教程分析案例

1、FN-LINKTECHNOLOGY5thFloor,ABuilding,HaoyeLogisticsPark, Shugang Channel, Baoan District, Shenzhen City, CHINATEL:86-0755-FAX: 86-0755- HYPERLINK / FN-LINKTECHNOLOGY5thFloor,ABuilding,HaoyeLogisticsPark, Shugang Channel, Baoan District, Shenzhen City, CHINATEL:86-0755-FAX: 86-0755- HYPERLINK / Produc

2、tIEEE802.11b/g/n2.4GHz1T1RWiFiwithBluetoothv2.1+EDR/BluetoothFeedbackofcustomersWeacceptthespecificationafterCustomerApprovedApproved:SunnyCheck:JIMDraft:SJProjectRealtekRTL8723BUUSBWi-Fi+BTComboModelCustomersPartFN-LINK TECHNOLOGY 0REVESION0.1MODELNO1FN-LINK TECHNOLOGY 0REVESION0.1MODELNO1PRODUCT2G

3、ENERALWIFIRFPOWER3 OUTLINERECOMMENDEDPIN4RECOMMENDEDREFLOW5 HYPERLINK / FN-LINK TECHNOLOGY 0. Revision 0.1.ModelNo F23BUUM13-WControlNO:0,1,Antenna:WExternal,BPrintVoltage:33.3Vdc,5ProductNO:1,2,ProductType:MModule,DFN-LINK TECHNOLOGY 0. Revision 0.1.ModelNo F23BUUM13-WControlNO:0,1,Antenna:WExterna

4、l,BPrintVoltage:33.3Vdc,5ProductNO:1,2,ProductType:MModule,DInterface:SSDIO,UUSB,EPCI-ICVersion:ICPartNO: HYPERLINK / REVFirstXJSymenPackingSJSymenModifiedthefunctionofPIN13and SJSymenFN-LINK TECHNOLOGY 1.1.1OverF23BUUM13-W2 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Gr

5、id Array) footprint, FN-LINK TECHNOLOGY 1.1.1OverF23BUUM13-W2 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is 13.2mm*12.0mm with module thickness of 2mm. It can be easily manufactured onSMTprocess and highly suitable for tablet PC, ultra

6、book, mobile device and consumer products. It provides USBinterfaceforWiFitoconnectwithhostprocessorandhighspeedUSBinterfaceforBT.ItalsohasaPCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by usin

7、g 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.F23BUUM13-W2 uses Realtek RTL8723BU, a highly integrated WiFi/BT single chip based on COMS process. RTL8723BU integrates whole WiFi/BT function blocks into a chip, such as USB, MAC, BB, AFE, RFE, PA, EEPROM and L

8、DO/SWR, except fewer passive components remained onPCB. The general block diagram for the module is shown in Figure 1Figure 1.2 Product OperateatISMfrequencybandsUSBforWiFiandIEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11iFully

9、QualifiedforBluetooth2.1+EDRspecificationincludingboth2Mbpsand3Mbpsmodulationmode Fully qualified for Bluetooth 3.0FullyqualifiedforBluetooth4.0DualFullspeed Bluetooth operation with Piconet and Scatternet support EnterpriselevelsecuritywhichcanapplyWPA/WPA2certificationforWiFi.WiFi1transmitterand1r

10、eceiverallowdataratessupportingupto150Mbpsdownstreamand150Mbps upstream PHY rates HYPERLINK / FN-TECHNOLOGY GENERAL WiFiRF HYPERLINK / MainRealtekOperating FN-TECHNOLOGY GENERAL WiFiRF HYPERLINK / MainRealtekOperating IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d,802.11e, IEEE 802.11h, IEEE

11、 802.11iV2.1+EDR/BTv3.0/BTv3.0+HS/BT802.11b:CCK(11,5.5Mbps),QPSK(2Mbps),802.11g/n:/4DQPSK,PHY Data 802.11b:11,5.5,2,1 802.11n:upto1MbpsforBasic2,3 Mbps for Enhanced Data Rate 6,9,12,18,24,36,48,54MbpsforHighSpeedTransmit Output Power (Tolerance: 2.0dBm)802.11b11Mbps 16dBm 802.11g6Mbps 15dBm 802.11g5

12、4Mbps 14dBm13dBm(MCS13dBm(MCS13dBm(MCS13dBm(MCSMaxReceiver -671dBm(MCS-641dBm(MCSOperating WiFi11:(Ch.1-11)United13:(Ch.1-13)14:(Ch.1-14)BT 2.4GHz: Ch. 0 MediaAccessCSMA/CAwithAFH,TimeNetwork WiFi:Ad-hoc mode (Peer-to-Peer ) Infrastructure modeSoftwareAP WiFi DirectPicoNetScatterWiFi:WPA,WPA-PSK,WPA

13、2,WPA2-PSK,WEP64bit & 128bit, IEEE 802.11x, IEEE 802.11iFN-TECHNOLOGY 2.2Power3.Mechanical FN-TECHNOLOGY 2.2Power3.Mechanical 3.2Recommended HYPERLINK / Power Consumption (TypicalbyusingSWR)WiFiTX Mode: (Continuous mode) 200mARX Mode: (Conituous mode) 170mAAssociated Idle power saving with DTIM=3Una

14、ssociated Idle:RFdisableBT: Inquiry & Page Scan:0.9 mA ACL no SCOSimpleOSAndroidWiFi: BT: Operating 3.3Vdc 9%I/OsupplyFN-TECHNOLOGY 3.3PinPIN HYPERLINK / Pin1Mainpowervoltagesource2USB 3USB 456RF/BT7Floating8FN-TECHNOLOGY 3.3PinPIN HYPERLINK / Pin1Mainpowervoltagesource2USB 3USB 456RF/BT7Floating8Fl

15、oating9PCMControlPCMControlSYNCPCMChipwakeuphost(Whennotusedwakeup,itisdefaultHostwakeupchippin(WhennotusedPCM,itisdefault FN-TECHNOLOGY 4. Environmental 4.1OperatingOperating0CtoFN-TECHNOLOGY 4. Environmental 4.1OperatingOperating0Cto+55Relative10-90%(non-Storage-40Cto+80C(non-RelativeMTBF:Over5-90

16、%(non-4.2 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : 250CNumberofTimes2 4.3 Patch WIFI modules installed before the WIFImoduleinstalledPleasepress1:1andthenexpandoutwardproportionto0.7mm,0.12mmthicknessWhenopenaTakeandusetheWIFImodule,pleaseinsuretheelectrostaticpr

17、otectiveReflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 for the MID motherboard.Aboutthemodulepackaging,storageanduseofmattersneedingattentionareasThe module of the reel and storage life of vacuum packing: 1). She

18、lf life: 8 months, storage environment conditions: temperature in: 40 , relative humidity: 90% r.h.Themodulevacuumpackingonceopened,timelimitoftheCard: 1) check the humidity display value should be less than 30% (in blue), such as: 30% 40% (pink), or greater than 40% (red) the module have been moisture absorption. 3).Onc