRFinspectionandqualification.Orelse,IQCshouldpurchasethenewtoolsthenqualifythembyXRFinspection.3.2符合规定之治工具需張貼「XRF專用」標示始得使用，並收納於「XRF治工具專用櫃」中，以避免與其她工具混用，且嚴禁使用未標示之治工具。 ThetoolthathadpassedthroughXRFqualified.Itshouldbelabeledandseparated.3.3治工具於使用前或於拆解樣品A與樣品B之間，治工具需先要以酒精及棉布進行擦拭，並於檢驗完畢後須將工作台清潔乾淨，以避免測試樣品受污染。 Itisnecessarythatcleaningbyalcoholforthedisassemblytoolsbeforetouseorbetweenthedifferentsamples,andthatcleaningtheworktableafterinspection.3.4治工具定期驗證：每季以XRF驗證治工具後之數據記錄於AT-0801-M427-F1，以供備查 QuarterinspectionbyXRFfortoolsandrecordingtheresultintoAT-0801-M427-F13.5拆解樣品超標時：若樣品超標時，須以XRF檢驗拆解工具，以排除工具导致之污染 Ifthesample’sXRFtestresultisfail.ThedisassemblytoolsshouldbeinspectedbyXRFtoclarifythefactorofcontamination.4.上述測試措施為重要拆解原則，若客戶另有规定則根据其規範實施測試。 Abovetestmethodsaregeneralrulesfordisassembly.Ifcustomershavefurtherrequestforthetestmethod,thenwewillfollowtheirrequirements.七、附件Attachment附件一：XRF測試零件及產品類別之有害物質限值表Attachment1:EHSthresholdvalueofcomponenttypeforXRFtest電子零件類ComponentType測試限值ThresholdValue測試零件

MainCategory零件類別

DetailXRF測試措施

TestMethod鉛(Pb)鎘(Cd)汞(Hg)鉻(Cr)*溴(Br)*氯(Cl)*溴(Br)

+氯(Cl)主動零件類

Active二極體(Diode)1.DIP:Method1

2.SMD:Method2700607007006306301050電晶体(Transistor)700607007006306301050閘流体(Thyratron)700607007006306301050積体電路(Integratedcircuit)700607007006306301050FET700607007006306301050被動零件類

Passive電容器(Capacitor)1.DIP:Method1

2.SMD:Method2700607007006306301050電阻器(Resistor)700607007006306301050電感器(Inductance)Method4700607007006306301050變壓器(Transformer)700607007006306301050記憶體零件類

MemoryCPU,CHIPSETS,EPROM,DRAM,SRAM,PAL,RAMDAC,ASICCHIP.Method2700607007006306301050電機材料類

Electrical有披覆之導線;裸導線;CABLE.coverofcable;nudeofcable;cableMethod5700607007006306301050Bondingwire,CONNECTOR,SOCKET,SWITCH,PINHEADER,RELAY,SHORTPLUG,WIRE(SILVER),COPPERWIRE,FUSE,FACK,BATTERY.700607007006306301050水晶振盪子、振盪器

Crystal,Oscillator700607007006306301050陶磁基片類(Ceramic)700607007006306301050MIRROR類700607007006306301050化學材料類ChemicalEPOXYRESIN,COATINGPOSDER,RTV,SOLVENT等。ICP,IC測試TestbyICP/IC限值參閱綠色環保產品規格(AT-0801-R300)

ThresholdvaluerefertoAT-0801-R300五金材料類Metallic五金類材料，涉及所有沖壓、壓鑄及其電鍍、皮膜、表面塗裝及組立等之五金件。Alloftheincomingmetalpart,includeallstamping,die-castingandelectroplate,wiperandassemblyetc.Method5700607007006306301050塑膠材料類

Plastic所有一般進料之塑膠類材料，涉及所有塑膠、橡膠及其組合件等。Alloftheincomingplasticpart,includeplastic,rubberandothersassemblyparts.Method5700607007006306301050包裝材料類Package包裝類材料，涉及所有彩盒、紙箱、棧板、保麗龍、EPE、塑膠袋、文献手冊及各種防靜電材料等。Alloftheincomingpackagingincludescolorbox,carton,pallet,EPSfoam,EPEform,plasticbag,documentmanualandESDmaterial.Method6鉛+汞+鎘+鉻之總量小於100ppmPb+Hg+Cd+Cr<100ppmCd<5ppm6306301050印刷電路板類PCB單面板、雙面板及多層板印刷電路板。Singlesided、doublesidedandmultilayerboardMethod3700607007006306301050週邊材料類Periphery各種電源供應器、記憶體模組、輸出入設備、各式介面卡、PC卡等。Powersupply、memorym